InvenSense Announces World’s First TDM Microphone with an Array of 16 Devices on a Single Bus

2023-07-02 TDK InvenSense News

SAN JOSE, Calif. & SHANGHAI–(BUSINESS WIRE)–May 10, 2016– InvenSense, a leading provider of MEMS sensor platforms, today announced the world's first Time Division Multiplexed MEMS microphone (TDM MEMS microphone) that can support up to 16 microphones on one bus. With the proliferation of connected devices where the main means of communication is far-field voice communication, having an array of microphones that can pick up the user's voice from any direction is key to their success. These microphone arrays allow the device to form a narrow audio band to pick up the user's command in its direction while effectively ignoring the noise from every other direction making reliable communication possible. Up to now, device makers had to pick from microphones with interfaces that supported no more than two on a bus leading to complex and expensive solutions for an array of microphones. InvenSense's ICS-52000 is a low-noise microphone that allows a microphone array to connect directly to digital processors without the need for audio converters in the system. All microphones in the array are able to synchronize their acoustic capture enabling precise audio processing.


There are a growing number of applications that require multiple microphones to support reliable voice recognition in the IoT market, home automation, audio and video conferencing, and drones. The ICS-52000 addresses the challenges of interfacing microphone arrays by simplifying system design and significantly reducing overall system cost.


"Far-field voice recognition has become a critical feature in the IoT market and AR/VR applications that need to have wrap-around audio processing. The ICS-52000 compliments our market-leading high-performance microphone portfolio by addressing the specific needs of these markets," said Eitan Medina, vice president of marketing and product management at InvenSense. "InvenSense patented microphone array architecture based on standard TDM interface enables efficient and elegant industrial designs."


InvenSense's ICS-52000 TDM microphone is sampling now and will be in mass production in 3Q this year. The product is packaged in a standard bottom port configuration. 

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本文由ChangeArmy转载自TDK InvenSense News,原文标题为:InvenSense Announces World’s First TDM Microphone With an Array of 16 Devices on a Single Bus,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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