New Silicon Labs Modules Provide Pre-Certified Wireless Connectivity for A Broad Range of IoT Applications

时间： 2020-11-30 来源：Silicon Labs

技术问答

-- Choice of Bluetooth, Zigbee, Thread and Multiprotocol modules speed time-to-market by addressing developer pain points with industry-leading security for smart home, building and industrial automation applications --

AUSTIN, Texas – Oct. 28, 2020 – SILICON LABS (NASDAQ: SLAB), a leading provider of silicon, software and solutions for a smarter, more connected world today announced a portfolio expansion of pre-certified wireless modules specifically designed to address modern needs of IoT application development. The portfolio consists of the only modules in the industry with full stack support for multiprotocol solutions to enable commercial and consumer IoT applications, with flexible package options and highly integrated device security.

“Silicon Labs has mastered the challenges that come with adding wireless connectivity to IoT devices,” said Matt Saunders, vice president of IoT marketing and applications at Silicon Labs. “Our new modules offer a simple, effective solution to the complex problem of RF engineering and testing, allowing IoT device makers to quickly get pre-certified and secure wireless devices into the market.”

Silicon Labs highly integrated modules are available in multiple package options including system-in-package (SiP) and traditional printed circuit board (PCB). SiP modules contain miniaturized components that remove the need for complicated RF design and certification by opening space-constrained IoT designs to module-based solutions. PCB modules enable flexible pin access and additional options to extend RF performance.

Silicon Labs’ new modules include xGM210PB, BGM220, MGM220, and BGX220 Xpress:

xGM210PB features Secure Vault, the ARM PSA Level 2 certified state-of-the-art IoT device security, as well as dynamic multiprotocol support for Bluetooth, Zigbee, and OpenThread with robust and supports Wi-Fi coexistence. Optimized for IoT applications, including connected lighting, gateways, voice assistants and smart meter in-home displays, xGM210PB modules offer up to +20dBM output power and better than -104dBm sensitivity.
BGM220 is one of the world’s smallest Bluetooth modules and the first to support Bluetooth Direction Finding. The integrated, pre-certified Bluetooth 5.2 module delivers up to ten-year operation on a coin cell battery, ideal for a broad range of Bluetooth LE applications including appliances, asset tags, beacons, portable medical, fitness, and Bluetooth mesh low-power nodes.
MGM220 is a low-power, low-cost ideal for eco-friendly, ultra-low-power IoT products including include lighting controls, building and industrial automation sensors. The modules are ideal for Zigbee Green Power and energy harvesting applications.
BGX220 Xpress includes an onboard Bluetooth stack, Xpress command interface and pre-programmed cable replacement firmware to deliver a serial to Bluetooth LE solution needing no firmware development. The modules are ideal for industrial applications including human-machine interface (HMI) devices, addressing size, safety, and environmental challenges.

The modules are supported in the free Silicon Labs Simplicity Studio 5, a fully integrated development environment, featuring comprehensive software stacks, application demos and mobile apps, along with premium features, such as network analyzer and patented energy profiler. Customers are also able to further accelerate wireless development by taking advantage of simple APIs from Silicon Labs Xpress modules.

Samples, production quantities and development kits for xGM210PB, BGM220, MGM220 and BGX220 Xpress are available now.

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由青莲居士转载自Silicon Labs，原文标题为:New Silicon Labs Modules Provide Pre-Certified Wireless Connectivity for a Broad Range of IoT Applications，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

全部评论（0）

暂无评论

【产品】Silicon Labs BGM220模块入门套件开箱评测，加速新型蓝牙产品上市

BGM220蓝牙模块无线入门套件基于Silicon Labs的EFR32BG22蓝牙无线芯片，延续和继承了芯科科技在无线低功耗蓝牙芯片方面的领先优势和各种软硬件配套资源，同时又提供了两种新的产品形式，SiP封装形式的蓝牙模块和PCB封装形式的蓝牙模块。

新产品发布时间 : 2021-01-07

Accelerate Smart Home Wireless Product Development With The Matter-powered Silicon Labs Mgm240 Wireless Modules

Silicon Labs MGM240 wireless modules provide smart home device makers with a low-power, high-performance wireless solution for Matter over Thread with Bluetooth LE on the same chip enabling easy commissioning for the user.

新产品发布时间 : 2022-10-18

【产品】Silicon Labs线上展示最新蓝牙SoC解决方案EFR32BG22

Silicon Labs日前参加“蓝牙5力全开・最新蓝牙技术与应用设计趋势大揭密”线上技术研讨会，展示新一代蓝牙SoC解决方案EFR32BG22的多样功能、特色及应用案例；该方案兼具高安全性、超低功耗与完整蓝牙无线连结效能，提供低成本的设计方案新选择。

新产品发布时间 : 2020-11-19

Silicon Labs（芯科科技）产品选型指南

目录- 8-bit Microcontrollers 32-bit Microcontrollers High-performance analog products wireless ICs, SoCs and modules Sensors Interface chip Timing products Isolation products Audio products Video products Voice products Data products Development Tools

型号- C8051T604-GS,SI8420AD-A-IS,WF111,SI7007-A20-IM1,SI8035AA-B-IU,C8051T604-GM,C8051F813-GU,SI8642ET-IS,C8051F541-AM,SL16020DC,C8051F813-GM,C8051F587-AM,C8051F044,SI2434,SI4613,C8051F043,SI4614,C8051F046,C8051F045,C8051F587-AQ,SI2435,C8051F047,C8051F541-AQ,TS3001,TS3002,SI2439,TS3003,SI8712CC-B-IP,TS3004,C8051F060,C8051F531-C-IM,TS3006,C8051F062,SI8710AD-B-IS,C8051F061,SI8712CC-B-IS,C8051F064,C8051F063,EFM32LG230FX - QFN64,EZR32WG230F64R69G,EFM32WG880FX - QFP100,EFM32WG980FX - QFP100,SI8233BB-C-IS1,C8051F531-C-IT,SI51210,SI8635BD-B-IS,C8051F975-A-GM,SI8230BB-B-IS1,SI8232BB-B-IS,C8051F394-A-GM,SI4624,C8051T616-GM,SI4622,SI8635BT-IS,C8051F573-IM,SI4629,C8051F530-C-AM,SI8920BD-IS,C8051F530-C-AT,C8051F801-GM,C8051F711-GQ,C8051F585-IM,SI21802,C8051F585-IQ,EFM32LG390FX - BGA112,SI8605AC-B-IS1,C8051F370-A-GM,EFM8BB10F2G-A-QFN20,C8051F066,C8051F065,C8051F067,SI2457,SI3452B-B02-GM,SI88243ED-IS,C8051F801-GU,C8051F506-AQ,SI7005-B-GM1,SI2167-C,SI21682-C,SI7022-A20-IM,SI8642AB-B-IS,SI8650ED-B-IS,SI2167-B,SI8719BC-A-IP,TSM9118,SI8631AB-B-IS,TSM9117,SI8234AB-C-IS,TSM9119,SI8234AB-C-IM,EFM32WG390FX - BGA112,SI8620AB-B-IS,SI8719BC-A-IS,SI8631EC-B-IS1,C8051F565-AM,EZR32WG330F64R55G,SI8235AB-C-IS1,C8051F835-GS,SI1132,SI3500-A-GM,TS1102-100,C8051F506-AM,C8051F565-AQ,SL2309NZ,SI8065AA-B-IU,EZR32LG230F64R60G,C8051F551-AM,EZR32LG230F128R60G,EFM32LG980FX - QFP100,SI8640AB-B-IS1,SI8600AD-B-IS,SI8710BC-B-IP,SI8710BC-B-IS,C8051F007,EFM32LG290FX - BGA112,SI8712BD-B-IM,EFM32GG295FX - BGA120,C8051F38C-GQ,SI8244BB-C-IS1,C8051F000,C8051F002,C8051F38C-GM,C8051F001,SI8620EC-B-IS,TS1005,TS1004,C8051F006,TS1003,C8051F005,TS1002,TS1001,C8051F963-B-GM,C8051F504-AQ,EFM8SB10F4G-A-QFN20,C8051F823-GS,EZR32LG230F128R61G,C8051F020,EFM32TG822FX - QFP48,SI8650BC-B-IS1,C8051F388-GQ,EFM32G200FX - QFN32,C8051F537-C-AM,C8051F563-IM,C8051F019,EZR32WG330F256R55G,C8051F018,C8051F563-IQ,C8051F011,SI2401,SI4822,C8051F010,EFM32TG222FX - QFP48,EFM32TG210FX - QFN32,SI4820,C8051F012,C8051F015,SI4826,SI2404,SI4827,C8051F017,SI4824,C8051F016,C8051F504-AM,SI4825,EFM32WG232FX - QFP64,C8051T602-GS,C8051T327-GM,C8051T602-GM,BGM111,EZR32WG330F128R68G,C8051F863-C-GS,SI88244ED-IS,C8051F811-GS,C8051F589-AM,SI8421BD-B-IS,C8051F537-C-AT,EFM32GG395FX - BGA120,C8051F531-C-AT,C8051F854-C-GM,C8051F022,C8051F021,SI4831,C8051F023,SI2415,C8051F854-C-GU,SI4835,SI2417,SI4836,EFM32WG290FX - BGA112,SI2169-C,TS1101-100,SI8455BA-B-IU,C8051F040,C8051F042,C8051F041,EZR32WG330F128R69G,SI8232AB-B-IS1,C8051F344-GQ,SI8662EC-B-IS1,SI4840,SI8452AA-B-IS1,C8051F701-GQ,SI4844,C8051F502-IM,C8051F575-IM,SI88622ED-IS,C8051F502-IQ,CP2201,CP2200,EFM32LG942FX - QFP64,SI8641BB-B-IS,EFM32GG942FX - QFP64,SI8655BB-B-IS1,SI8400AB-B-IS,SI8030AA-B-IU,C8051F587-IM,C8051F206,C8051F587-IQ,EFM32TG840FX - QFN64,SI8460AA-B-IS1,C8051F500-IQ,EZR32WG230F64R61G,C8051F546-IM,C8051F500-IM,EZR32WG330F128R67G,SI8660AB-B-IS1,C8051F827-GS,C8051F988-GU,SI52142,SI52143,SI7050,SI52144,SI7055,SI7054,SI7053,C8051F567-AQ,C8051F590-AM,C8051F567-AM,C8051F988-GM,SI8450BA-B-IS1,SI7023-A20-IM1,SL28EB742,SI8231BD-B-IS,C8051F855-C-GU,EZR32WG230F128R63G,EZR32LG230F64R68G,SI8631BC-B-IS1,C8051F300-GM,SI52111,SI52112,SI8920AD-IS,C8051F855-C-GM,SL28EB740,EFM8SB20F16G-A-QFN24,SI8641BB-B-IS1,C8051F300-GS,EFM8UB10F16G-C-QFN28,C8051F920-GQ,C8051F815-GS,C8051F920-GM,C8051F220,EFM8UB10F16G-C-QFN20,TSM9938F,EZR32LG230F64R67G,C8051F221,C8051T320-GQ,SI8651EC-B-IS1,C8051F226,C8051F862-C-GS,TSM9938H,SI8661BB-B-IS1,EZR32WG230F64R63G,SI8661ED-B-IS,SI8220DD-A-IS,EZR32LG230F64R69G,SI8405AB-A-IS1,C8051F565-IM,EFM8SB10F2G-A-QFN20,C8051F395-A-GM,C8051F565-IQ,SI8641BD-B-IS,EFM32TG232FX - QFP64,C8051F231,SI8661BC-B-IS1,C8051F230,C8051T631-GM,SL2305NZ,SI8441AA-D-IS1,SI8630BD-B-IS,C8051T600-GS,C8051F236,SI8442BA-D-IS1,C8051F580-AQ,C8051T600-GM,C8051F803-GS,C8051F580-AM,TS1103-100,EZR32WG230F128R61G,C8051F996-GM,SI21822,SI8645BT-IS,C8051F302-GM,C8051F996-GU,SI8232AB-B-IS,SI8622BC-B-IS,C8051F302-GS,TS7003,C8051F708-GQ,TS7001,EFM32WG890FX - BGA112,EZR32LG230F64R61G,EZR32WG330F128R63G,SI21662-B,SI8600AC-B-IS,SI21662-C,EZR32WG230F128R60G,EFM32G222FX - QFP48,TSM9938T,C8051F523-C-IM,SI21812,EFM32GG990FX - BGA112,EFM32LG360FX - CSP81,SL23EP09NZ,SI8651BD-B-IS,TSM9938W,C8051F510-IM,C8051F556-IM,SI8422AD-B-IS,SI8232AD-B-IS,C8051F411,C8051F410,C8051F413,SI8405AA-A-IS1,C8051F412,C8051F381-GM,SI8040AA-B-IU,C8051F589-IM,C8051F965-B-GM,SI8461BA-B-IS1,SI8655BA-B-IS,SI8660BA-B-IS1,C8051F381-GQ,C8051T621-GM,C8051F346-GM,EZR32WG230F64R68G,EFM8BB10F8G-A-QSOP24,SI51214,C8051F346-GQ,SI51211,SI51218,SI8655BA-B-IU,SI8662BD-B-IS,SI8630BB-B-IS,EFM8UB20F32G-A-QFP32,SI51219,EZR32LG230F64R63G,EZR32WG330F128R60G,C8051F930-GM,SI8630BB-B-IS1,SI8660BB-B-IS1,C8051F502-AM,C8051F825-GS,EFM8UB11F16G-C-QSOP24,C8051F544-IM,EZR32WG330F128R61G,C8051F34A-GQ,EFM32GG332FX - QFP64,SI7006-A20-IM,C8051F502-AQ,SI2165-D,C8051F544-IQ,C8051F986-GU,C8051F34A-GM,SI21832,WF121,EZR32WG230F64R67G,SI8620BT-IS,C8051F569-AM,SI8642BC-B-IS1,C8051F930-GQ,C8051F986-GM,EFM8UB20F32G-A-QFP48,EZR32LG330F64R55G,EFM32LG380FX - QFP100,SI8630

选型指南 - SILICON LABS - 2019/1/14 PDF 英文下载

Silicon Labs（芯科科技）物联网无线产品选型指南

目录- Company and product overview Bluetooth Modules proprietary wireless devices Wi-Fi Modules Mighty Gecko Modules Z-Wave Modules

型号- EBWT41U,ZDB5202,SLEXP8027A,EFR32FG13P233F512GM48,EFR32™,SLWSTK6061B,MGM12P,EZR32WG,EFR32FG13P231F512GM32,EFR32BG12P232F1024GM68,EFR32MG13P733F512GM48,EFR32BG13P532F512GM32,WT12,AMW007-E04,EFR32,WT32I,EZR32™,BGM121,BGM11S,WT11U,EFR32FG,EFR32FG14P233F256GM48,SLWSTK6062B,RBK-ZW500DEV-CON2,SLWSTK6120A,SLWSTK6063B,RBK-ZW500,EFR32BG12P132F1024GL125,SI4XXX,ZM5101,ZM5304,ZDB5101,ACC-UZB3-U-BRG,BGM111,EBWT11U,EFR32FG14P233F128GM48,ACC-UZB3-U-STA,MGM111,ZDB5304,SLWSTK6000B,SLWSTK6020B,WT32,SI10XX,SLWSTK6101C,EFR32MG13P632F512GM32,AMW037,EFR32FG12P433F1024GM48,DKWT32I-A,EFR32MG12P132F1024GL125,EFR32MG1P133F256GM48,BGM13S,EZR32HG,BGM13P,BGX13P,EZR32LG,MGM13P,WT41U,EFR32BG13P733F512GM48,BGX13S,SLWSTK6060B,MGM13S,SLWSTK6065B,WGM110,RBK-ZW500DEV-EMB2,EFR32BG12P433F1024GL125,EBWT12-A,ZM5202,AMW007,SLTB004A,EFR32MG14P733F256GM48

选型指南 - SILICON LABS - REV A - SEPTEMBER 2018 PDF 英文下载

8 High-Power Bluetooth LE Modules and Their Applications

Bluetooth Low Energy (BLE) technology is renowned for its low power consumption and ease of use in short-range wireless communication. High-power BLE modules are essential for applications requiring extended range and robust connectivity. They integrate advanced wireless technologies and offer flexible output options, making them ideal for smart homes, industrial automation and more. This article introduces 8 high-power bluetooth LE modules and their applications.

技术探讨发布时间 : 2024-07-16

Silicon Labs（芯科科技） Wi-Fi 芯片和模块选型指南

目录- Wi-Fi SoC and Module Selector Guide Wi-Fi Lineup Wi-Fi Development Kits IoT Wi-Fi Technology Leader Wi-Fi Applications Company Profile

型号- SLEXP8022A,SIWX915,RS9116,WF200,SIWX917,RS9116X-DB-EVK1,RS9116X-SB-EVK1,RS9116X-SB-EVK2

选型指南 - SILICON LABS - 2023/10/3 PDF 英文下载

长达10年电池寿命的蓝牙SoC EFR32BG22

型号- SLWRB4183A,FG12,FG13,FG14,EFM32,ESP32-S2,BG22C224,BG22C222,DA16200,FG1,CYW43012,SX126X,EFR32FG23,EFR32FG1,BG22,BG21,EFR32BG22,BGM220S,EFR32,RS9116X-SB-EVK1,BGM220P,RS9110,CC3220,FG22,RS9113,BGM220,EFR32XG1X,SLWRB4182A,RS9116,RS9116X-DB-EVK1,EFR32FG,BG22C112,MT 5932,QCA4020,SLWSTK6021A,ESP32,SLTB010A,SX127X,EFR32FG13,EFR32FG12,EFR32FG14

商品及供应商介绍 - SILICON LABS PDF 中文下载

Beacon600 2.4GHz High-Performance Bluetooth Module: Effortlessly Handles Many-to-Many Communication with Flexible Operating Modes

Beacon600 2.4GHz High-Performance Bluetooth Module is low power, cost-effective, and powerful, suitable for various wireless communication applications. It offers flexible parameter configuration and efficient data transmission capabilities.

产品发布时间 : 2024-06-30

Silicon Labs Announces New Bluetooth® Location Services with Advanced Hardware and Software

Silicon Labs announced its new, Bluetooth Location Services solution using accurate, low-power Bluetooth devices to simplify Angle of Arrival (AoA) and Angle of Departure (AoD) location services.

厂牌及品类发布时间 : 2022-07-07

Bluetooth tag connects and tracks construction assets wirelessly, increasing productivity and reducing maintenance costs

Silicon Labs’ Bluetooth 5.2 SoC modules enable secure, wireless communication between the Kin tags and the Iris platform and meet the unique requirements of high-volume, battery-powered Bluetooth products.

行业资讯发布时间 : 2021-11-13

BLE Connection Roles Central/Master vs. Peripheral/Slave

Title: BLE Connection Roles: Central / Master vs. Peripheral / SlaveKeywords: BLE connection, Central vs Peripheral, bluetooth master module, bluetooth master slave,bluetooth master vs slaveDescription: Learn the nuances between Central and Peripheral roles in BLE devices to optimize energy efficiency and functionality for your projects. Unlock how to select the most suitable BLE modules based on your specific needs. In the world of Bluetooth Low Energy (BLE), BLE devices are designed to play specific roles that dictate how they interact within the BLE ecosystem.

技术探讨发布时间 : 2024-05-15

BGM220S 无线 Gecko Bluetooth® 模块数据表

型号- BGM220SC22WGA2,BGM220S,BGM220SC22HNA2,BGM220S12A,BGM220SC12WGA2,BGM220S22A

数据手册 - SILICON LABS - Rev. 1.2 - October, 2023 PDF 中文下载查看更多版本

Bluetooth Modules: A Comprehensive Guide to Wireless Solutions

The article emphasizes the importance of understanding Bluetooth modules for integrating wireless communication technology into projects. It highlights the benefits of these modules, such as versatility, high-speed data transfer, and low power consumption. Bluetooth modules are crucial for IoT applications, wireless audio devices, and automotive systems, enabling seamless wireless communication.

技术探讨发布时间 : 2024-04-25

Silicon Labs（芯科科技）电源产品/定时器/IoT产品介绍

描述- 2020 April Sales Training Slides

型号- SI547,SI8422BB,SI545,SI546,SI549,XG12,XG21B,SI533XX,SI5383,XG21A,SI5342,SI5384,SI5341,SI536X,SI5347,SI5388,SI5389,SI532X,SI5348,EFR32FG22,CK440,EFR32BG22,SI5508,EFR32,SI5332-GM,SI534XH,SI5350,SI53471,SI53472,SI5392,SI5397,SI41XX,SI5351,SI828X,SI5357,SI537X,SI561,SI347X,SI562,SI560,SI565,SI566,SI5518,SI564,SI569,SI54X,XG1X,SI567,SI532XX,EFR32XG21B,SI823HX,SI538X,SI893X,BG22,SI534X,BGM220S,BGM220P,BGM220,SI51X,EFR32MG22,SI34071,SI522XX,SI834X,SI8920,SI5332,SI539X,SI88XX,SI8921,SI8922,SI5330,SI5335,SI8252X,SI3474,XG22,SI531X,XG21,SI540,SI5338,SI842X,SI830X,EFP01,SI894X,DB2000

商品及供应商介绍 - SILICON LABS - 2020年4月 PDF 英文下载