【选型】德聚N-Sil8220 L1导热灌封胶用于环视摄像头，导热系数2.0W/m·K，具有粘度低、流动性好等优势

金菱通达（GLPOLY）热对策材料选型指南

Company Profile    Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel    Thermal Pad    Thermal Silicone Pad & Silicone Thermal Fiberglass/Film    EMI absorber/Absorption Gel    Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound    Silicone/Non-Silicone Thermal grease    Silicone Thermal Tape    Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad   

金菱通达  -  低密度导热硅凝胶垫,NON-SILICONE THERMAL TAPE,NON-SILICONE THERMAL GREASE,LOW DENSITY THERMAL GAP PAD FOR EV BMS,ELECTROSTATIC DISCHARGE THERMAL SILICONE PAD,热间隙垫,硅酮热膜,减振硅胶垫,硅橡胶热垫,NON-SILICONE THERMAL FIBERGLASS,非硅酮热玻璃纤维,无硅密封剂,热腻子凝胶,PRINTABLE PCM THERMAL LNTERFACE MATERIAL,热界面相变材料,导热电磁干扰吸收软垫,SILICONE THERMAL FIBERGLASS,无应力硅酮热腻子凝胶,脉冲编码调制系统,EML吸收器,非硅酮热敏带,EMI ABSORBER,石墨热辐射垫,热EMI吸收凝胶,用于电动汽车BMS的低密度热间隙衬垫,THERMALLY CONDUCTIVE INSULATOR,非硅酮热垫,THERMALLY CONDUCTIVE EMI ABSORBER,双组分热界面密封剂,静电放电散热硅胶垫,THERMAL CONDUCTIVE SILICONE GEL PAD,SILICONE RUBBER THERMAL PAD,导热粘合剂,THERMAL FIBERGLASS,THERMAL INTERFACE PHASE CHANGE MATERIALS,PRINTABLE PCM THERMAL INTERFACE MATERIAL,ELECTROSTATIC DISCHARGE THERMAL GAP PAD,可印刷PCM热界面材料,GRAPHITE THERMAL RADIATION PAD,非硅酮热润滑脂,非硅酮腻子凝胶,THERMAL EMI ABSORPTION GEL,THERMAL PUTTY GEL,NON-SILICONE THERMAL PAD,SILICONE RUBBERTHERMAL PAD,SILICONE THERMAL PUTTY PAD,两部分液体热间隙垫,硅酮热垫,导热绝缘体,两部分可分配热垫,硅热玻璃纤维,SILICONE FREE SEALING COMPOUND,硅酮热腻子垫,STRESSLESS SILICONE THERMAL PUTTY GEL,THERMAL GREASE,NON-SILICONE THERMAL GREASE,SILICONE THERMAL PAD,PHASE CHANGE MATERIALS,静电放电热间隙垫,SILICONE THERMAL FILM,热界面润滑脂,EML ABSORBER,热玻璃纤维,SILICONE THERMAL TAPE,热导率EML吸收体PCM,THERMAL CONDUCTIVITY EMI ABSORBER SOFT PAD,TWO-PART THERMAL INTERFACE SEALING COMPOUND,导热硅凝胶垫,THERMAL GAP PAD,硅酮热敏带,THERMALLY CONDUCTIVE ADHESIVE,PCMS,非硅酮密封剂,VIBRATION DAMPENING SILICONE PAD,硅热凝胶,SILICONE PUTTY PAD,THERMAL CONDUCTIVITY EMI ABSORBER,非硅酮型,硅热润滑脂,NON-SILICONE SEALING COMPOUND,导热EMI吸收材料,TWO-PART DISPENSABLE THERMAL PAD,TWO-PART LIQUID THERMAL GAP PAD,THERMAL LNTERFACE GREASE,散热膏,THERMAL INTERFACE GREASE,NON-SILICONE PUTTY GEL,硅酮腻子垫,THERMAL CONDUCTIVITY EML ABSORBER PCM,NON-SILICONE TYPE,相变材料,导热EMI吸收凝胶,SILICONE THERMAL GREASE,THERMALLY CONDUCTIVE EMI ABSORPTION GEL,SILICONE THERMAL GEL,LOW DENSITY THERMALLY CONDUCTIVITY SILICONE GEL PAD,XK-G20E,XK-P20系列,XK-R系列,XK-P PUTTY,XK-PN50,XK-Z系列,XK-P20LD,XK-P80,XK-RE SERIES,XK-RAY310,XK-A100,XK-FN系列,XK-F系列,XK-FN,XK-FN20,XK-J系列,XK-C35D,XK-C35C,XK-PN45,XK-GN SERIES,XK-Z,XK-FST,XK-F35,XK-R30,XK-Z SERIES,XK-F10ST,XK-FN10,XK-P PUTTY SERIES,XK-FN15,XK-FST系列,XK-SF SERIES,XK-P45-PUTTY,XK-GN20,XK-Z15,XK-RE系列,XK-FN50,XK-X SERIES,XK-T SERIES,XK-G40,XK-F20,XK-J20,XK-SF35,XK-XN40,XK-P60,XK-RAY,XK-J25,XK-FST SERIES,XK-C系列,XK-SN SERIES,XK-R20,XK-G系列,XK-PN系列,XK-K系列,XK-TN08,XK-GN15,XK-XN系列,XK-SN系列,XK-FN40,XK-XN50,XK-G30,XK-S15LV,XK-F10,XK-C35,XK-PN60,XK-S30LV,XK-TN,XK-J10,XK-P50,XK-F15,XK-A SERIES,XK-TN12,XK-PS SERIES,XK-R10,XK-J18,XK-X50,XK-SF系列,XK-R15,XK-P30S20,XK-A80,XK-A60,XK-P系列,XK-PLD SERIES,XK-P20 SERIES,XK-PN15,XK-T系列,XK-P50-PUTTY,XK-C20,XK-X系列,XK-G20,XK-S20LV,XK-C25,XK-PLD,XK-SN,XK-SF15,XK-GEL 100,XK-SF18,XK-SN10,XK-P45,XK-PS系列,XK-P80-P,XK-SF,XK-K4,XK-X40,XK-TN SERIES,XK-F20ST,XK-K6,XK-P20S,XK-F SERIES,XK-GN30,XK-J SERIES,XK-S12LV,XK-C15,XK-C16,XK-P PUTTY 系列,XK-K10,XK-P15LD,XK-G15,XK-P50-P,XK-P30,XK-SN20,XK-P SERIES,XK-P80-PUTTY,XK-RE,XK-PN SERIES,XK-C,XK-TN系列,XK-G,XK-F,XK-F60,XK-R SERIES,XK-S25LV,XK-PN30,XK-A,XK-P20S20,XK-R,XK-A系列,XK-T,XK-R10E9,XK-PLD系列,XK-P20,BETA GEL 100,XK-X,XK-P25,XK-K,XK-J,XK-P45-P,XK-RAY SERIES,XK-P,XK-G SERIES,XK-PN,XK-T09,XK-A30,XK-PS,XK-F50,XK-F15ST,XK-C SERIES,XK-PN20,XK-K SERIES,XK-XN,XK-XN10,XK-XN SERIES,XK-RAY 系列,XK-P10LD,XK-FN SERIES,XK-R50,XK-GN系列,XK-T12,XK-GN,XK-ANFC,XK-X10,电机控制,MOTOR CONTROLS,空中飞行,OPTICAL PRODUCTS,HEAT SINK,军事的,摄像头,DIGITAL DISK DRIVES,北桥集成电路,医学电子学,MEDICAL ELECTRONICS,DC-DC CONVERTERS,高压装置,NEW ENERGY VEHICLES,AEROSPACE,散热片,COMPUTER,HIGH FREQUENCY IC CHIP,CAMERA,存储设备,手机应用,AIR FLIGHT,GRAPHIC CARDS,POWER SUPPLIES,光学产品,LED LIGHT,PERIPHERALS,HIGH PERFORMANCE COMPUTER PROCESSORS GRAPHIC CARDS,HAND-SET APPLICATIONS,POWER CONVERSION,TELECOMMUNICATIONS,工业控制设备,LED LIGHTING,POWER SEMICONDUCTORS,CELLULAR PHONES,FPC,军工设备,MILITARY EQUIPMENT,HIGH PERFORMANCE COMPUTER PROCESSORS,CONSUMER ELECTRONICS,射频模块,LED灯,CONSUMER ELECTRONICS,手机,HIGH VOLTAGE UNITS,SEMICONDUCTOR,消费电子,RF MODULE,航空航天,功率半导体,无线通讯,光纤模块,UAV,TELECOMMUNICATIONS,COMPUTER,医疗器件,DC-DC转换器,数字磁盘驱动器,高性能计算机处理器,STORAGE DEVICE,FIBER OPTICS MODULES,MILITARY,MEDICAL DEVICES,AUTOMOTIVE SYSTEMS,半导体,医疗设备,MEDICAL EQUIPMENT,AUTOMOTIVE ELECTRONICS,新能源汽车,LED,COMPUTER CPU,计算机中央处理器,功率转换,TELECOMMUNICATIONS CAMERA,LED照明,图形卡,外围设备,INDUSTRIAL CONTROL EQUIPMENT,电脑,NORTH BRIDGE IC,发光二极管,电源,汽车系统,高频集成电路芯片,汽车电子,柔性线路板,无人飞机

【视频】德聚热管理、电磁屏蔽、底填等电子胶粘剂产品方案

德聚的产品基于多种化学体系，包括丙烯酸、环氧、有机硅、改性硅烷、聚氨酯等，固化方式是从光固化，热固化、双组分反应固化到常温湿气固化，及以上固化机理的组合。可以适应不同的工艺要求产品的功能也是涵盖了电子胶粘剂的大部分品类，已经广泛应用于多种行业。

德聚  -  导热灌封胶,底部填充胶,胶粘剂,电磁屏蔽胶,导热填缝剂,结构粘接胶,导热粘接胶,导热凝胶,包封胶,导热硅脂,电子胶粘剂,EW 6326LT-6,N-SIL 8745B,N-SIL 8356,EW 6364,EW 63033,工业物联网,可再生能源,半导体,信息通信技术,消费电子,通信,IIOT,新能源汽车,ICT,物联网,汽车电子,工业

储能系统高性能材料解决方案

德聚  -  导热灌封胶,导热填缝剂,结构粘接胶,环氧,导热粘接胶,储能系统高性能材料,导热硅脂,有机硅,涂覆胶,聚氨酯,密封胶,EW 6660HV,EW 6303,N-SIL 8210,N-SIL 8772,N-PU 5103M,N-PU 5912,N-PU 5901,N-SIL 8626LS,N-SIL 8742M,N-SIL 8180,N-SIL 8628,N-SIL 8206N,PCS,电池模组,变流器,BMS,EMS,电池管理系统,电池包,能量管理系统,邮政特快专递