New Silicon Labs Modules Provide Pre-Certified Wireless Connectivity for A Broad Range of IoT Applications
-- Choice of Bluetooth, Zigbee, Thread and Multiprotocol modules speed time-to-market by addressing developer pain points with industry-leading security for smart home, building and industrial automation applications --
AUSTIN, Texas – Oct. 28, 2020 – SILICON LABS (NASDAQ: SLAB), a leading provider of silicon, software and solutions for a smarter, more connected world today announced a portfolio expansion of pre-certified wireless modules specifically designed to address modern needs of IoT application development. The portfolio consists of the only modules in the industry with full stack support for multiprotocol solutions to enable commercial and consumer IoT applications, with flexible package options and highly integrated device security.
“Silicon Labs has mastered the challenges that come with adding wireless connectivity to IoT devices,” said Matt Saunders, vice president of IoT marketing and applications at Silicon Labs. “Our new modules offer a simple, effective solution to the complex problem of RF engineering and testing, allowing IoT device makers to quickly get pre-certified and secure wireless devices into the market.”
Silicon Labs highly integrated modules are available in multiple package options including system-in-package (SiP) and traditional printed circuit board (PCB). SiP modules contain miniaturized components that remove the need for complicated RF design and certification by opening space-constrained IoT designs to module-based solutions. PCB modules enable flexible pin access and additional options to extend RF performance.
Silicon Labs’ new modules include xGM210PB, BGM220, MGM220, and BGX220 Xpress:
xGM210PB features Secure Vault, the ARM PSA Level 2 certified state-of-the-art IoT device security, as well as dynamic multiprotocol support for Bluetooth, Zigbee, and OpenThread with robust and supports Wi-Fi coexistence. Optimized for IoT applications, including connected lighting, gateways, voice assistants and smart meter in-home displays, xGM210PB modules offer up to +20dBM output power and better than -104dBm sensitivity.
BGM220 is one of the world’s smallest Bluetooth modules and the first to support Bluetooth Direction Finding. The integrated, pre-certified Bluetooth 5.2 module delivers up to ten-year operation on a coin cell battery, ideal for a broad range of Bluetooth LE applications including appliances, asset tags, beacons, portable medical, fitness, and Bluetooth mesh low-power nodes.
MGM220 is a low-power, low-cost ideal for eco-friendly, ultra-low-power IoT products including include lighting controls, building and industrial automation sensors. The modules are ideal for Zigbee Green Power and energy harvesting applications.
BGX220 Xpress includes an onboard Bluetooth stack, Xpress command interface and pre-programmed cable replacement firmware to deliver a serial to Bluetooth LE solution needing no firmware development. The modules are ideal for industrial applications including human-machine interface (HMI) devices, addressing size, safety, and environmental challenges.
The modules are supported in the free Silicon Labs Simplicity Studio 5, a fully integrated development environment, featuring comprehensive software stacks, application demos and mobile apps, along with premium features, such as network analyzer and patented energy profiler. Customers are also able to further accelerate wireless development by taking advantage of simple APIs from Silicon Labs Xpress modules.
Samples, production quantities and development kits for xGM210PB, BGM220, MGM220 and BGX220 Xpress are available now.
- |
- +1 赞 0
- 收藏
- 评论 0
本文由青莲居士转载自Silicon Labs，原文标题为:New Silicon Labs Modules Provide Pre-Certified Wireless Connectivity for a Broad Range of IoT Applications，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
相关推荐
【产品】Silicon Labs BGM220模块入门套件开箱评测，加速新型蓝牙产品上市
BGM220蓝牙模块无线入门套件基于Silicon Labs的EFR32BG22蓝牙无线芯片，延续和继承了芯科科技在无线低功耗蓝牙芯片方面的领先优势和各种软硬件配套资源，同时又提供了两种新的产品形式，SiP封装形式的蓝牙模块和PCB封装形式的蓝牙模块。
Accelerate Smart Home Wireless Product Development With The Matter-powered Silicon Labs Mgm240 Wireless Modules
Silicon Labs MGM240 wireless modules provide smart home device makers with a low-power, high-performance wireless solution for Matter over Thread with Bluetooth LE on the same chip enabling easy commissioning for the user.
【产品】Silicon Labs新推多款无线模块，为广泛的IoT应用提供预认证的无线连接
Silicon Labs宣布其经过预认证的无线模块产品组合得到进一步扩展。这些模块专门用于解决现代物联网应用开发的需求。该产品组合包括业内唯一的模块，该模块提供对多协议解决方案的全栈支持，能够支持商业和消费物联网应用，并具有灵活的封装选项和高度集成的设备安全性。
Silicon Labs（芯科科技）产品选型指南
目录- 8-bit Microcontrollers 32-bit Microcontrollers High-performance analog products wireless ICs, SoCs and modules Sensors Interface chip Timing products Isolation products Audio products Video products Voice products Data products Development Tools
型号- C8051T604-GS,SI8420AD-A-IS,WF111,SI7007-A20-IM1,SI8035AA-B-IU,C8051T604-GM,C8051F813-GU,SI8642ET-IS,C8051F541-AM,SL16020DC,C8051F813-GM,C8051F587-AM,C8051F044,SI2434,SI4613,C8051F043,SI4614,C8051F046,C8051F045,C8051F587-AQ,SI2435,C8051F047,C8051F541-AQ,TS3001,TS3002,SI2439,TS3003,SI8712CC-B-IP,TS3004,C8051F060,C8051F531-C-IM,TS3006,C8051F062,SI8710AD-B-IS,C8051F061,SI8712CC-B-IS,C8051F064,C8051F063,EFM32LG230FX - QFN64,EZR32WG230F64R69G,EFM32WG880FX - QFP100,EFM32WG980FX - QFP100,SI8233BB-C-IS1,C8051F531-C-IT,SI51210,SI8635BD-B-IS,C8051F975-A-GM,SI8230BB-B-IS1,SI8232BB-B-IS,C8051F394-A-GM,SI4624,C8051T616-GM,SI4622,SI8635BT-IS,C8051F573-IM,SI4629,C8051F530-C-AM,SI8920BD-IS,C8051F530-C-AT,C8051F801-GM,C8051F711-GQ,C8051F585-IM,SI21802,C8051F585-IQ,EFM32LG390FX - BGA112,SI8605AC-B-IS1,C8051F370-A-GM,EFM8BB10F2G-A-QFN20,C8051F066,C8051F065,C8051F067,SI2457,SI3452B-B02-GM,SI88243ED-IS,C8051F801-GU,C8051F506-AQ,SI7005-B-GM1,SI2167-C,SI21682-C,SI7022-A20-IM,SI8642AB-B-IS,SI8650ED-B-IS,SI2167-B,SI8719BC-A-IP,TSM9118,SI8631AB-B-IS,TSM9117,SI8234AB-C-IS,TSM9119,SI8234AB-C-IM,EFM32WG390FX - BGA112,SI8620AB-B-IS,SI8719BC-A-IS,SI8631EC-B-IS1,C8051F565-AM,EZR32WG330F64R55G,SI8235AB-C-IS1,C8051F835-GS,SI1132,SI3500-A-GM,TS1102-100,C8051F506-AM,C8051F565-AQ,SL2309NZ,SI8065AA-B-IU,EZR32LG230F64R60G,C8051F551-AM,EZR32LG230F128R60G,EFM32LG980FX - QFP100,SI8640AB-B-IS1,SI8600AD-B-IS,SI8710BC-B-IP,SI8710BC-B-IS,C8051F007,EFM32LG290FX - BGA112,SI8712BD-B-IM,EFM32GG295FX - BGA120,C8051F38C-GQ,SI8244BB-C-IS1,C8051F000,C8051F002,C8051F38C-GM,C8051F001,SI8620EC-B-IS,TS1005,TS1004,C8051F006,TS1003,C8051F005,TS1002,TS1001,C8051F963-B-GM,C8051F504-AQ,EFM8SB10F4G-A-QFN20,C8051F823-GS,EZR32LG230F128R61G,C8051F020,EFM32TG822FX - QFP48,SI8650BC-B-IS1,C8051F388-GQ,EFM32G200FX - QFN32,C8051F537-C-AM,C8051F563-IM,C8051F019,EZR32WG330F256R55G,C8051F018,C8051F563-IQ,C8051F011,SI2401,SI4822,C8051F010,EFM32TG222FX - QFP48,EFM32TG210FX - QFN32,SI4820,C8051F012,C8051F015,SI4826,SI2404,SI4827,C8051F017,SI4824,C8051F016,C8051F504-AM,SI4825,EFM32WG232FX - QFP64,C8051T602-GS,C8051T327-GM,C8051T602-GM,BGM111,EZR32WG330F128R68G,C8051F863-C-GS,SI88244ED-IS,C8051F811-GS,C8051F589-AM,SI8421BD-B-IS,C8051F537-C-AT,EFM32GG395FX - BGA120,C8051F531-C-AT,C8051F854-C-GM,C8051F022,C8051F021,SI4831,C8051F023,SI2415,C8051F854-C-GU,SI4835,SI2417,SI4836,EFM32WG290FX - BGA112,SI2169-C,TS1101-100,SI8455BA-B-IU,C8051F040,C8051F042,C8051F041,EZR32WG330F128R69G,SI8232AB-B-IS1,C8051F344-GQ,SI8662EC-B-IS1,SI4840,SI8452AA-B-IS1,C8051F701-GQ,SI4844,C8051F502-IM,C8051F575-IM,SI88622ED-IS,C8051F502-IQ,CP2201,CP2200,EFM32LG942FX - QFP64,SI8641BB-B-IS,EFM32GG942FX - QFP64,SI8655BB-B-IS1,SI8400AB-B-IS,SI8030AA-B-IU,C8051F587-IM,C8051F206,C8051F587-IQ,EFM32TG840FX - QFN64,SI8460AA-B-IS1,C8051F500-IQ,EZR32WG230F64R61G,C8051F546-IM,C8051F500-IM,EZR32WG330F128R67G,SI8660AB-B-IS1,C8051F827-GS,C8051F988-GU,SI52142,SI52143,SI7050,SI52144,SI7055,SI7054,SI7053,C8051F567-AQ,C8051F590-AM,C8051F567-AM,C8051F988-GM,SI8450BA-B-IS1,SI7023-A20-IM1,SL28EB742,SI8231BD-B-IS,C8051F855-C-GU,EZR32WG230F128R63G,EZR32LG230F64R68G,SI8631BC-B-IS1,C8051F300-GM,SI52111,SI52112,SI8920AD-IS,C8051F855-C-GM,SL28EB740,EFM8SB20F16G-A-QFN24,SI8641BB-B-IS1,C8051F300-GS,EFM8UB10F16G-C-QFN28,C8051F920-GQ,C8051F815-GS,C8051F920-GM,C8051F220,EFM8UB10F16G-C-QFN20,TSM9938F,EZR32LG230F64R67G,C8051F221,C8051T320-GQ,SI8651EC-B-IS1,C8051F226,C8051F862-C-GS,TSM9938H,SI8661BB-B-IS1,EZR32WG230F64R63G,SI8661ED-B-IS,SI8220DD-A-IS,EZR32LG230F64R69G,SI8405AB-A-IS1,C8051F565-IM,EFM8SB10F2G-A-QFN20,C8051F395-A-GM,C8051F565-IQ,SI8641BD-B-IS,EFM32TG232FX - QFP64,C8051F231,SI8661BC-B-IS1,C8051F230,C8051T631-GM,SL2305NZ,SI8441AA-D-IS1,SI8630BD-B-IS,C8051T600-GS,C8051F236,SI8442BA-D-IS1,C8051F580-AQ,C8051T600-GM,C8051F803-GS,C8051F580-AM,TS1103-100,EZR32WG230F128R61G,C8051F996-GM,SI21822,SI8645BT-IS,C8051F302-GM,C8051F996-GU,SI8232AB-B-IS,SI8622BC-B-IS,C8051F302-GS,TS7003,C8051F708-GQ,TS7001,EFM32WG890FX - BGA112,EZR32LG230F64R61G,EZR32WG330F128R63G,SI21662-B,SI8600AC-B-IS,SI21662-C,EZR32WG230F128R60G,EFM32G222FX - QFP48,TSM9938T,C8051F523-C-IM,SI21812,EFM32GG990FX - BGA112,EFM32LG360FX - CSP81,SL23EP09NZ,SI8651BD-B-IS,TSM9938W,C8051F510-IM,C8051F556-IM,SI8422AD-B-IS,SI8232AD-B-IS,C8051F411,C8051F410,C8051F413,SI8405AA-A-IS1,C8051F412,C8051F381-GM,SI8040AA-B-IU,C8051F589-IM,C8051F965-B-GM,SI8461BA-B-IS1,SI8655BA-B-IS,SI8660BA-B-IS1,C8051F381-GQ,C8051T621-GM,C8051F346-GM,EZR32WG230F64R68G,EFM8BB10F8G-A-QSOP24,SI51214,C8051F346-GQ,SI51211,SI51218,SI8655BA-B-IU,SI8662BD-B-IS,SI8630BB-B-IS,EFM8UB20F32G-A-QFP32,SI51219,EZR32LG230F64R63G,EZR32WG330F128R60G,C8051F930-GM,SI8630BB-B-IS1,SI8660BB-B-IS1,C8051F502-AM,C8051F825-GS,EFM8UB11F16G-C-QSOP24,C8051F544-IM,EZR32WG330F128R61G,C8051F34A-GQ,EFM32GG332FX - QFP64,SI7006-A20-IM,C8051F502-AQ,SI2165-D,C8051F544-IQ,C8051F986-GU,C8051F34A-GM,SI21832,WF121,EZR32WG230F64R67G,SI8620BT-IS,C8051F569-AM,SI8642BC-B-IS1,C8051F930-GQ,C8051F986-GM,EFM8UB20F32G-A-QFP48,EZR32LG330F64R55G,EFM32LG380FX - QFP100,SI8630
Silicon Labs（芯科科技） 物联网无线产品选型指南
目录- Company and product overview Bluetooth Modules Bluetooth Modules Overview Bluetooth Modules Bluetooth Low Energy Kits Bluetooth Modules Blue Gecko Wireless Modules Bluetooth Modules Bluetooth Xpress Modules Bluetooth Modules Blue Gecko Wireless SoCs Bluetooth Modules Bluetooth BR/EDR Kits Bluetooth Modules Bluetooth BR/EDR Modules proprietary wireless devices proprietary wireless devices Proprietary Kits Proprietary Wireless Sub-GHz and 2.4 GHz Dual Band Devices Proprietary Wireless Sub-GHz Devices Wi-Fi Modules Wi-Fi Modules Wi-Fi Kits Mighty Gecko Modules Mighty Gecko Modules Mighty Gecko Development Kit Mighty Gecko Modules Mighty Gecko Mesh Networking Wireless SoCs Z-Wave Modules Z-Wave Modules Z-Wave Reference Designs Z-Wave Modules Z-Wave Development Kits
型号- EBWT41U,ZDB5202,SLEXP8027A,EFR32FG13P233F512GM48,EFR32™,SLWSTK6061B,MGM12P,EZR32WG,EFR32FG13P231F512GM32,EFR32BG12P232F1024GM68,EFR32MG13P733F512GM48,EFR32BG13P532F512GM32,WT12,AMW007-E04,EFR32,WT32I,EZR32™,BGM121,BGM11S,WT11U,EFR32FG,EFR32FG14P233F256GM48,SLWSTK6062B,RBK-ZW500DEV-CON2,SLWSTK6120A,SLWSTK6063B,RBK-ZW500,EFR32BG12P132F1024GL125,SI4XXX,ZM5101,ZM5304,ZDB5101,ACC-UZB3-U-BRG,BGM111,EBWT11U,EFR32FG14P233F128GM48,ACC-UZB3-U-STA,MGM111,ZDB5304,SLWSTK6000B,SLWSTK6020B,WT32,SI10XX,SLWSTK6101C,EFR32MG13P632F512GM32,AMW037,EFR32FG12P433F1024GM48,DKWT32I-A,EFR32MG12P132F1024GL125,EFR32MG1P133F256GM48,BGM13S,EZR32HG,BGM13P,BGX13P,EZR32LG,MGM13P,WT41U,EFR32BG13P733F512GM48,BGX13S,SLWSTK6060B,MGM13S,SLWSTK6065B,WGM110,RBK-ZW500DEV-EMB2,EFR32BG12P433F1024GL125,EBWT12-A,ZM5202,AMW007,SLTB004A,EFR32MG14P733F256GM48
小型蓝牙设备：如何在不影响性能和可靠性的情况下最小化尺寸
描述- 本资料由Silicon Labs公司提供，主题为小型蓝牙设备的微型化设计。内容涵盖微型化趋势、设计挑战、解决方案和案例研究。资料强调了SoC集成、低组件数量、电池类型和天线设计的重要性，并介绍了Silicon Labs的小型蓝牙解决方案和参考设计。
型号- BGM220,BG27,BG24,BG22,BGM240,BGM240S,BCM220S,BGM220S,BGM220P
Silicon Labs（芯科科技） Wi-Fi 芯片和模块选型指南
目录- Wi-Fi SoC and Module Selector Guide Wi-Fi Lineup Wi-Fi Development Kits IoT Wi-Fi Technology Leader Wi-Fi Applications Company Profile
型号- SLEXP8022A,SIWX915,RS9116,WF200,SIWX917,RS9116X-DB-EVK1,RS9116X-SB-EVK1,RS9116X-SB-EVK2
长达10年电池寿命的蓝牙SoC EFR32BG22
描述- 本文介绍了Silicon Labs在物联网无线连接领域的领导地位，重点介绍了其EFR32BG22蓝牙SoC，该SoC具有长达10年电池寿命，适用于大批量产品的安全蓝牙5.2 SoC。文章详细阐述了BG22的射频特性、安全性、外围设备、封装选项等，并提供了不同型号的对比。此外，文章还介绍了BG22在蓝牙网状网络、低功耗网络协处理器等应用中的优势，以及Silicon Labs的其他无线解决方案，如Wi-Fi和LoRa。
型号- SLWRB4183A,FG12,FG13,FG14,EFM32,ESP32-S2,BG22C224,BG22C222,DA16200,FG1,CYW43012,SX126X,EFR32FG23,EFR32FG1,BG22,BG21,EFR32BG22,BGM220S,EFR32,RS9116X-SB-EVK1,BGM220P,RS9110,CC3220,FG22,RS9113,BGM220,EFR32XG1X,SLWRB4182A,RS9116,RS9116X-DB-EVK1,EFR32FG,BG22C112,MT 5932,QCA4020,SLWSTK6021A,ESP32,SLTB010A,SX127X,EFR32FG13,EFR32FG12,EFR32FG14
Silicon Labs‘ Breakthrough Ultra-Low Power Wi-Fi 6 and Bluetooth LE 5.4 Modules SiWx917Y Supercharge Device Deployment
Silicon Labs announced the SiWx917Y ultra-low power Wi-Fi® 6 and Bluetooth® Low Energy (LE) 5.4 modules. these modules are designed to help device makers streamline the complex development and certification process for Wi-Fi 6 devices.
Silicon Labs Announces New Bluetooth® Location Services with Advanced Hardware and Software
Silicon Labs announced its new, Bluetooth Location Services solution using accurate, low-power Bluetooth devices to simplify Angle of Arrival (AoA) and Angle of Departure (AoD) location services.
BGM220S 无线 Gecko Bluetooth® 模块数据表
型号- BGM220SC22WGA2,BGM220S,BGM220SC22HNA2,BGM220S12A,BGM220SC12WGA2,BGM220S22A
Will the 2.4 GHz RF Module and the Bluetooth Module Interfere with Each Other?
2.4 GHz rf modules and Bluetooth modules are widely used in IoT application scenarios. These two wireless modules are also found everywhere in our lives, and the working frequency band of Bluetooth modules is also 2.4g. So will the 2.4 GHz rf module and the bluetooth module interfere with each other?
Silicon Labs（芯科科技） Bluetooth®芯片和模块选型指南
目录- Bluetooth® - Rapid Growth in IoT Why the Silicon Labs Bluetooth® Portfolio is Ideal Bluetooth® SoC and Module Selector Guide Bluetooth® Application Examples About Silicon Labs
型号- BGM210P,BGM210L,BG27,BG24,BG22,BGM240S,BG21,BGM220S,BGM240P,BGM220P
8 High-Power Bluetooth LE Modules and Their Applications
Bluetooth Low Energy (BLE) technology is renowned for its low power consumption and ease of use in short-range wireless communication. High-power BLE modules are essential for applications requiring extended range and robust connectivity. They integrate advanced wireless technologies and offer flexible output options, making them ideal for smart homes, industrial automation and more. This article introduces 8 high-power bluetooth LE modules and their applications.
芯科科技物联网无线协议解决方案助力智能牙刷、血糖监测仪及胰岛素泵，实现智能医疗健康设备智能安全设计
本文是Silicon Labs 3D虚拟智能家居网页中针对智能医疗健康设备开发和解决方案的快速导览，主要聚焦三个家庭中常见的健康及生理监测设备－智能牙刷、血糖检测仪和胰岛素泵，并说明如何通过全系列物联网无线协议解决方案和完善的软件开发工具助力工程师实现智能、安全的设计。
电子商城
品牌：SILICON LABS
品类：Wireless Gecko SoC
价格：￥8.1764
现货： 101,879
品牌：SILICON LABS
品类：Mighty Gecko Multi-Protocol Wireless SoC
价格：￥27.0929
现货： 90,767
现货市场
品牌：SILICON LABS
品类：Switch Hall Effect Magnetic Position Sensor
价格：￥2.2924
现货：126,000
服务
Ignion可支持多协议、宽频段的物联网天线方案设计，协议：Wi-Fi、Bluetooth、UWB、Lora、Zigbee、2G、3G、4G、5G、CBRS、GNSS、GSM、LTE-M、NB-IoT等，频段范围：400MHz~10600MHz。
最小起订量： 2500 提交需求>
提供语音芯片、MP3芯片、录音芯片、音频蓝牙芯片等IC定制，语音时长：40秒~3小时（外挂flash），可以外挂TF卡或U盘扩容。
最小起订量： 1pcs 提交需求>
授权代理品牌：集成电路
授权代理品牌：分立元件
授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
我要提问
登录 | 立即注册
提交评论