【选型】T500导热绝缘垫片助力新能源汽车驱动解决散热问题

时间： 2020-02-26 来源：世强

技术问答

新能源汽车具有环保、节约、简单三大优势，越来越受到人们的欢迎。新能源汽车的性能主要取决于核心部件动力电池、电驱动桥以及电控系统，也就是我们常说的三电系统。其中电驱动桥主要由电机、电驱变速器以及逆变器三大核心部件组成，除此之外还有针对逆变器和电机的散热部件以及变速器的润滑部件等。

图1 电驱控制器

通常新能源汽车的电机通过功率驱动模块进行驱动控制，功率驱动模块包括布置于PCB板并构成三相逆变器上桥臂和下桥臂的功率MOS管，当上桥臂或下桥臂的单个功率MOS管的电源或耗散功率不满足设计需求时就需将多个功率MOS管并联连接，以提高其功率性能。但是MOS管通常工作过程中发热功率变化非常大，会产生大量热量，以至于出现温漂导致带载不稳现象，如果不能及时将热量传导出去，MOS将非常容易发生故障或是被烧坏，就会使得整个电驱损坏。所以非常需要一款好的绝缘材料来对MOS管进行散热处理。

图2 驱动电路板

有些新能源汽车驱动器的MOS散热对散热材料的要求是：

·绝缘强度≥4KVac；

·厚度≤0.3mm；

·导热系数≥2.0W/mK；

·具备优异的机械强度和抗穿刺性能；

·符合UL94标准中V0阻燃等级。

针对上述要求，固美丽 CHO-THERM® T500 导热绝缘垫片非常适合给驱动器的MOS散热，CHO-THERM® T500专用于需要尽可能高的热、电介质和机械性能的场合。其通过玻璃纤维布增强，能够有效防止撕裂、穿透和穿孔。此外，这款产品可以是模切或片状形状，并可根据用户的需求在绝缘垫的一侧或两侧添加丙烯酸粘合剂层（带PSA）。CHO-THERM®T500导热绝缘垫在多种应用领域拥有数十年的成功记录。

CHO-THERM®T500导热绝缘垫的主要特点：

• 出色的热性能，导热系数达到2.1W/mK

• 高绝缘性能，绝缘强度达4KVac

• 采用玻纤增强，具有优异的机械强度和抗穿刺性

• 每片产品的绝缘性能都得到验证

• 可提供带丙烯酸PSA附件的产品

• UL认可的可燃性等级

• 符合RoHS规范

• 满足极低的NASA排气标准

• 经过数十年的严苛军事和航空航天应用证明

图3 CHO-THERM® T500数据手册

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6308,30-03-2075-XXXXX,CHO-SEAL 6307,20-01-5145-1239,10-05-6394-XXXX-40,20-02-6531-1212,10-04-1720-XXXX,19-07-L463-XXXX,40-TA-1015-6330,19-26-5541-0650,19-04-23086-XXXX,19-05-C128-XXXX,20-11-5035-1239,10-02-2736-XXXXX,30-02-2052-XXXX,19-09-28323-XXXX,46-TA-1020-90XX,19-09-22539-XXXX,19-07-12877-XXXX,20-03-6645-1212,10-07-4523-XXXX,19-04-11651-XXXX,19-09-24030-XXXX,19-05-L547-XXXX,19-04-14537-XXXX,19-09-25853-XXXX,10-04-1687-6503,10-00-1360-XXXXX,20-03-6685-1212*,40-T0-1015-V6433,20-03-3561-1212,19-04-20072-XXXX,19-07-M327-XXXX,10-00-2071-XXXXX,19-26-5538-0650,20-01-5055-1239**,20-02-6530-1212,19-08-E622-XXXX,19-09-F676-XXXX,10-04-W267-XXXX,19-09-19022-XXXX,19-04-22533-XXXX,20-03-L767-1212,19-09-24063-XXXX,19-09-17428-XXXX,10-05-1499-XXXX-40,10-04-3560-XXXX,30-02-2057-XXXXX,19-04-13564-XXXX,19-09-M942-XXXX,19-04-12792-XXXX,20-11-1683-1239,19-05-14960-XXXX,19-09-14377-XXXX,10-05-8635-XXXX,40-TA-1010-6460,30-02-ZZZZ-XXXXX,40-T0-1010-V6433,CHO-SEAL 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应用方案发布时间 : 2019-11-23

导热率达1~7W/mk的Parker Chomerics（派克固美丽）导热界面材料，最快交期4周

Parker Chomerics（派克固美丽）可提供多种功用和规格可选的优质的导热界面材料，如导热凝胶，导热垫片，相变材料，导热绝缘垫，导热硅脂等，导热率达1~7W/mk，厚度为0.5-5mm，最快交期4周，具有高导热，低热阻的特性。

原厂动态发布时间 : 2019-08-27

Thermal Interface Materials

型号- 9025,WIN-SHIELD G,CHO-TOUCH™,CHO-STRAP®,9005,CHO-SEAL®,HO-MUTE 9025,T-WING®,CHO-MUTE®,CHO-MASK®,THERM-A-GAP™ GELS,SPRING-LINE®,DURALAN™,CHO-BOND®,THERM-A-GAP™,WIN-SHIELD®,CHO-SORB®,STREAMSHIELD OMNI-CELL® SHIELD-CELL,DURALAN G XL,THERM-A-FORM™,MESH STRIP,CHO-THERM®,THERMFLOW®,CHO-SHRINK®,DURALAN G,THERMATTACH®,CHO-FAB,METALASTIC®,PREMIER™,CHO-FOIL®,SHIELD WRAP,SOFT-SHIELD®,CHO-LUBE,CHO-FORM®,POLA®,TECKFILM™,CHO-MUTE 9005,CHO-SHIELD®

商品及供应商介绍 - PARKER CHOMERICS - 2019-08 PDF 英文下载

【经验】陶瓷片VS导热垫片用于变频器中IGBT热处理的成本、性能优劣势对比分析

陶瓷垫片在变频器中IGBT上应用非常广泛，主要原因其具备25W/m-k的导热系数，感觉应用起来，导热性能应该非常优秀，另外很多很多应用还必须要求绝缘，陶瓷的绝缘强度约10~12KV/mm，参数上综合分析，陶瓷垫片是满足IGBT导热应用的绝佳选择。然而事实并非如此，陶瓷垫片硬和脆的特点带来了实际操作中的不便。本文通过综合对比导热垫片MCS30GL和陶瓷垫片在该应用的优劣，为你提供更多选择。

设计经验发布时间 : 2019-11-01

OCDT2.E140244 - Miscellaneous Insulating, Ceramic, Metallic and Conducting Materials - Component UL Product iQ

型号- MCS12,5541,G570,4850,T500,SS3500,HCS35,G974,G579,A580,T474,77-1A,T-WING,XTS-900,HCS40,S6305E,5550,4220,A474,G569,SS4850,400,T647G,1122V,6372,5560,T647,T404,T646,T405,1000,HC-FIP-C,CHO-VER,6371,6370,CIP110,GEL 45,T491,CIP35,SS7000-1,T636,4000,SS3500M,4002,G580,GEL 30,4003,THERM-A-GAPTM PAD 30,TC50,CJ-021,T-725,CJ-022,SS5000,1750-2250,5568,3700,GEL 37,579KT,6310,T705,CIP210,77-0,SS3500-1F,4800,4008,77-1,4009,FIP-C,6309,30V0,T405-R,T418,L-1971,SS3500-1E,T777,SS3500-1D,T414,SS3500-1C,T654,T411,THERM-A-GAPTM GEL75,SS3500-1B,1671,1273,T-630,A274,SS4010,1661,GEL 8010,GREEN-1B,T386,GEL AB,6571,6570,HCS10,5000,THERM-A-GAPTM PAD 60,CRS,MCS30,A569,S6304M,G515RFA,T609,T410-R,4800-2,4800-1,5519,1556,SS3700A,574,1674,1673,1310,976,5513,T174,5515,TPI-130,F174,A579,T-379,CL-336,F574,A574,1688,A174,A570,3500,1684,T441,S6305

测试报告 - PARKER CHOMERICS - 2021-09-30 PDF 英文下载

【应用】高导热系数、高绝缘电压的导热垫片MCS30在EPS/变频器IGBT上的应用

Parker Chomerics公司推出的MCS30高性能导热垫片，具有硬度超小、导热系数高、压缩比例大、绝缘电压高等特点。在EPS、变频器等应用中，IGBT器件既需要较高的导热性能，又需要较高的绝缘电压，传统的方式是使用陶瓷垫片，外加涂抹导热硅脂，达到较好绝缘与导热性能，但该方式存在陶瓷垫片易碎、工艺复杂、人力成本高等问题。而使用MCS30可以较好的解决上述问题。

应用方案发布时间 : 2019-08-01