Alliance Memory Launched High-Density, Low-Power 32M CMOS SRAM Offering 2.7V to 3.6V Power Supply in 12mm by 20mm TSOP-I Package
SAN CARLOS, Calif. — May 1, 2013 — ALLIANCE Memory expanded its line of legacy low-power CMOS SRAMs with a 32M IC (2M x 16 / 4M x 8 switchable), the company’s highest-density low-power device to date. Operating from a single power supply of 2.7V to 3.6V and offering a fast access time of 55 ns, the AS6C3216 is optimized for low-power industrial, telecom, medical, and automotive applications, and it is particularly well-suited for battery backup non-volatile memory.
The device released today is offered in the 48-pin, 12-mm by 20-mm TSOP-I package. The AS6C3216 features low power consumption with a typical operating current of 45mA and a standby current of 10µA. All inputs and outputs are fully TTL-compatible.
The AS6C3216 is fabricated using very high-performance, high-reliability CMOS technology, and its current is stable within the operating temperature range of – 40℃ to + 85℃. The device offers fully static operation and tri-state output, and it features a data retention voltage of 1.2 V minimum.
Alliance Memory’s legacy ICs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions. The AS6C3216 is the latest in the company’s full range of low-power SRAM products, which include devices with densities of 64K, 256K, 1M, 2M, 4M, 8M, 16M, and now, 32M.
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本文由涂抹转载自ALLIANCE News,原文标题为:Alliance Memory Launches New High-Density, Low-Power 32M CMOS SRAM Offering 2.7-V to 3.6-V Power Supply in 12-mm by 20-mm TSOP-I Package,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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