Greenconn GB03 Series Wafer Connectors Complied with LV214 Standards: Engineered for Reliability and Space Efficiency

Driven by diverse industry demands, the miniaturization and high performance of electronic devices have become key trends in the connector market. With evolving needs in automotive electronics, industrial automation, and new energy, demand for reliable, efficient connectors is rising. Greenconn’s GB03 Series Wire-to-Board Connectors comply with LV214 standards, ensuring high reliability for automotive applications. Featuring a compact design, exceptional performance, and robust durability, these connectors deliver optimized space utilization, efficient assembly, and dependable connectivity for a wide range of applications.

Figure 1: Greenconn’s GB03 Series Wafer Connectors

Premium Materials Ensure Stable Connectivity 

Fabricated from high-quality materials, the GB03 series connectors provide superior electrical performance and durability.

Board-side Housing: Fabricated from a high-temperature LCP material to provide robust protection in extreme conditions.

Wire-side Housing: Engineered with weather-resistant PBT material for enhanced durability and adaptability.

Contact Terminals: Made from tin-plated copper alloy, compatible with wire gauges of 20 AWG to 26 AWG, ensuring stable electrical connections. 

Figure 2 : Specifications of GB03 Series Connectors

Compact Design Saves PCB Space 

Featuring a 1.8mm pitch, the GB03 series connectors offer a PCB area savings of up to 50% compared to conventional connector designs. The compact design optimizes applications in space-constrained environments, proving ideal for high-density configurations.

Figure 3 : Structure and Dimensions of GB03 Series Wire-to-Board Connectors

Innovative Features Boost Assembly Efficiency and Stability

Anti-Misalignment Mechanisms and Latching Design: An audible "click" feedback during mating confirms successful assembly while the latch design prevents signal interruption caused by vibration and shock.

Terminal Position Assurance (TPA): Designed to provide enhanced terminal alignment, strengthen the retention force between the terminal and housing, and increase connector stability.

Figure 4 : Latch Mechanism & TPA Structure of GB03 Series Wafer Connectors

Reliable Performance for Diverse Applications 

The GB03 series connectors offer excellent reliability while maintaining a compact size:

Each pin supports a maximum current of 3A, with the overall connector supporting up to 500V of voltage surge.

Made from high-reliability plastic materials, with a wide operating temperature range from -55℃ to +125℃, suitable for harsh environmental conditions.

Figure 5: Applications of GB03 Series Connectors

Utilizing superior materials and precise engineering, the GB03 series connectors offer exceptional reliability, making them ideally suited for high-density connectivity applications across automotive, industrial, medical, smart home, and renewable energy industries.