Bornsun Provides Thermally Conductive Interface Materials for Notebook Computers, Effectively Transferring Heat to Dissipate Heat

2024-12-12 Bornsun Official Website
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Notebook computers from large volume, high weight, poor stability all the way to today's thin and lightweight, powerful, not only to promote the development of chips and various types of accessory technology, bringing the miniaturisation of chips and accessories, highly centralised, effective, and at the same time, the thermal conductivity of the thermal conductivity of the material, the reliability of the requirements of a higher level. Thin and light notebook computer body internal space is small, the use of PC accessories and layout of the special, if then equipped with a high configuration of the processor and chip, the heat dissipation difficulty will be greatly enhanced, then choose a performance of the thermal conductivity of the material is particularly important.


Thermally conductive interface materials that can be applied on notebook computers include:


Thermally conductive spacer (BN-FS250, BN-FS300, BN-FS500) can fill the gap between the heat-generating device or the entire PCB board and the metal casing or heat sink, effectively transferring heat to dissipate heat and safeguarding the efficiency of heat-generating electronic components.


Thermally conductive silicone grease can fully wet the surface of the target component, forming a very low thermal resistance interface. Therefore, under the same thermal conductivity, thermal grease (BN-GC4021L, BN-GC5506) will have better thermal conductivity. Through the combination of "fan - heat pipe - heat sink - thermally conductive grease", the CPU graphics card on the motherboard evacuates heat through the heat sink.


Thermal conductive phase change film (BN-PM1050) can be used for heat transfer between the chip or graphics card and the heat sink. The thermally conductive phase change film transforms from solid to liquid when it reaches the phase change temperature, and is used to fill the gap between the heat-generating device and the heat sink, which results in low thermal resistance to form an interface with good thermal conductivity.


Liquid metal (BN-GC1026LM) can be used for thermal conductivity at notebook chips with high heat generation. It is a solvent-free, high-fluidity thermal conductivity material with a thermal conductivity of up to 20~30W/m·K. It can obtain a very thin contact interface as well as a very low thermal resistance, and is safe and non-toxic.


授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
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概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
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本文由玄子转载自Bornsun Official Website,原文标题为:Notebook computers,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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金菱通达(GLPOLY)热对策材料选型指南

目录- Company Profile    Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel    Thermal Pad    Thermal Silicone Pad & Silicone Thermal Fiberglass/Film    EMI absorber/Absorption Gel    Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound    Silicone/Non-Silicone Thermal grease    Silicone Thermal Tape    Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad   

型号- XK-G20E,XK-P20系列,XK-R系列,XK-P PUTTY,XK-PN50,XK-Z系列,XK-P20LD,XK-P80,XK-RE SERIES,XK-RAY310,XK-A100,XK-FN系列,XK-F系列,XK-FN,XK-FN20,XK-J系列,XK-C35D,XK-C35C,XK-PN45,XK-GN SERIES,XK-Z,XK-FST,XK-F35,XK-R30,XK-Z SERIES,XK-F10ST,XK-FN10,XK-P PUTTY SERIES,XK-FN15,XK-FST系列,XK-SF SERIES,XK-P45-PUTTY,XK-GN20,XK-Z15,XK-RE系列,XK-FN50,XK-X SERIES,XK-T SERIES,XK-G40,XK-F20,XK-J20,XK-SF35,XK-XN40,XK-P60,XK-RAY,XK-J25,XK-FST SERIES,XK-C系列,XK-SN SERIES,XK-R20,XK-G系列,XK-PN系列,XK-K系列,XK-TN08,XK-GN15,XK-XN系列,XK-SN系列,XK-FN40,XK-XN50,XK-G30,XK-S15LV,XK-F10,XK-C35,XK-PN60,XK-S30LV,XK-TN,XK-J10,XK-P50,XK-F15,XK-A SERIES,XK-TN12,XK-PS SERIES,XK-R10,XK-J18,XK-X50,XK-SF系列,XK-R15,XK-P30S20,XK-A80,XK-A60,XK-P系列,XK-PLD SERIES,XK-P20 SERIES,XK-PN15,XK-T系列,XK-P50-PUTTY,XK-C20,XK-X系列,XK-G20,XK-S20LV,XK-C25,XK-PLD,XK-SN,XK-SF15,XK-GEL 100,XK-SF18,XK-SN10,XK-P45,XK-PS系列,XK-P80-P,XK-SF,XK-K4,XK-X40,XK-TN SERIES,XK-F20ST,XK-K6,XK-P20S,XK-F SERIES,XK-GN30,XK-J SERIES,XK-S12LV,XK-C15,XK-C16,XK-P PUTTY 系列,XK-K10,XK-P15LD,XK-G15,XK-P50-P,XK-P30,XK-SN20,XK-P SERIES,XK-P80-PUTTY,XK-RE,XK-PN SERIES,XK-C,XK-TN系列,XK-G,XK-F,XK-F60,XK-R SERIES,XK-S25LV,XK-PN30,XK-A,XK-P20S20,XK-R,XK-A系列,XK-T,XK-R10E9,XK-PLD系列,XK-P20,BETA GEL 100,XK-X,XK-P25,XK-K,XK-J,XK-P45-P,XK-RAY SERIES,XK-P,XK-G SERIES,XK-PN,XK-T09,XK-A30,XK-PS,XK-F50,XK-F15ST,XK-C SERIES,XK-PN20,XK-K SERIES,XK-XN,XK-XN10,XK-XN SERIES,XK-RAY 系列,XK-P10LD,XK-FN SERIES,XK-R50,XK-GN系列,XK-T12,XK-GN,XK-ANFC,XK-X10

2017/2/23  - 金菱通达  - 选型指南 代理服务 技术支持 批量订货

【选型】博恩导热材料助力光伏逆变器散热设计,导热硅脂最高导热系数达3.8W/mK

博恩的导热垫片,导热硅脂,导热灌封胶,导热矽胶布或热固化粘接膜,绝缘片材和RTV粘胶胶等特色产品应用于光伏逆变器,使光伏逆变器具有良好的散热效果,绝缘性能和粘接稳定性。

2022-10-29 -  器件选型 代理服务 技术支持 批量订货 散热方案设计

Bornsun Provides Thermal management materials for Battery Packs to Quickly Conduct the Heat Generated by Charging and Discharging to the Heat Dissipation Elements

As manufacturers strive to increase the range of new energy vehicles, vehicles need to design as many cells as possible in a given space, and many battery packs consisting of individual cells in a battery module will generate heat and accumulate in a relatively small space during vehicle operation.

2024-12-12 -  应用方案 代理服务 技术支持 批量订货

博恩导热垫片、导热绝缘膜、导热凝胶、导热灌封胶等热界面材料为车载电源控制系统提供优良的导热效能

车载充电机由于大功率的充电放电,在壳体内发热量大的电子器件、芯片、MOSFET等需及时将热传导出来,否则会大大降低内部的元器件寿命和性能。热界面材料(导热垫片、导热绝缘膜、导热凝胶、导热灌封胶等)不仅能提供优良的导热效能,还能有效填补器件和散热体表面不平整的间隙以排除空气,建立有效的导热路径。

2024-05-30 -  应用方案 代理服务 技术支持 批量订货

【应用】博恩导热垫片应用于伺服驱动器,导热系数3W/m.k,助力解决大功率MOS散热问题

伺服驱动器内部结构包含大功率MOS等电子元器件,随着工作时间的延长,MOS部位会产生大量的热,如果没有合适的散热途径,将会导致热量堆积,并最终影响产品的正常使用。推荐采用博恩BN-FS300S-SP导热垫片,导热系数3W/m·k,控制MOS部位的温升。

2021-08-17 -  应用方案 代理服务 技术支持 批量订货

博恩导热界面材料在智能照明和投影仪中的应用

智能照明和投影仪设备中的LED模组、开关电源,遥感器、传感器等在工作状态时都会产生大量的热,所以为了提高照明设备的工作效率及使用寿命,有效的散热解决方案显得至关重要。博恩一系列导热界面材料,导热硅脂、低挥发导热垫片、导热绝缘膜和导热凝胶等组合为智能家居散热保驾护航。

2024-10-23 -  应用方案 代理服务 技术支持 批量订货

博恩提供热界面导热材料满足轨道交通PLC等电路设备对防护散热的高要求

PLC(可编程逻辑控制器)是为轨道交通提供智能化控制和管理的数字逻辑控制器,本质上是一种电路设备,对防护散热要求很高。其内部CPU,内存以及电源模组在设备运转时会产生热量,热量集中会致使设备温度过高影响正常运转,造成轨道交通系统运行时的安全隐患。博恩提供的热界面导热材料满足轨道交通PLC等电路设备对防护散热的高要求。

2024-06-05 -  应用方案 代理服务 技术支持 批量订货

博恩导热垫片选型表

博恩导热垫片包括超柔、吸波、低密度、低挥发、低出油、炭纤维导热垫片,可根据客户要求对硬度、出油率、挥发份、载体、回弹性等进行定制化设计;导热系数1~25W;厚度0.3mm~16mm;阻燃等级UL94V-0;可复合玻纤布、矽胶布、PI膜及背胶等

产品型号
品类
导热系数(W/m·K)
密度(g/cm³)
常规密度(g/cm³)
BN-FS100-LD
低密度导热垫片
1
1.6
1.8

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