Partnership for True Multiple Sourcing: Semikron Danfoss Power Modules with ROHM IGBTs

2023-04-28 ROHM News

Semikron Danfoss and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regard to the implementation of silicon carbide (SiC) inside power modules. Recently, Semikron Danfoss added ROHM’s new 1200V RGA IGBT to its low-power module offering. In doing so, both companies show that they remain committed to serving worldwide motor drive customers’ needs.

The worldwide growth in electrification technologies has created unprecedented demand for power modules. Often, it is the chip supply that limits power module availability. Despite ongoing investments in production capacity by the chip manufacturers, the supply situation remains tight. It is against this backdrop that ROHM has introduced the new 1200V RGA IGBT, targeted as an alternative to the latest Generation 7 IGBT devices in industrial applications. ROHM is now expanding its bare die offering to Semikron Danfoss, positioning itself as an advanced alternative to traditional chip suppliers.


“The RGA is a newly designed, light punch through, trench gate IGBT with Tj, max = 175℃. The conduction, switching, and thermal characteristics are optimized for new industrial drive applications in the low to medium power range. At the same time, the RGA is intended to remain compatible with existing IGBT solutions, enabling a multiple-source approach. In addition, the RGA can also be used to improve transient overcurrent handling during overload conditions in motor drive applications,” says Kazuhide Ino, Member of the Board, Managing Executive Officer, and CFO at ROHM.


Semikron Danfoss can offer the 1200V RGA IGBT in a full range of nominal current classes from 10A to 150A. This range, combined with the suitability of the RGA chip in motor drive applications, means that the MiniSKiiP family is the ideal choice for module implementation. The baseplate-less, spring-contact MiniSKiiP is already deeply embedded in the worldwide motor drive market and is always equipped with the latest generation IGBTs. Therefore, it is important for this product to have an alternative IGBT source to diversify the supply chain. The uniform-height MiniSKiiP housing family is also offered on the market as a multiple-source package, making an alternative IGBT a valuable option for manufacturers.


For press-fit/solder applications, the industry-standard SEMITOP E package will also be available in pin-compatible configurations to existing Generation 7 IGBT module offerings. This housing family will also offer six-pack (“GD”) and converter-inverter-brake (“DGDL”) circuit configurations.


“The power electronics industry continues to recover and learn lessons from the supply issues in recent years. It’s clear that diversification in semiconductor chip and module manufacturing is required to generate true ‘multiple source’ power modules”, says Claus A. Petersen, President, of Semikron Danfoss. “In the case of 1200V Generation 7 IGBTs, a reliable equivalent from a reputable manufacturer is now available to address this issue also in the low power range. The 1200V RGA IGBT from ROHM is a perfect alternative to the Generation 7 IGBT and can be made to behave in a remarkably similar manner with small gate resistor adjustment,” continues Peter Sontheimer, Senior Vice President Industry Division & Managing Director at Semikron Danfoss.

Kazuhide Ino, Member of the Board, Managing Executive Officer, CFO, ROHM (left), Claus A. Petersen, President, Semikron Danfoss (right)
Kazuhide Ino, Member of the Board, Managing Executive Officer, CFO, ROHM (left)
Claus A. Petersen, President, Semikron Danfoss (right)


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本文由玄子转载自ROHM News,原文标题为:Partnership for True Multiple Sourcing: Semikron Danfoss Power Modules with ROHM IGBTs,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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高热流密度液冷板定制

定制液冷板尺寸5mm*5mm~3m*1.8m,厚度2mm-100mm,单相液冷板散热能力最高300W/cm²。

最小起订量: 1片 提交需求>

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授权代理品牌:加工与定制

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