DL-RXC113L: High-performance FSK Wireless Receiving Module with TI-Chipcon CC113L Chip

时间： 2020-09-28 来源：DreamLNK

技术问答

DL-RXC113L was designed base on TI-Chipcon' S CC113L wireless transceiver chip. It is a compact, long-distance, high-performance wireless RF receiving module. The chip launched by TI-Chipcon is mainly set to 315MHz, 433MHz, 868MHz, 915MHz and other special frequency bands of the national networks. The sensitivity can reach -114dbm, the maximum transmission rate can reach 500Kbps.

There are 2 interface modes (SMD and DIP) been adopted, which can not only meet customers' SMT application, but also realize transverse and longitudinal welding through 2.0mm standard stitch arrangement. The small size of the module is convenient for portable products, and it can well meet the requirements of low-power system by combining with low-power MCU.

Basic information

Model:DL-RXC113L
Frequency:433M
Chip:CC113L
Power:-45~-35dBm
Voltage:1.8~3.6V
Sensitivity:-114dBm
Distance:500~600m
Size:19*17*2

Features

600m transmission distance (1200bps)
Working frequency: 433.92m (other frequencies need to be customized)
Operating voltage: 1.8V-3.6V
The most classical product in the SUB GHz RF modules
Support up to 255 independent channels, can achieve soft frequency hopping
Separate 64-byte RX FIFO and TX FIFO
Efficient SPI four-pins interface

Applications

Wireless sensor;
Home automation;
Automated data collection;
Industrial remote control, telemetry;
Data monitoring and transmission;
Home Appliance Control;
Security, alarm control;

Technical Parameter

DC characteristics

DC characteristics of the Module

RF characteristics (Unless otherwise stated, the temperature is 25 ℃, and VCC is 3.3V)

High frequency characteristic table of the module

Pins Definition

Pins Definition of DL-RTS4463PA Module

Size

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本文由翊翊所思转载自DreamLNK，原文标题为:High-performance FSK Wireless Receiving Module with TI-Chipcon' S CC113L Chip，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

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