Laird Thermal SystemsLaunches the OptoTEC™ MBX Series, a New Line of Micro Thermoelectric Coolers for High-performance Space-constrained Optoelectronic Applications
Laird Thermal Systems launches the OptoTEC™ MBX Series, a new line of micro thermoelectric coolers for high-performance space-constrained optoelectronic applications. Leveraging next-generation thermoelectric materials and advanced process automation, the MBX Series offers innovative configurations designed for integration into TO-Can, TOSA, and Butterfly packages. The latest design innovation includes a compact footprint, with the smallest model measuring just 1.5 x 1.1 mm and profiles as thin as 0.65 mm, ensuring exceptional cooling performance in given space constraint at the lowest possible power consumption.
The MBX Series boasts high heat pumping densities up to 43 W/cm2 with temperature differentials up to 82℃ at ambient of 50℃. Ensuring efficient thermal management and precise temperature stabilization, the MBX Series protects optoelectronics that operate in high-temperature environments including laser diodes, optical transceivers, LiDAR, Infrared Range (IR) Sensors, and high-powered Indium Phosphide (InP) VCSELs.
"Advancements in the optical communications industry, driven by applications such as artificial intelligence and machine learning, require superior temperature stabilization for laser diodes in high-speed optical transceivers." said Andrew Dereka, Thermoelectrics Product Director at Laird Thermal Systems. "The MBX Series is the ideal solution to ensure optical devices maintain consistent wavelength, reduced crosstalk, and extend operational lifespan. Our large investment in a high precision automation production line reflects our commitment to process control, high-volume capacity and reliability."
The MBX Series has undergone rigorous Telcordia GR-468 CORE qualification testing, ensuring exceptional reliability and long operational life even in harsh environments to meet the highest qualification and reliability standards in the optoelectronic market. Engineered to order, the MBX Series allows for unique form factors, heat pumping densities and power efficiencies. With solder construction's supporting reflow temperatures up to 280℃ and wire-bondable attachments, this series is suitable for a wide range of optoelectronic applications. Laird Thermal Systems also offers special finishing options, including Au-plated patterns, thermistor attachments and hermetic sealing to accommodate non-hermetic packaging.
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本文由玄子转载自Laird Thermal Systems Official Website，原文标题为:Laird Thermal Systems Announces New Line of Micro Thermoelectric Coolers for Next Generation Optoelectronic Packages，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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