Parker Releases High-Flow Thermal Gel THERM-A-GAP™ GEL 60HF Offering Flow Rates of up to 100g/min for High-Volume Applications

时间： 2023-06-30 来源：PARKER CHOMERICS News

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High Wycombe, Bucks, UK, 7th June 2023 – The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, is unveiling a new thermal interface gel that is ideal for all manufacturers faced with meeting the challenges of high-throughput production. Providing flow rates of up to 100g/min, the new THERM-A-GAP™ GEL 60HF (‘High Flow’) thermal gel is perfect for companies manufacturing consumer electronics, telecommunications equipment, energy storage devices, power supplies and semiconductors, automotive control units, and sensors, and computing components such as CPUs and GPUs.

Parker has optimized this fully cured gel for automated dispensing at various packaging sizes while retaining properties for easy rework and field repair situations. The paste-like consistency of THERM-A-GAP™ GEL 60HF also enables very tightly controlled dispensing and accurate material placement during assembly. Notably, the product requires low compressive force to deflect under assembly pressure, minimizing stress on components, soldered joints, and PCB leads.

Despite its high flow rate attributes (far in excess of other products in this materials family), THERM-A-GAP™ GEL 60HF offers no compromise in performance with superior, long-term thermal stability and reliability assured for all users. A thermal conductivity of 6.2 W/m-K facilitates optimal heat transfer from electronic components to cooling features.

For convenience, users can store and transport this single-component gel at room temperature, while an additional benefit includes no post-cure requirements, further assisting manufacturers with high-throughput production demands.

“For example, mobile phone manufacturers with short takt times can achieve flow rates of up to 100g/min alongside good wetting-out properties that adhere well to the substrate in support of fast dwell times,” explains Ben Nudelman, global market manager, Chomerics Division.

“Throughput of several hundred pieces per hour is possible with THERM-A-GAP™ GEL 60HF, depending on the specific application. Furthermore, with low deflection force, there is no chance of the product causing PCB distortion.”

As a final point of note, Parker can optimize the THERM-A-GAP™ GEL 60HF package to suit any existing dispensing equipment.

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2022-07-14 - 器件选型代理服务技术支持采购服务

Therm-A-Gap™Gel 35VT可靠性报告（TR 58940）

THERM-A-GAP™ GEL 35VT是一种单组分、可涂抹的热界面凝胶材料，具有3.5 W/m-K的热导率。该材料旨在将电子设备的热量传导至散热器或外壳，并在垂直、高振动和恶劣环境中可靠工作。报告详细介绍了GEL 35VT在长期环境老化（干热、热湿和温度循环）下的热可靠性测试结果，显示其热阻抗在老化后没有显著增加，表明其热性能保持稳定。此外，报告还提供了GEL 35VT在汽车测试环境中的热阻抗变化数据，证明其在热冲击、温度循环和振动测试条件下表现出优异的热稳定性。

PARKER CHOMERICS - HIGH-PERFORMANCE THERMAL GEL,ONE-COMPONENT, DISPENSABLE THERMAL INTERFACE GEL MATERIAL,高性能热凝胶,单组分可分配热界面凝胶材料,THERM-A-GAP GEL 35VT,THERM-A-GAP™ GEL 35VT,AUTOMOTIVE APPLICATIONS,汽车应用

May 2023 - 测试报告代理服务技术支持采购服务查看更多版本

Parker Chomerics（派克固美丽）热界面材料（热传导性凝胶/在位灌封材料/润滑脂）选型指南

Company Profile Overview of Dispensable Materials Material Selection Equipment Types Technical Parameters Packaging Options

PARKER CHOMERICS - 现场固化灌封化合物,GELS,ELECTRONIC APPLICATION,UNDERFILL MATERIALS,导热凝胶,DISPENSABLE, VERY LOW COMPRESSION FORCE, THERMAL GAP FILLERS,THERMAL GREASES,THERM-A-GAP™ GELS,CURE-IN-PLACE POTTING COMPOUNDS,热接口材料,热润滑脂,TIM,THERMALLY CONDUCTIVE GELS,THERMAL INTERFACE MATERIAL,POTTING MATERIALS,T636,T647,T635,T646,CIP 35,GEL 30,T642,TC 50,GEL 25NS,1642,1641,GEL 8010,T630,GEL 75,T650,GEL 45,T660,T670,GEL 37,HIGH-VOLUME AUTOMATED DISPENSING SYSTEMS,配药设备,制动控制,CONSUMER ELECTRONICS,消费电子,POWER DRIVERS,MEMORY MODULES,功率半导体,TELEVISIONS,移动服务器,DC/DC CONVERTERS,DC/DC转换器,LED模块,欧洲货币单位,MICROPROCESSORS,电信基站,不间断电源,TELECOM BASE STATION,POWER CONVERSION EQUIPMENT,TELECOM BASE STATIONS,AUTOMOTIVE ELECTRONIC CONTROL UNIT,DISPENSING EQUIPMENT,ENGINE,AUTOMOTIVE ELECTRONIC CONTROL UNITS,MOBILE SERVERS,微处理器,POWER SUPPLIES,BRAKING CONTROLS,MOSFET ARRAYS,发动机,牵引力控制,UNINTERRUPTABLE POWER SUPPLIES,功率转换设备,TRACTION CONTROLS,电视和电子产品,金属氧化物半导体场效应晶体管阵列,功率驱动器,POWER SEMICONDUCTORS,汽车电子控制单元,DESKTOPS,电源,ECU,高容量自动分配系统,TELEVISIONS ELECTRONICS,内存模块,台式机,LED MODULES

May 2021 - 选型指南代理服务技术支持采购服务

On the Cutting Edge: How Parker Chomerics Helps SpaceX Soar

Chomerics, part of Parker Hannifin’s Engineered Materials Group, has been a top supplier to SpaceX since its founding in 2002. From aerospace solutions to the SpaceX Crew Dragon Capsule, Chomerics’ materials are an integral part of many SpaceX innovations.

2023-11-03 - 原厂动态代理服务技术支持采购服务

导热凝胶系列[导热填隙材料]数据表

本资料介绍了HFC公司生产的单组分导热凝胶，这是一种具有高导热性和低热阻的热界面材料。该材料具有良好的机械性能，适用于多种电子产品的散热解决方案。

鸿富诚 - THERMAL GAP FILLER,THERMAL INTERFACE MATERIAL,THERMALLY CONDUCTIVE GEL,热接口材料,导热凝胶,热间隙填料,HTG-300,HTG-500,SEMICONDUCTORS,POWER BASE,热电冷却装置,半导体,CPU,中央处理器,功率电阻器,POWER RESISTOR,THERMOELECTRIC COOLING DEVICES,GPU,权力基础,ASSEMBLY SURFACE,温度调节器,散热器,TEMPERATURE REGULATOR,装配表面,RADIATORS

2024/07/19 - 数据手册代理服务技术支持采购服务

Therm-A-Gap™凝胶25NS高性能完全固化可分配凝胶

Parker Chomerics THERM-A-GAP GEL 25NS是一种单组分、可涂抹的热界面材料，具有2.5 W/m-K的热导率。该非硅凝胶适用于需要防止硅胶污染且无需混合或固化的应用场景。它具有良好的热传导性能，低压缩力变形，适合高性能电子产品和高精度自动点胶机、返工和现场维修等情况。

PARKER CHOMERICS - 非硅酮热凝胶,FULLY CURED DISPENSABLE GEL,完全固化的可点胶的凝胶,NON-SILICONE THERMAL GEL,65-00-GEL25NS-0180-M,65-00-GEL25NS-9KG-M,65-00-GEL25NS-0610-M,THERM-A-GAP™,GEL 25NS,65-00-GEL25NS-0030-M,65-00-GEL25NS-0055-M,65-00-GEL25NS-0300-M,65-00-GEL25NS-0010-M,微处理器,电源模块,POWER SUPPLIES,CENTRAL PROCESSING UNITS (CPUS),半导体,MEMORY,POWER MODULES,SEMICONDUCTORS,AUTOMATED DISPENSING MACHINES,MICROPROCESSORS,电源,电信基站,内存,TELECOM BASE STATIONS,自动点胶机,中央处理器（CPU）

June 2020 - 数据手册代理服务技术支持采购服务