【应用】导热垫片MCS30结合热仿真软件smart CFD为T-BOX提供散热解决方案
当前车联网已是大势所趋，作为车联网车载终端的核心：T-box。车内所有信息交换，网络链接，安全监测及操控等，都要通过其进行传递，并需要快速响应、准确可靠。处理如此巨大的信息量，T-BOX散热势必是个问题，那要如何选择合适的散热方案呢？
作为导电和热界面材料开发和应用的全球领导者：PARKER CHOMERICS，其热界面材料导热垫片MCS30可以很好填充芯片与散热器之间的界面，其理想的柔软度能有效的减少接触热阻，提高导热效率，满足其散热需求。
那为了确保T-BOX发热量能通过热界面材料MCS30有效的传导出去，势必需要用到热仿真。世强近期上线的smart CFD热仿真服务，可给客户提供整体散热方案及建议。
热仿真具体设计可通过客户产品的相关参数，如外壳结构图纸，PCBA发热源3D图纸，模拟相关条件，建立分析模型。合理利用smart CFD热仿真，输出相关结果：相关温度分布曲线，结构件设计合理性、热界面材料选择等。
总体结果表明：超低硬度的MCS30导热垫片，能有效的将最大热源T-BOX主芯片热量及时的传递到外壳散热器上。但由于外壳散热器六面，只有一面是金属铸造件，与空气交换的面积太小，散热效果并不是很好，建议增大散热器铸造铝件的面积，以便将热量有效的与空气交换。
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