New Silicon Labs Modules Provide Pre-Certified Wireless Connectivity for A Broad Range of IoT Applications

2020-11-30 Silicon Labs
Bluetooth modules,xGM210PB,BGX220 Xpress,BGM220 Bluetooth modules,xGM210PB,BGX220 Xpress,BGM220 Bluetooth modules,xGM210PB,BGX220 Xpress,BGM220 Bluetooth modules,xGM210PB,BGX220 Xpress,BGM220

-- Choice of Bluetooth, Zigbee, Thread and Multiprotocol modules speed time-to-market by addressing developer pain points with industry-leading security for smart home, building and industrial automation applications --


AUSTIN, Texas – Oct. 28, 2020 – SILICON LABS (NASDAQ: SLAB), a leading provider of silicon, software and solutions for a smarter, more connected world today announced a portfolio expansion of pre-certified wireless modules specifically designed to address modern needs of IoT application development. The portfolio consists of the only modules in the industry with full stack support for multiprotocol solutions to enable commercial and consumer IoT applications, with flexible package options and highly integrated device security.



“Silicon Labs has mastered the challenges that come with adding wireless connectivity to IoT devices,” said Matt Saunders, vice president of IoT marketing and applications at Silicon Labs. “Our new modules offer a simple, effective solution to the complex problem of RF engineering and testing, allowing IoT device makers to quickly get pre-certified and secure wireless devices into the market.” 


Silicon Labs highly integrated modules are available in multiple package options including system-in-package (SiP) and traditional printed circuit board (PCB). SiP modules contain miniaturized components that remove the need for complicated RF design and certification by opening space-constrained IoT designs to module-based solutions. PCB modules enable flexible pin access and additional options to extend RF performance.


Silicon Labs’ new modules include xGM210PB, BGM220, MGM220, and BGX220 Xpress:


  • xGM210PB features Secure Vault, the ARM PSA Level 2 certified state-of-the-art IoT device security, as well as dynamic multiprotocol support for Bluetooth, Zigbee, and OpenThread with robust and supports Wi-Fi coexistence. Optimized for IoT applications, including connected lighting, gateways, voice assistants and smart meter in-home displays, xGM210PB modules offer up to +20dBM output power and better than -104dBm sensitivity.

  • BGM220 is one of the world’s smallest Bluetooth modules and the first to support Bluetooth Direction Finding. The integrated, pre-certified Bluetooth 5.2 module delivers up to ten-year operation on a coin cell battery, ideal for a broad range of Bluetooth LE applications including appliances, asset tags, beacons, portable medical, fitness, and Bluetooth mesh low-power nodes.

  • MGM220 is a low-power, low-cost ideal for eco-friendly, ultra-low-power IoT products including include lighting controls, building and industrial automation sensors. The modules are ideal for Zigbee Green Power and energy harvesting applications.

  • BGX220 Xpress includes an onboard Bluetooth stack, Xpress command interface and pre-programmed cable replacement firmware to deliver a serial to Bluetooth LE solution needing no firmware development. The modules are ideal for industrial applications including human-machine interface (HMI) devices, addressing size, safety, and environmental challenges.


The modules are supported in the free Silicon Labs Simplicity Studio 5, a fully integrated development environment, featuring comprehensive software stacks, application demos and mobile apps, along with premium features, such as network analyzer and patented energy profiler. Customers are also able to further accelerate wireless development by taking advantage of simple APIs from Silicon Labs Xpress modules.


Samples, production quantities and development kits for xGM210PB, BGM220, MGM220 and BGX220 Xpress are available now.

授权代理商:世强先进(深圳)科技股份有限公司
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本文由青莲居士转载自Silicon Labs,原文标题为:New Silicon Labs Modules Provide Pre-Certified Wireless Connectivity for a Broad Range of IoT Applications,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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型号- C8051T604-GS,SI8420AD-A-IS,WF111,SI7007-A20-IM1,SI8035AA-B-IU,C8051T604-GM,C8051F813-GU,SI8642ET-IS,C8051F541-AM,SL16020DC,C8051F813-GM,C8051F587-AM,C8051F044,SI2434,SI4613,C8051F043,SI4614,C8051F046,C8051F045,C8051F587-AQ,SI2435,C8051F047,C8051F541-AQ,TS3001,TS3002,SI2439,TS3003,SI8712CC-B-IP,TS3004,C8051F060,C8051F531-C-IM,TS3006,C8051F062,SI8710AD-B-IS,C8051F061,SI8712CC-B-IS,C8051F064,C8051F063,EFM32LG230FX - QFN64,EZR32WG230F64R69G,EFM32WG880FX - QFP100,EFM32WG980FX - QFP100,SI8233BB-C-IS1,C8051F531-C-IT,SI51210,SI8635BD-B-IS,C8051F975-A-GM,SI8230BB-B-IS1,SI8232BB-B-IS,C8051F394-A-GM,SI4624,C8051T616-GM,SI4622,SI8635BT-IS,C8051F573-IM,SI4629,C8051F530-C-AM,SI8920BD-IS,C8051F530-C-AT,C8051F801-GM,C8051F711-GQ,C8051F585-IM,SI21802,C8051F585-IQ,EFM32LG390FX - BGA112,SI8605AC-B-IS1,C8051F370-A-GM,EFM8BB10F2G-A-QFN20,C8051F066,C8051F065,C8051F067,SI2457,SI3452B-B02-GM,SI88243ED-IS,C8051F801-GU,C8051F506-AQ,SI7005-B-GM1,SI2167-C,SI21682-C,SI7022-A20-IM,SI8642AB-B-IS,SI8650ED-B-IS,SI2167-B,SI8719BC-A-IP,TSM9118,SI8631AB-B-IS,TSM9117,SI8234AB-C-IS,TSM9119,SI8234AB-C-IM,EFM32WG390FX - BGA112,SI8620AB-B-IS,SI8719BC-A-IS,SI8631EC-B-IS1,C8051F565-AM,EZR32WG330F64R55G,SI8235AB-C-IS1,C8051F835-GS,SI1132,SI3500-A-GM,TS1102-100,C8051F506-AM,C8051F565-AQ,SL2309NZ,SI8065AA-B-IU,EZR32LG230F64R60G,C8051F551-AM,EZR32LG230F128R60G,EFM32LG980FX - QFP100,SI8640AB-B-IS1,SI8600AD-B-IS,SI8710BC-B-IP,SI8710BC-B-IS,C8051F007,EFM32LG290FX - BGA112,SI8712BD-B-IM,EFM32GG295FX - BGA120,C8051F38C-GQ,SI8244BB-C-IS1,C8051F000,C8051F002,C8051F38C-GM,C8051F001,SI8620EC-B-IS,TS1005,TS1004,C8051F006,TS1003,C8051F005,TS1002,TS1001,C8051F963-B-GM,C8051F504-AQ,EFM8SB10F4G-A-QFN20,C8051F823-GS,EZR32LG230F128R61G,C8051F020,EFM32TG822FX - QFP48,SI8650BC-B-IS1,C8051F388-GQ,EFM32G200FX - QFN32,C8051F537-C-AM,C8051F563-IM,C8051F019,EZR32WG330F256R55G,C8051F018,C8051F563-IQ,C8051F011,SI2401,SI4822,C8051F010,EFM32TG222FX - QFP48,EFM32TG210FX - QFN32,SI4820,C8051F012,C8051F015,SI4826,SI2404,SI4827,C8051F017,SI4824,C8051F016,C8051F504-AM,SI4825,EFM32WG232FX - QFP64,C8051T602-GS,C8051T327-GM,C8051T602-GM,BGM111,EZR32WG330F128R68G,C8051F863-C-GS,SI88244ED-IS,C8051F811-GS,C8051F589-AM,SI8421BD-B-IS,C8051F537-C-AT,EFM32GG395FX - 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QFP64,C8051F231,SI8661BC-B-IS1,C8051F230,C8051T631-GM,SL2305NZ,SI8441AA-D-IS1,SI8630BD-B-IS,C8051T600-GS,C8051F236,SI8442BA-D-IS1,C8051F580-AQ,C8051T600-GM,C8051F803-GS,C8051F580-AM,TS1103-100,EZR32WG230F128R61G,C8051F996-GM,SI21822,SI8645BT-IS,C8051F302-GM,C8051F996-GU,SI8232AB-B-IS,SI8622BC-B-IS,C8051F302-GS,TS7003,C8051F708-GQ,TS7001,EFM32WG890FX - BGA112,EZR32LG230F64R61G,EZR32WG330F128R63G,SI21662-B,SI8600AC-B-IS,SI21662-C,EZR32WG230F128R60G,EFM32G222FX - QFP48,TSM9938T,C8051F523-C-IM,SI21812,EFM32GG990FX - BGA112,EFM32LG360FX - CSP81,SL23EP09NZ,SI8651BD-B-IS,TSM9938W,C8051F510-IM,C8051F556-IM,SI8422AD-B-IS,SI8232AD-B-IS,C8051F411,C8051F410,C8051F413,SI8405AA-A-IS1,C8051F412,C8051F381-GM,SI8040AA-B-IU,C8051F589-IM,C8051F965-B-GM,SI8461BA-B-IS1,SI8655BA-B-IS,SI8660BA-B-IS1,C8051F381-GQ,C8051T621-GM,C8051F346-GM,EZR32WG230F64R68G,EFM8BB10F8G-A-QSOP24,SI51214,C8051F346-GQ,SI51211,SI51218,SI8655BA-B-IU,SI8662BD-B-IS,SI8630BB-B-IS,EFM8UB20F32G-A-QFP32,SI51219,EZR32LG230F64R63G,EZR32WG330F128R60G,C8051F930-GM,SI8630BB-B-IS1,SI8660BB-B-IS1,C8051F502-AM,C8051F825-GS,EFM8UB11F16G-C-QSOP24,C8051F544-IM,EZR32WG330F128R61G,C8051F34A-GQ,EFM32GG332FX - QFP64,SI7006-A20-IM,C8051F502-AQ,SI2165-D,C8051F544-IQ,C8051F986-GU,C8051F34A-GM,SI21832,WF121,EZR32WG230F64R67G,SI8620BT-IS,C8051F569-AM,SI8642BC-B-IS1,C8051F930-GQ,C8051F986-GM,EFM8UB20F32G-A-QFP48,EZR32LG330F64R55G,EFM32LG380FX - QFP100,SI8630

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物联网天线方案设计/虚拟天线芯片方案设计

Ignion可支持多协议、宽频段的物联网天线方案设计,协议:Wi-Fi、Bluetooth、UWB、Lora、Zigbee、2G、3G、4G、5G、CBRS、GNSS、GSM、LTE-M、NB-IoT等,频段范围:400MHz~10600MHz。

最小起订量: 2500 提交需求>

语音/录音芯片定制

提供语音芯片、MP3芯片、录音芯片、音频蓝牙芯片等IC定制,语音时长:40秒~3小时(外挂flash),可以外挂TF卡或U盘扩容。

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