An Introduction and Comprehensive Guide to Thermal Interface Materials
In today's rapidly evolving electronics landscape, effective thermal management has become crucial for ensuring optimal device performance and longevity. Thermal Interface Materials (TIMs) play a vital role in this process, serving as the critical link between heat-generating components and cooling solutions. Let's explore these essential materials and their impact on modern electronics.
Understanding Thermal Interface Materials
Thermal Interface Materials are specialized substances designed to enhance heat transfer between electronic components (heat sources) and heat sinks. When two surfaces meet, microscopic air gaps naturally form between them due to surface irregularities. These air pockets act as insulators, significantly reducing heat transfer efficiency. TIMs fill these gaps, creating an optimal thermal path that enables efficient heat dissipation.
Types of Thermal Interface Materials
Thermal pads, also known as thermal gap pads or thermal gap fillers, offer a reliable solution for various applications:
- Excellent conformability and compression recovery
- Thermal conductivity ranging from 1.0 to 15.0 W/m·K
- Ideal for applications requiring shock absorption
- Self-adhesive properties for easy installation
- Common applications: CPUs, GPUs, memory modules, and power electronics
- Superior thermal conductivity (15.0 to 45.0 W/m·K)
- Excellent elastic properties
- Perfect for high-power electronic applications
- Available in customizable compression rates
- No siloxane outgassing
- Ideal for silicone-sensitive applications
- Enhanced durability and wear resistance
- Commonly used in optical systems and medical equipment2.
2.Phase Change Materials (PCMs)
Phase change thermal interface materials offer unique advantages:
- Transform from solid to liquid at specific temperatures
- Exceptional surface wetting capabilities
- Ultra-thin interface thickness
- Ideal for applications with minimal gap requirements3.
3.Liquid Thermal Interface Materials
- Extremely low thermal resistance
- Excellent wetting properties
- Ideal for tight tolerance applications
- Perfect for CPU and GPU applications
- Available in one and two-component formulations
- Available in Silicone free type
- Superior gap filling capabilities
- Excellent thixotropic properties
- Suitable for automated dispensing systems
Selecting the Right Thermal Interface Material
When choosing a thermal interface material, consider these key factors:
1. Thermal Performance Requirements
- Required thermal conductivity
- Maximum allowable thermal resistance
- Operating temperature range
2. Application Specifics
- Gap size between surfaces
- Surface roughness
- Mounting pressure
- Installation method
3. Environmental Considerations
- Operating environment
- Humidity exposure
- Temperature cycling
- Chemical compatibility
4. Manufacturing Process
- Assembly method
- Production volume
- Rework requirements
- Automation compatibility
Industry Applications
Thermal interface materials are crucial in various sectors:
Automotive Electronics
- Electric vehicle power systems
- Engine control units
- LED lighting systems
- Battery thermal management
Consumer Electronics
- Smartphones and tablets
- Gaming consoles
- Laptops and desktop computers
- High-performance computing systems
Industrial Electronics
- Power supplies
- Motor drives
- Industrial computers
- Telecommunications equipment
The Sheen Technology Advantage
Sheen Technology offers a comprehensive range of thermal interface solutions engineered to meet the most demanding requirements. Their product portfolio includes:
• High-performance thermal pads with conductivity up to 45.0 W/m·K
• Advanced phase change materials for critical applications
• Specialized silicone-free solutions for sensitive components
• Custom formulations to meet specific application requirements
Choose the Right Solution for Your Application
Selecting the appropriate thermal interface material is crucial for optimal system performance. Sheen Technology's engineering team is ready to help you identify the perfect solution for your specific needs.
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爰美达散热高达300W/CM2嵌入式热管与600W高功率0.4mm不锈钢超薄VC解决严苛的热管理需求
描述- 爱美达(AAVID)隶属于宝德(BOYD)集团，1964年创立于美国新罕布什尔州，至今己有50多年的历史，是全球散热产品及散热系统管理解决方案的领导者。公司提供行业中最广泛的产品线，从最小的板级散热到几千万瓦的工业用散热产品；服务的市场非常广泛，包括服务器、汽车、电信、LED、医疗设备、消费电子、军事和航空航天、测试设备、电力等各产业。
型号- LCS7846G1,LCS 951-50126,CHILLER 900-27969
Aavid(爱美达)--BOYD热管理(导热界面材料)选型指南
目录- Aavid Company profile Thermal Interface Materials Overview Thermo-silicone interface material Thermo-silicone caps and tube Thermally conductive soft-silicone film Thermally conductive silicone-free films Thermally conductive phase-change material Graphite films EMI-shielding materials Thermally conductive ceramics Insulating films Insulating bushings POWERCLIP Heat sinks Films/ceramics/Phase-change materials Standard configurations and dimensions Thermal properties products naming rules Thermal Properties Products Technical Information
型号- KU 3-380/M3,KU-BG 30,KU-TCS100,KU-A 30,KU-TXE 50,KU-CR-MINI,KU 3-325,KU 1-159,KU-K/CU/K,KU-EGF 45,KU-CG 80,KU-TXS 100,KU-CRFI 75,KU 3-334/3,KU 6-628/0,KU-ALN,KU-ALO,KU 7-724/AXX/CP,KU-BG 20,KU-ALC 5/315-157,KU 6-631/0,KU-ALF,KU 3-310,KU 6-651/PA,KU-ALC,KU-ALC 5/241-229,KU-TCSP400,S SERIES,KU-KAPIT,KU 6-655/SR,KU-ALC 5/370-134,KU-KAHN,KU-SAS20,KU-TCAS,KU 6-650/SR,KU-TCAT,KU-BGDX 80,KU-TCS200,KU-KAPIF,KU 1-019,KU 3-300,C SERIES,KU-TXE 100,KU 3-303,KU-ALC 5/250-125,KU 1-016,KU-LEXB0.25,KU-A 45,KU 4-440/3.1,KU 4-461,KU-ALC 5/374-244,KU-SAS,KU-TCS,KU-KE11,KU-SAS10,KU-CRF,KU -7-723/16/CXX/CP,KU-TCSP500,KU-TCAB,KU 4-453,KU-TCAD,KU 4-450,KU 4-451,KU-TDFBS,KU 3-396/24,KU-ALC 5,KU-NOMA,KU 6-652/PA,KU-TDFBH,KU 4-445,KU-TDFD,KU 4-443,KU-TDFF,KU 4-441,KU 6-656/SR,KU 4-440/4.0,KU-CRF-MINI,KU 6-624/K/CU/K,KU 2-ZUB01-567,KU-ALC 5/370-339,KU-ALC 5/315-114,KU-TCSP200,KU-ALC 5/750-370,KU-PA247/2,KU-A 80,KU-CR-125,KU-TCSP,KU 4-430,KU 6-651/SR,KU 7-723/CXX/CP,KU 7-724/SXX/CP,KU-LEXA0.25,KU-C 30,KU 6-623/0,KU-ALC 5/460-230,KU-PCL12,KU-ALC 5/354-154,KU-S 30,KU 7-723/16/SXX/CP,KU-ALC 5/386-252,KU-THE 300,KU-KG,KU-ALC 5/350-281,KU-ALC 5/366-197,KU-KC15,KU-CBGA,KU 4-498/X,KU 6-653/PA,KU-TCSP300,KU-CRFI,KU-S 45,KU 6-657/SR,KU-ALC 5/125-125,KU-TXST 100,KU 6-624/0,KU-ALC 5/425-244,KU-TCS500,KU-BGD,KU-BGDX,KU 3-396/24/4,KU-KG 25,KU-THE 200,KU 6-652/SR,KU 6-665/PA,KU-C 45,KU-ALC 5/456-236,KU-TCSP50,KU-KAMT,KU-ALC 5/550-370,KU-ALC 5/197-114,KU 4-499/X,KU 3-396,KU 3-397,KU 3-398,KU-THE 100,KU 3-399,KU-BGD 80,KU 7-723/16/AXX/CP,KU-TXST 200,KU-ALC 5/225-175,KU-THE 50,KU-ALF 5,KU 3-385,KU-TXST,KU 6-654/PA,KU 3-386,KU 3-387,KU-CRF-125,KU 3-388,KU 3-389,KU 6-658/SR,KU-TXS 50,KU 3-391,KU-CG 20,KU 3-392,KU 3-393,KU 3-394,KU 3-395,KU-ALC 5/106-108,KU-C 80,KU-ALC 5/425-134,KU-ALC 5/075-080,KU 7-723/AXX/CP,KU-ALC 5/630-302,KU-BG 80,KU-PCL,KU-TCSP100,KU-CG 30,KU 3-380,KU-ALC 5/206-206,KU 3-381,KU 3-382,KU 3-383,KU 3-384,KU-S 80,KU-TXST 300,KU 7-723/SXX/CP,KU 6-619,KU-TCS300,KU-KG 75,KU-MYA,KU 3-368,KU 3-369,KU 6-623/K/CU/K,KU 1-086,KU 7-700/AXX /CP,KU-TXE 200,KU-BGD 45,KU-ALC 5/112-112,KU-TXS 300,KU-TXST50,KU-CG 45,KU-CBMC,KU-ALC 5/100-100,KU 6-655/PA,KU-LEXC0.25,KU-EGF 20,KU-CBMA,KU-BGD 30,KU 6-620,KU 3-360,KU-BGDX 08,KU 6-624,KU-LEXA,KU 6-623,KU-LEXC,KU-LEXB,KU 6-628,KU-EGF,KU-BG,KU 1-086/1,KU-THS,A SERIES,KU-TCS400,KU-KG 50,KU-ALC 5/445-354,KU-EGF 30,KU-SFH,KU-SFI,KU-ALC 5/220-064,KU-TCS50,KU-SFG,KU-THE,KU-BGD 20,KU-TXE 300,KU-SFB,KU-TXS,KU 6-650/PA,KU 6-631,KU-ALC 5/346-154,KU 1-182,KU 6-630,KU 3-333/3,KU-TXS 200,KU 6-654/SR,KU-ALC 5/449-449,KU-BGDX 30,KU-TXE,KU 3-339,KU 6-630/0,KU-ALC 5/276-106,KU-ALC 5/480-150,KU 3-333,KU 3-334,KU-BG 45,KU-CG,KU - CG 20 - 0H -KS -20 X 25 MM - L,KU-KG 38,KU 1-072,KU-ALC 5/244-102,KU 4-495,KU 3-340,KU 2-ZUB 38-1,KU-ALC 5/402-358,KU-BGDX 20,KU-CR,KU 1-070,KU 7-724/CXX/CP,KU-ALC 5/364-081,KU-KG/S
Thermal Interface Material Supplier Offers High-Quality TIM Solutions
When it comes to thermal management solutions, choosing a reliable thermal interface material (TIM) manufacturer is essential. Sheen Technology is a leading provider of high-quality TIMs, offering innovative solutions to meet the diverse needs of industries such as automotive, electronics, and telecommunications.
High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
The Parker Chomerics is introducing its next generation of thermal gap filler pads - THERM-A-GAPTM PAD 30 and 60 - for all heat transfer applications between electronic components and heat sinks.
THERMAL INTERFACE SOLUTIONS
型号- TPLI™ 200,7000,TPUTTY™ 607,TGARD™ 500,P100,TFLEX™ HD80000,P300,TGARD™ 220,210B,TPUTTY™ 403,TFLEX™ HD7.5,TGREASE™ 300X,230,SF10,2500,910,TFLEX™ CR607,TFLEX™ P100,TPUTTY™ 910,TFLEX™ 300,TFLEX™ CR900,TGARD™ 230,TFLEX™ P300,TGARD™ 210B,B200,TPCM™ 7000,SF600,200,TNC-4,TGARD™ TNC-4,600,TFLEX™ SF10,SF800,403,CR607,TFLEX™ B200,607,SLIM TIM™ 10000,TPUTTY™ 508,5000,TPUTTY™ 502,HP34,HD80000,TFLEX™ HD700,TFLEX™ CR350,TGREASE™ 2500,300X,HD7.5,TFLEX™ HD300,TPCM™ 780,TPCM™ 580,208B,TFLEX™ HR600,TGARD™ 208B,HD300,TFLEX™ 600,CR350,TFLEX™ SF800,UT20000,HD700,TPCM™ 5000,580,TGARD™ K52-3,TFLEX™ SF600,780,HR600,220,TFLEX™ HP34,TGARD™ K52-2,300,TGARD™ K52-1,K52-2,K52-1,500,502,TFLEX™ UT20000,K52-3,10000,CR900,508,TGARD™ 5000
The Next Generation of Thermal Gap Filler Pad: THERM-A-GAP PAD 80LO, with a Thermal Conductivity of 8.3 W/m-K
By addressing the shortcomings of current gap pads, PAD 80LO represents the next generation of gap pads to address modern electronics design and thermal managements. With a thermal conductivity of 8.3W/m-K, PAD 80LO is designed for high heat-output components.
THERM-A-GAP™ GEL 60HF High Performance High Flow Rate Fully Cured Dispensable GEL
型号- 65-00-GEL60HF-0300-B,65-1P-GEL60HF-2500,GEL 60HF,65-5P-GEL60HF-7500-B,65-02-GEL60HF-0180,65-00-GEL60HF-0010-B,65-02-GEL60HF-0030-B,65-00-GEL60HF-0300,THERM-A-GAP GEL 60HF,THERM-A-GAP™ GEL 60HF,65-02-GEL60HF-0030,65-1P-GEL60HF-2500-B,65-5P-GEL60HF-7500,65-02-GEL60HF-0180-B,65-00-GEL60HF-0010
Thermal Pad vs Paste: Which is Better for Your Needs?
When it comes to thermal management in electronic devices, choosing the right thermal interface material (TIM) is crucial. Two common options are thermal pads and thermal paste. Each has its unique properties and applications, and understanding their differences can help you make an informed decision.
Thermal Interface Solutions Laird（莱尔德） designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
型号- TGREASE 980,TGARD 20,TFLEX HD400,TPCM HP105,TFLEX HD90000,TPCM 780SP,TPLI 200,TGARD 400,HTD04,HTD06,TGARD 3000,TFLEX300TG,HTD03,TPUTTY 502,TGARD TNC-4,TPUTTY 508,TGREASE 300X,TGARD 230,TGON 9070,TFLEX CR200,TFLEX 600,TGARD 5000NT1,TFLEX UT20000,TPCM 580SP,TGON 9100,TGON 9025,TPCM 580S,TGREASE 880,TGREASE 1500,TFLEX HD300,TPCM 900,TFLEXHD300,TFLEX HD700,TPCM 580,TFLEX P300,TFLEX P100,TFLEX SF600,TFLEX SF800,TPCM 780,TGARD 300,TGARD 220,TGARD 100,TGARD 500,1KA06,TGON 9017,1KA08,1KA04,TGARD 5000,TPCM 200SP,TGREASE 2500,TPCM 750,TPUTTY 403,TPUTTY 607,SLIM TIM 10000,TFLEX 300,TFLEX HR400,TGON 9040,TGARD 210,TGARD K521-2,TGARD K521-3,TMATE 2900,TGARD K521-1,TFLEX HR600
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