LoRa-STM32WLE5 Module with Open Area Transmission Distance Exceeds 5000 Meters, Sleep Current Less Than 2µA

时间： 2024-11-13 来源：G-NiceRF Official Website

技术问答

The LoRa-STM32WLE5 Module is based on ST's STM32WLE5 chip and uses LoRa® modulation, making it suitable for ultra-long-range and ultra-low-power wireless solutions. It features a high-performance Arm® Cortex®-M4 core with a frequency of up to 48 MHz, supporting 256 KB of flash memory and 64 KB of RAM, along with enhanced security features. This module is widely used in security systems, smart agriculture, industrial manufacturing, and smart homes.

LoRa-STM32WLE5 Module Key Features
UHF frequency band: 433/470MHz, 868/915MHz,

Customized frequency range：150~ 960 MHz
Open area transmission distance exceeds 5000 meters
Receiving sensitivity up to -141dBm @ BW=125KHz, SF=12
Rich interface types: UART, SPI, I2C, GPIO, ADC
Sleep current less than 2µA, receive current less than 10mA

LoRa-STM32WLE5 Core Features
32-bit ARM Cortex-M4 CPU
Adaptive Real-Time Accelerator (ART Accelerator) allows execution from flash with zero wait state, frequency up to 48MHz, supports MPU and DSP instructions

Security and Protection
Hardware encryption: AES 256-bit hardware encryption (customizable)
Sector protection to prevent read/write operations (PCROP, RDP, WRP)

CRC computation unit
Unique device identifier (64-bit UID compliant with IEEE 802-2001 standard)

96-bit unique chip identifier
Hardware public key accelerator (PKA)

Introduction to SoC Module Concepts
SoC (System on Chip) modules integrate multiple functions, including processors, memory, input/output interfaces, communication modules, and graphics processors, onto a single chip. By achieving complete system functionality within a single chip, SoCs reduce size and power consumption while enhancing performance and efficiency.

Features of SoC Module
Component Integration: SoC design integrates key components such as the central processing unit (CPU), memory (RAM and ROM), input/output interfaces (e.g., GPIO, UART, USB), graphics processing unit (GPU), and accelerators onto one chip. This high level of integration reduces physical distances between modules and signal transmission time, improving system performance and response speed, while also lowering costs.

Compact Design: By integrating multiple functional modules onto a single chip, SoCs significantly reduce the physical space required for devices, making them especially suitable for applications with strict size requirements, such as smartphones, wearables, and IoT terminals.

Power Efficiency: SoCs achieve exceptional power efficiency by optimizing internal connections and reducing data movement, resulting in lower energy consumption compared to traditional multi-chip systems.

Optimized Performance: SoCs enhance overall performance through efficient inter-component communication and optimized internal architecture. Data flows more quickly between functional modules, reducing communication latency, making them particularly suitable for complex computational tasks like image processing and real-time data analysis.

Low Latency Response: The design of SoCs minimizes data transmission distances, reducing delays between components and improving overall system response speed.

Simplified Interconnect Complexity: Integrating components into one chip simplifies the interconnect structure, reducing the complexity of designing and managing communication paths.

Multicore Processing Capability: SoCs can integrate multiple processing cores, supporting efficient parallel processing and multitasking capabilities, which enhances performance and user experience.

Heterogeneous Computing: SoCs can integrate various processing units, such as CPUs, GPUs, DSPs, and dedicated accelerators, to optimize performance for different workloads. This flexible architecture allows for the dynamic selection of the most suitable processing unit based on specific tasks, improving overall system efficiency and response speed.

Advantages of SoC Modules
Miniaturization and Multi-function Integration: SoCs integrate various functions into a small chip, achieving a highly compact device design. This integration not only saves space but also reduces the need for connections between multiple components, simplifying the overall structure and layout of devices, making smaller and lighter devices possible.

Low Power Characteristics: By optimizing component connections, SoC achieves lower power consumption compared to traditional multi-chip systems. This design reduces energy loss and enhances device's battery life.

Single Chip Construction: With all functions integrated onto a single chip, data transmission delays and energy consumption between different chips are minimized. This design enhances system efficiency, ensuring faster response times and lower energy consumption.

Ease of Development and Integration of SoC Modules
SoC modules are typically equipped with a wealth of development tools and support libraries, allowing developers to quickly get started. The modular design enables developers to select and configure the necessary functions based on specific application scenarios, further enhancing system flexibility.

Flexible Application Scenarios for SoC Modules
Due to their high integration and miniaturization features, SoC modules are suitable for multiple fields. For instance, in smart homes, they can enable remote control and monitoring of smart devices; in industrial automation, SoC modules can facilitate efficient data collection and real-time processing, improving production efficiency and safety.

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本文由出山转载自G-NiceRF Official Website，原文标题为:Compact Design, Powerful Features: Exploring the Versatile Functions of SoC Modules，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

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选型指南 - 有人物联 - 2023/3/8 PDF 英文下载

GLOBAL IOT SOLUTIONS PROVIDER loT Modules and Antenna Catalogue

型号- SC606T,RG501Q-EU,FLM340D,YF0007KA,RG255C,YG0030AA,EG950A,YE0009AA,YB0031AA,RM521F-GL,YFCO002AA,YFGA005AA,YM0004AA,YE0021KA,EM120R-GL,UC200A-GL,YFCA010AA,KG100S,YFCA002HA,AG521R,M95,YF0017GA,YEGT000W8A,YC0018CAEVB,LC76G,FC30R,AG520R,L86,YF0017FA,YF0026AA,FC66E,YPCA006AA,YF0027CA,YFGA006AA,YM0003AB,YM0003AA,RG502Q-GT,SG520B,YC0018CA,FLM240D,L26-ADR,L96,YP00090A,FC65E,AG568N,AG55XQ,FC41D,LC98S,YC0017DAEVB,YM0015AA,YCWS002AA,LC86L,LC86G,LC86GPA,YC0002BAEVB,YEWN001AA,LC79H,YC0017DA,BG77XA-GL,AG215S,FGH100M,EM05,YP0009NA,YFGA007AA,FC64E,YF0027AA,RG502Q-EU,YM0003CA,YC0003BAEVB,YG0043AA,SC20,RM500U-CNV,YXH001AA,YMCP002AAEVB,YPCA004AA,YSAN028AA,FLM140D,AF56C,AF68E,YCG0011AA,AG57XQ,AF31G,YF0028AA,YE0031BA,AG18,YF0029CA,AG15,FC62E,EG060W-EA,YC0017EA,RM502Q-AE,LC79HAL,YP0009MA,RG502Q-EA,YSAN027AA,LC86GLA,YCGO009AA,YM0013AA,AF66T,YC0017EAEVB,YPCS002BAEVB,YCGS010AA,YCG0010AA,AF61Y,L26-T,YE0032BA,AG35,AG519M,YSIS001AA,YCGO011AA,YC0003BA,YCIS002AA,YF0006PA,BG95 SERIES,RG500U-LA,RM505Q-AE,SC66,YC0001CAEVB,YSAN026AA,RM550V-GL,AF20,EC21/EC21 MINI PCIE,SC668S,YCGO022AA,YC0001AA,YXU00A0AA,AF51Y,AG529R,FCS850R-B,YG0035AA,YBY00A0IA,EM060K,YMCP003AAEVBAA,YSAN028FA,AF50T,YCIS001AA,YC0013AA,YCGO010AA,YC0002BA,SG560D,SG885G-WF,BG95XA-GL,YPCS002AAEVB,BC95-GR,YE0010AA,YFW0001AA,YFWO001A,YG0046AA,YMCP003AAEVBBA,YSAN025AA,FC905A,FC909A,YC0001CA,YECW000N1A,YB0010AA,YECN009AA,YE0011BA,YFGA003AA,CC660D-LS,YEMA003AA,FC80A,LC76GAB,YSAN027FA,EM121R-GL,LG69TAB,LG69TAA,YEIM001AA,EC200A MINI PCIE,LG69TAJ,RG500U-EA M.2,LG69TAI,YEGM011BA,AG525R,LG69TAD,YCGS024AA,CC200A-LB,AG52XR,YMCP003AA,RM500U-CN,YFC0002AA,YEGT001BA,SC600T,YEGM011AA,LG69TAP,LG69TAR,YEMA004AA,LG69TAM,LG69TAS,YEWN004AA,LC02H,YCIS003AA,LC26G,EC25/EC25 MINI PCIE,RM500U-EA,YCGS025AA,YPCP003AAEVB,YEGT002BA,YMCP002AA,YE0001BA,YE0013CA,YE0012AA,BG77,YG0048AA,LC26G-T,RG500U-EB,RG500U-EA,LC86GAB,LC86GAA,YCGA001AA,YG0015AA,BG77XA-GL SERIES,YG0038AA,BG600L-M3,EG120K,LC29HAA,YF0011KA,YB0027AA,YC0010AA,RG525F,YBS00A1AA,YCGA013AA,YMCP001AA,LC760Z,BG96,RG500U-CN,BG95,FCM100D,YPGS001AAEVB,YCGO004AA,SC200K,LC29HBA,LG77L,RG500L,SC200L,LC29H,YF0020EA,YB0017AA,LG77LIC,SC200E,YPCP001AAEVB,YPCS002BA,EC200U/EC200U MINI PCIE,EM12-G,LC29HBS,LC29T,SC200R,RM530N-GL,SC696S,LC29HCA,LC29EA,EG12,EG18,YPCS001AA,YEGM007BA,RM520N,YC0013AAEVB,YCGA012AA,RG620T,YC0010AAEVB,RM255C-GL,YF0023IA,YWL00A0AA,YB0014AA,YPCS001AAEVB,YCG0009AA,YE0003AA,FC900E,YBY00A0KA,BC660K-GL,YF0023HA,YAT001BA,YPCS002AA,YCGS005AA,EG915N,SC206E,YE0029FA,YG0005AA,RG200U-CN MINI PCIE,EG915Q,YC0009AAEVB,RM500Q-GL,EC20-CE/EC20-CE MINI PCIE,YECT002AA,EG915U,FCS945R,RG520F,LG69T,YF0023GA,RG200U-CN,YB0015AA,YCGS006AA,YCG0008AA,BC950K-GL,EG912N,YPR00A0AA,FC06E,EG912U,RG520N,BC65,YF0026LA,YF0023FA,YF0022DA,RM510Q-GL,MC60,YECT003AA,HCM010S,YMCP001AAEVBBA,BC92,FCU741R,RG530F,YE0028AA,YF0029AA,EG91,YFOA004AA,EG95,RG650E,FLM040D,MC60E,SG865W,LUA600A,RG500Q-GT,RG650V,YB0008AA,EG512R-EA,SA800U,YCGO008AA,LC02HBA,LC26GAB,FCS940R,YE0006AA,YCN001AA,YF0011SA,L26-UDR,YC0009AA,L26-DR,L76-L,EG065K,YPCP001AA,YSOS001AA,FCM360W,YCGO007AA,EG800Q,FCS950R,YSAO001AA,RG500Q-EA,YE0007AA,AH20C,YEGM007AA,LC86LC,YCGA003AA,FC20,FC21,YG0062AA,YE0008BA,YE0019AA,YPA00A0AA,L89 R2.0,YEWM001AA,YEIN002AA,YCGO006AA,YEWT004AA,YSAO002AA,M66,M65,YPGS001AA,YCGA002AA,L26-DRAA,FCS850R,YG0063AA,YMCP001AAEVBAA,YPCP003AA,EC200A,LC76GPA,LC76GPB,EM160R-GL,BG95XA-GL SERIES,YECT007AA,YCGA014AA,RG500Q-EU,RM500Q-AE,YEMN017AA,EM120K-GL,M95-R,EG060K,YCGO005AA

选型指南 - QUECTEL - V7.7 - 2023/11/16 PDF 英文下载

LONGSUNG（龙尚）无线通信模块选型指南（英文）

目录- Broadband Module Smart Module Automotive Module LPWAN Module PCBA

型号- MU990CD,U9507C R2,U9507C R3,U9507C V2,U9507C V3,E9720,PE9330,U9507E,U9507C SGCC,MU960 X,U9507A,A9800,A8300 R2,U9507C V2C,U9507C V2CC,MU990C53,U9507C V2A,EX520,PX9001,M6700,E9720 R2,U9507C ATA,S9700,A9500C,PE9340,V9700,MU960 V2C,PE9321,E9720 R3,E9510,PE9320,PX9000,A8901,A9600 R2,U9300C,EX510,MU970C,MU990C,VX95,EX610,M5700

选型指南 - LONGSUNG - Version: LS-B-PC-202003-CH - 2020/3/27 PDF 英文下载

ROHM（罗姆）LAPIS 无线通信LSI/模块选型指南（英文）

目录- Wireless Communication LSIs/Modules Product Introduction Bluetooth® Modules Specified Low Power Wireless LSIs LPWAN (Low Power Wide Area Network) Wireless LSI Specified Low Power Wireless System LSI with Built-in MCU Wi-SUN Modules 13.56MHz Wireless Charger Chip set Wi-Fi Modules EnOcean® Modules Specifications

型号- ML7436N,ML7416N,ML7344CY,EDK 400J,STM 429J,ML7386X,MK74Q0410,BP35C1-J11-T01,BU1805AGU,MK71511A,STM 300,BP35C0-JXX,TCM 310,MK71521-NNN,BP35C5,TCM 410J,ML7416S,ML7396E,ML7396D,ML7396B,BP35C5-T01,ML7631,BP359B-T01,BP3591-T02,ML7630,BP3591-T03,USB 400J,BP3580,PTM 210J,STM 431J,ML7344XT,BP359F,MK71511A-NNN,MK71511,BP359D,BP359C,BP359B,ML7345D,ML7345C,ECO 200,BP3595-T02,BP3595-T03,BP3599,BP35C0-J11-T01,ML7345,MK715X1EK1A,BP3595,ML7386,MK71521A,BP3591,STM 431T,HSM 100,ML7406T,BP35C2-J11-T01,BP35A1,BP3622-T01,USB 500T,BP35C2,BP3621-T01,BP35C0,BP35C0-T01,MK71521,ML7386B,STM 400J,ML7344XY,MK71521A-NNN,PTM 330,ML7404,MK715X1EK1,STM 329,ML7396X,PTM 210,ML7414,USB 300,ML7345X,MK71511-NNN,STM 331,ML7406Y,PTM 430J,BP35C0-J11,BP35A7A,ML7344JY

选型指南 - ROHM - Ver.7.0 - 10.2020 PDF 英文下载

FGM230S Proprietary SiP Module Data Sheet

型号- FGM230S,FGM230S-RB4328A,FGM230SA27HGN3,FGM230SB27HGN3,EFR32FG23,FGM230S-RB4328B

数据手册 - SILICON LABS - Rev. 1.1 - April, 2023 PDF 英文下载

LoRaCC68 Series Wireless Transceiver Modules with a Sensitivity of -129dBm and an Output Power of 22dBm, Achieve Temperature Control in Thermostats

LoRa wireless thermostats are well-suited for indoor temperature regulation due to LoRa spread spectrum technology and low power consumption. Wireless thermostats use LoRa wireless transceiver modules to sense indoor temperatures, then adjust the flow of hot water in radiators to control indoor temperature based on the desired temperature. When choosing a LoRa wireless control solution, it‘s essential to consider factors such as communication range, interference resistance, data transmission rate, and select the appropriate LoRa wireless transceiver module and configuration accordingly.

应用方案发布时间 : 2024-11-09

LoRa126XF30 2W power over long distance Wireless transceiver module Product Specification

型号- LORA1268F30,LORA1262F30-868,LORA1268F30-490,LORA1262F30-915,LORA1262F30,LORAF30,LORA126XF30,LORA1268F30-433

数据手册 - G-NICERF - Rev2.1 - 2020-11 PDF 英文下载

LCS6260 WiFi Module for Controling Smart Lighting with Work Frequency Range 2.4GHz, Physical Rate up to 72.2Mbps

SKYLAB provides intelligent lighting solutions based on domestic TR6260 chip and low-power UART WiFi module. It helps designers to realize dimmable intelligent lighting solutions controlled by ultra-low-power WiFi.

应用方案发布时间 : 2022-04-01

Advantages of LoRa Wireless Transmission in IoT Applications

LoRa wireless transmission, a low-power, long-range technology, is pivotal in IoT applications. Its unique modulation technique ensures reliable data transmission over long distances and superior anti-interference capabilities. LoRa modules support multiple signals on the same channel, have a wide frequency range, and are internationally certified. They are widely used in various IoT sectors.

技术探讨发布时间 : 2024-11-09