【应用】无需使用底漆、高导电性镀银铝片填充的双组分导电聚硫醚密封胶，可用作圆角或间隙填充填缝材料

时间： 2019-03-27 来源：Parker Chomerics

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导电聚硫醚密封胶,双组分导电聚硫醚密封胶,导电密封胶,CHO-BOND 1019

PARKER CHOMERICS推出的CHO-BOND 1019是一款广泛用作防御掩体和电子元件外壳的互连接缝中的圆角或间隙填充填缝材料。 CHO-BOND 1019是一种高导电性镀银铝片填充的双组分导电聚硫醚密封胶。 CHO-BOND 1019的优点是可涂敷 - 在涂敷前无需使用额外的底漆。对于CHO-BOND 1019挑战在于连续使用温度为-62 ~160 ℃（-80~320 °F），并且典型的粉末涂料涂敷工艺在此过程中超过该温度至375 °F的高温保持45分钟。

设计要求

CHO-BOND 1019通常直接应用于金属表面上的外壳或涂层转换工艺之后。使用CHO-BOND 1019并等待建议的最短3天固化时间之后，材料才能被涂上。即使在涂敷后材料也将继续固化，并且在室温下一周内将完全固化。

该粉末涂料是一种自由流动的干粉形式涂料。常规液体涂料和粉末涂料之间的主要区别在于粉末涂料不需要溶剂来使粘合剂和填料部分保持液体悬浮液形式。涂层通常施加静电，然后加热固化以使其流动并形成“skin”。固化温度通常达到375°F，超过CHO-BOND 1019的连续使用温度55°F，但是时间短仅为45分钟。

主要特点

CHO-BOND 1019的一些主要功能如下：

•CHO-BOND 1019的银铝填料在应用于铝基材时具有优异的耐腐蚀性。

•CHO-BOND 1019的定制配方聚硫醚聚合物体系是可涂敷的 - 在涂敷前省去了额外底漆施工步骤的时间和成本。

•CHO-BOND 1019可在24小时内固化，并提供坚固的导电和环境密封。

•CHO-BOND 1019通过高热，高湿度和盐雾等恶劣条件下的1A级六价铬IAW MIL-DTL-5541 I型和3级三价II型认证，可保持稳定的EMI屏蔽性能。

•外涂层附着力已通过MIL PRF-23377 II型，N级和MIL-DTL-53022 II型环氧底漆认证。

•CHO-BOND 1019可用于0.010英寸{0.25mm}推荐的极薄粘合层，最大厚度为0.250英寸{6.35mm}。

结论

Parker Chomerics最近对CHO-BOND 1019进行了测试。将该材料涂在铝基材上，并在完全固化后放入保温箱中。将温度室升温至357°F的温度保持45分钟。从保温箱中取出样品后，测试样品的电气和机械性能，如下表所示。

在375°F下将材料热老化45分钟后，CHO-BOND 1019没有显示出机械或电性能的显着弱化。

解决方案

Parker Chomerics 推出的CHO-BOND 1019是使用粉末涂层工艺进行涂装后，在遮蔽物或外壳上进行密封的绝佳选择。遮蔽物或外壳将具有卓越的耐腐蚀性，0.01 Ohmcm的体积电阻率和300MHz~18GHz频率下大于80dB的屏蔽效能。

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本文由Adward翻译自Parker Chomerics，版权归世强硬创平台所有，非经授权，任何媒体、网站或个人不得转载，授权转载时须注明“来源：世强硬创平台”。

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CALM Lv4. 资深工程师 2021-02-22

价格怎么样呢？

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欧盟REACH条款SVHC声明OSHA条款安全数据表

型号- CHO-BOND 1024,THERM-A-GAP T274,CHO-BOND 1027,CHO-MUTE 9020,THERMFLOW T766,CHO-MUTE 9025,CIP 210,CHO-BOND 1019,SOFT-SHIELD 2000,CEL-XX-5103-XXXX,THERM-A-GAP 976,THERM-A-GAP 974,THERM-A-GAP A569,CON-SIL A,THERMFLOW T777,THERM-A-GAP F574,CHO-SHIELD 596,CHO-THERM T500,CHO-BOND 360,THERM-A-GAP HCS,THERM-A-GAP A579,THERM-A-GAP A574,THERM-A-GAP T174,THERM-A-GAP A570,PREMIER AB140FR,FPCV-14244,FPCV-13701,CHO-BOND 592,THERM-A-GAP 579PT,CHO-BOND 1035,THERM-A-GAP TPS60,CHO-SEAL V6433,CHO-SEAL 1290,THERM-A-GAP 579PB,CHO-BOND 1030,THERM-A-GAP G570,THERM-A-GAP A580,THERM-A-GAP T579,CL-130,THERM-A-GAP G569,CHO-BOND 584,SOFT-SHIELD 1000,CHO-BOND 1029,72-08116,THERM-A-GAP T630,CHO-BOND 1067,CHO-BOND 1069,CHO-THERM 1661,CHO-SEAL L6303,THERM-A-GAP T636,THERM-A-GAP T635,THERM-A-GAP G580,THERMATTACH T491,CHO-SEAL 1285,CONSIL NC,CHO-SEAL 0860,THERM-A-GAP G574,CHO-SEAL 0862,THERM-A-GAP G579,THERM-A-FORM 1642,THERM-A-FORM 1641,THERM-A FORM T644,CIP 250,THERM-A-GAP GEL30,CHO-THERM 1679,CHO-BOND 1056,THERMAL GREASE T650,CHO-BOND 1055,CHO-THERM 1677,CHO-THERM 1678,CHO-THERM 1674,CHO-THERM 1671,CHO-BOND 1053,THERM-A-GAP 569PT,CHO-FAB CFT,CHO-LUBE 4220,CHO-FORM 5513,SOFT-SHIELD 4850,CHO-FORM 6600,CHO-FORM 5515,THERM-A-GAP T652,CHO-THERM T290,THERM-A-GAP 569PB,CHO-THERM 1684,THERM-A-GAP TPS60G,CHO-MUTE 9000,CHO-THERM 1680,CHO-SHIELD 610,CHO-BOND 1086,CHO-THERM T609,THERM-A-GAP T654,CIP 110,CHO-SHIELD 4076,THERM-A-GAP T630G,CJ-022-26,CHO-SHIELD 608,THERMFLOW T310,PREMIER APEI-140,CHO-BOND 1076,CHO-BOND 2165,THERMAL GREASE T670,SOFT-SHIELD 5000,CHO-SHIELD 604,THERMFLOW T557,CHO-BOND 1073,CHO-BOND 1072,THERMFLOW T558,PREMIER A240-FRHF,CHO-MUTE 9005,THERM-A-GAP 579KT,CHO-SEAL S6600,SOFT-SHIELD 3500,CHO-SEAL 6370,THERM-A-GAP A274,CHO-SEAL 6372,THERM-A-GAP F174,FPCV-13444,CHO-SEAL 1356,CHO-SEAL 1236,CHO-FORM 5541,THERM-A-GAP 579,CHO-SHIELD 2002,CHO-FAB CRS,CHO-BOND 1091,THERM-A-GAP TS15,THERM-A-GAP T569,THERM-A-GAP G274,CHO-SEAL 1221,PRIMER 1083,CHO-FORM 5550,PRIMER 1088,PRIMER 1085,CHO-THERM 1646,CHO BOND 4660,CHO-FORM 5506 FIP-C,CHO-FORM 5519,THERM-A-GAP T574,THERM-A-GAP GEL45,THERM-A-GAP T570,XTS8010,THERM-A-GAP A174,THERM-A-GAP T579,TC60,CHO-SEAL 1212,SOFT-SHIELD 4008,SOFT-SHIELD 4800,THERMFLOW PC07DM-7,CHO-SEAL 1217,SOFT-SHIELD 4002,SABIC C6200,SOFT-SHIELD 4000,CHO-FORM 5528,CHO-FORM 5526,SOFT-SHIELD 4004,THERM-A-FORM CIP35,THERM-A-GAP T580,THERM-A-GAP G515 RFA,CHO-SEAL 6460,TC50,THERM-A-GAP G174,PREMIER A220,SOFT-SHIELD 3700,PREMIER A225,R4013-24-C,THERMATTACH T410,THERMATTACH T411,CHO-SEAL 6452,THERM-A-FORM T646,CHO-SEAL 6330,THERMFLOW T725,XTS8030,CHO-MASK II CMT,THERM-A-FORM T647,PREMIER A230,THERM-A-FORM T642,PREMIER A235,CHO-BOND 4669,THERM-A-GAP G974,THERMATTACH T414,THERM-A-GAP 575NS,THERMATTACH T412,THERMATTACH T413,THERMATTACH T418,THERM-A-FORM T644G,CHO-FOIL CCK,CHO-FOIL CCJ,CHO-JAC,PARPHORM 1945,THERM-A-GAP GELAB,CHO-SHIELD 2044,CHO-FOIL CCD,CHO-SHIELD 4900,CHO-FOIL CCH,CHO-FOIL CCE,CHO-SEAL 6435,PREMIER A240,CIP 300,THERMATTACH T404,CHO-SEAL S6304,THERMATTACH T405,CHO-BOND 1121,TW10,CHO-SHIELD 2056,CHO-SHIELD 4914,CHO-SHIELD 4916,CHO-SEAL 6313,CHO-FORM 5560,CHO-SEAL 6307,PRIMER 1099,CHO-SHIELD 2052,THERM-A-GAP A515 RFA,PARPHORM 1800,THERMFLOW T710,CHO-FOIL CAD,CHO-SHIELD 571,PREMIER A240EC,TPS60G,CHO-SEAL 1401,CHO-THERM T441,CHO-THERM T444,THERMATTACH T428,CHO-SHIELD 1091

4/3/20 - PARKER CHOMERICS - 测试报告代理服务技术支持批量订货

派克固美丽新型双组分导电聚硫醚密封胶CHO-BOND 1018，工温范围-62~+160℃，具有出色的耐腐蚀性

全球运动和控制技术领导者派克汉尼汾公司的Chomerics部门发布了CHO-BOND 1018，这是一种双组分导电聚硫醚密封胶，用作圆角，用于当今先进电子系统的高水平EMI/RFI屏蔽的填缝剂或接缝密封剂。该产品的镍铝填料对MIL-DTL-5541 I型和II 型涂层铝基材具有出色的耐腐蚀性。

2023-04-28 - 新产品代理服务技术支持批量订货

CHO-BOND®1018和CHO-BOND®1019应用指南

型号- 50-01-1018-0000,CHO-BOND 1018,CHO-BOND 1019,50-01-1019-0000,CHO-BOND® 1019,50-02-1018-0000,CHO-BOND® 1018

May 2023 - PARKER CHOMERICS - 应用及方案代理服务技术支持批量订货

CHO-BOND®1018和CHO-BOND®1019油漆和粉末涂料说明

型号- 50-01-1018-0000,CHO-BOND 1018,CHO-BOND 1019,50-01-1019-0000,CHO-BOND® 1019,50-02-1018-0000,CHO-BOND® 1018

May 2023 - PARKER CHOMERICS - 应用及方案代理服务技术支持批量订货

PRO-SHIELD®7001单组分导电镍铝硅密封胶

描述- PRO-SHIELD® 7001是一种单组分导电镍铝合金硅橡胶密封剂，适用于电磁屏蔽。该产品具有优异的电导率和耐盐雾腐蚀性，可在多种温度下提供良好的导电和环境密封性能。

型号- PRO-SHIELD 7001,PRO-SHIELD® 7001,90-05-7024-0000,90-01-7024-0000

2019/3/23 - PARKER CHOMERICS - 数据手册代理服务技术支持批量订货

Parker Chomerics特种材料产品保质期数据

型号- CHO-SHIELD 571,CHO-BOND 580-208,CHO-SHIELD 4994,TECKNIT 0005,TECKNIT 0002,CHO-SHIELD 2056,CHO-SHIELD 596,CHO-BOND 360-20,CHO-BOND 1029,CHO-LUBE 4220,CHO-BOND 2165,CHO-SHIELD 608,CHO-BOND 1077,CHO-BOND 1035,TECKNIT 8116,CHO-BOND 1016,CHO-BOND 1038,CHO-BOND 4669,CHO-BOND 592,CHO-SHIELD 568,CHO-SHIELD 604,CHO-BOND 1030,CHO-BOND 4660,CHO-BOND 1075,CHO-SHIELD 2002,CHO-SHIELD 2003,CHO-SHIELD 2044,CHO-SHIELD 2001,CHO-BOND 1019,CHO-BOND 1121,CHO-SHIELD 2040,CHO-SHIELD 579,CHO-SHIELD 610,CHO-SHIELD 576,CHO-BOND 584-29,CHO-SHIELD 1091,CHO-BOND 1085,CHO-BOND 584-208,CHO-BOND 1086

2021-04 - PARKER CHOMERICS - 技术文档代理服务技术支持批量订货

【产品】填充镀银铜片的导电密封胶PRO-SHIELD®7024，适用于膨胀、收缩，温度波动或振动等物理场景

Parker Chomerics推出一款填充了镀银铜片的导电密封胶 PRO-SHIELD®7024。PRO-SHIELD 7024非常适合于那些存在膨胀、收缩，温度波动或振动等物理现象的应用场合。与基材形成能够屏蔽EMI的导电弹性粘附之后，PRO-SHIELD 7024可保持粘性和柔韧性。由于易于去除和重新涂抹，这种导电密封胶非常适用于电子产品组装或可需要拆开并重新组装的密封件。

2019-03-17 - 新产品代理服务技术支持批量订货