【产品】采用无焊接弹簧触点技术的PIM (CIB)拓扑功率模块,击穿电压高达1200V
VINCOTECH(威科)是全球领先的电力电子模块(IGBT模块)解决方案的供应商,80-M112PMA010M7-K209A70和80-M112PMA015M7-K200A70是Vincotech公司推出的两款采用MiniSKiiP® 1封装、PIM (CIB)拓扑的功率模块,属于MiniSKiiP® PIM 1产品线,广泛适用于工业驱动应用中。
图1 80-M112PMA010M7-K209A70和80-M112PMA015M7-K200A70 PIM (CIB)拓扑功率模块封装外形图
80-M112PMA010M7-K209A70和80-M112PMA015M7-K200A70 PIM (CIB)拓扑功率模块的击穿电压高达1200V,在极端的高电压工作环境下也不会造成器件损坏,其电流额定值分别为10A和15A;整流器二极管的峰值重复反向电压达1600V,连续正向电流为35A;逆变器开关的集电极-发射极电压为1200V,集电极电流分别为14A和21A。模块存储温度范围为-40℃到125℃,在开关条件下的工作温度范围为-40℃到(Tjmax-25)℃,其中,Tjmax为模块内部各组件最大结温的最小值,这两款模块为150℃。
这两款功率模块采用的拓扑结构为PIM(CIB),即转换器+制动器+逆变器(CIB)结构,十分适合工业驱动应用;还具有开路发射极配置,极大地改善了开关切换性能;内置的温度传感器和正温度系数热敏电阻(PTC)为温度监测电路的设计带来了便利。
图2 80-M112PMA010M7-K209A70和80-M112PMA015M7-K200A70 PIM (CIB)拓扑功率模块拓扑结构图
80-M112PMA010M7-K209A70和80-M112PMA015M7-K200A70采用了MiniSKiiP® 1封装,器件尺寸为42mm x 40mm x 16mm。MiniSKiiP® 1封装使用了无焊接弹簧触点技术,无需特殊工具,只需一颗螺丝以及一个安装步骤便可轻松完成组装,实现了灵活的PCB设计,坚固的弹簧触点进一步提高了可靠性。这两款功率模块还采用了三菱最新一代的芯片技术—IGBT M7,为其带来了易于并联,低关断损耗,低集电极-发射极饱和电压,正温度系数,短尾电流等优势,并进一步改善其EMC行为。
80-M112PMA010M7-K209A70和80-M112PMA015M7-K200A70 PIM (CIB)拓扑功率模块产品特性:
·采用MiniSKiiP® 1封装,无焊接弹簧触点技术
·PIM (CIB)拓扑
·击穿电压高达1200V
·存储温度范围为-40℃到125℃
·开关条件下的工作温度范围为-40℃到(Tjmax-25)℃
·开路发射极配置
·内置的温度传感器和PTC
·IGBT M7芯片技术
80-M112PMA010M7-K209A70和80-M112PMA015M7-K200A70 PIM (CIB)拓扑功率模块应用领域:
·工业驱动应用
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