Application Note Understanding Thermal Specifications of Bridge Rectifiers

2022-03-09 Diotec

Mastering thermal management of power applications is one of the highly underestimated challenges electronic designers must overcome. This application note explains the mechanisms of heat transfer in semiconductor components along with DIOTEC's datasheet parameters of 1ph and 3ph Bridge Rectifier. It further describes a way to determine whether a bridge is suitable for a given output current and ambient respectively case temperature.The conduction of electric current at a voltage generates heat in a semiconductor material thus increasing the temperature of the pn-junction. A higher temperature is directly tied to an increased probability of failures and a reduced component lifetime. In order to assure safe operation, designers must take measures to reduce the junction temperature during operation.

  1. Mechanisms of heat transfer in semiconductor components (free standing)

Figure 1 Heat Transfer Path when Free Standing


In semiconductor components, heat transfers from the hot areas to the cooler ones by different paths. Fig. 1 shows the thermal resistive path of heat transfer from the hot pn-junction to the ambient via the component case.

Tj= P * R(th j-a)+Ta (1)

R(th j-a)= R(th j-c)+R(th c-a)

Tj: Temperature of pn-junction

Ta: Temperature of ambient

P: Power Dissipation

R(th j-a):  Thermal Resistance junction-to-ambient

R(th j-c): Thermal Resistance junction-to-case

R(th c-a): Thermal Resistance case-to-ambient


2. Mechanisms of heat transfer in semiconductor components (on heatsink)

Figure 2 Heat Transfer Path with Cooling fin

A heatsink improves the heat transfer by introducing an additional path with a low thermal resistance.

Tj= P * R(th j-a)+Ta (2)

R(th j-a)= R(th j-c)+R(th c-cf)+R(th cf-a)

R(th c-cf): Thermal Resistance case-to-cooling fin

R(th cf-a): Thermal Resistance cooling fin-to-ambient


A thermal paste applied between the thermal pad of the component case and the cooling fin improves the heat transfer at the contact area. Recommendations of the thermal paste manufacturer must be respected and the thermal resistance of the paste must be taken into account.


3.1 Free standing

3. Datasheet Specifications of Bridge Rectifiers

For free standing bridge rectifiers, Diotec specifies a maximum average rectified current at a certain ambient temperature. This is sampled close to the component case (as specified in the datasheet footnotes). If the application requires a maximum ambient temperature higher than the datasheet specification, the max. current must be derated. For a reliable design, operation at maximum values is to be avoided with appropriate safety margins in place.


3.2 Cooling fin

When mounted on a heatsink (e.g. a cooling fin), the total thermal resistance between pn-junction and ambient is reduced. The larger the cooling fin area, the lower the thermal resistance and the better the thermal transfer. Diotec specifies a maximum average rectified current for a specific case temperature and area of the cooling fin.Due to the improved thermal resistance, the maximum value for the current is higher than for applications where the bridge rectifier is free standing.


3.3 Forced cooling

For applications without a heatsink, an active cooling (e.g. cooling fan) can be used to improve heat transfer.

4. Estimation of junction temperature at given output current


Formulas (1) and (2) allow to determine the junction temperature at given ambient respectively case temperature, when power losses P are known. No matter if single or three phase bridge, always only two diodes are conducting at the same time.


Depending on how Rth is defined, this has to be considered accordingly. The duty

cycle per diode is 1/2 for the single phase bridge and 1/3 for the three phase one.

Power dissipation P becomes then as follows:

P = VF * IFAV * n * m

VF: Forward voltage drop of the single diode at IFAV and Tj

IFAV: Average current at the output of the bridge

n= 1/2 (for 1ph bridges) or n= 1/3 (for 3ph bridges)

m= 2 (if Rth is „per device“) or m= 1 (if Rth is „per diode“)


Since VF is difficult to be measured in the real application, one can use the maximum value at 25°C as specified in the data sheet. Since real diodes will get hot during operation and VF thus will get down (due to its negative temperature coefficient), this procedure leads automatically to a certain safety margin. As such it covers unforeseeable, short overloads which might occur in the application.


It is a good practice to use the bridge at junction temperatures of not much higher than 100°C, even if maximum rating is at 150°C. According to Arrhenius‘ law, every 10K of reduced Tj improves the lifetime by a factor of 2. So in order to achieve a long lifetime and high reliability, it is worth to spend some effort in improved cooling or to choose a higher rated device.

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本文由电子人生转载自Diotec,原文标题为:Application Note Understanding Thermal Specifications of Bridge Rectifiers,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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Diotec(德欧泰克)整流桥选型指南

目录- Bridge Rectifiers   

型号- GBU10J,KBPC2506FP,DB15-08,GBU10K,DB15-06,MB10S,GBU10M,KBPC5004FP,KBPC1514WP,S40,KBPC810,DBI20-16B,KBPC3502WP,GBU10B,KBPC2510WP,GBU10A,GBU10D,KBPC1502FP,DB15-04,DB15-01,DB15-02,B125S2A,B500C5000-3300,DB15-16,KBPC3501FP,B380C7000-4000,B500C2300-1500B,KBPC1006WP,B500C2300-1500A,GBI25M,KBPC2506WP,S40F,B40FS,KBPC3501I,GBI25J,GBI25K,ABS8,KBP204G,DB15-10,ABS6,GBI25G,ABS4,GBI25A,KBPC1514FP,DB15-14,GBI25B,ABS2,DB15-12,GBI25D,ABS10,CS10D,KBPC1016WP,KBPC3514FP,B40S15A,B380C2300-1500B,B380C2300-1500A,KBPC3510I,KBPC1004FP,B125S,KBP302G,B125R,KBPC2516FP,KBPC3502FP,KBPC604,B125D,KBPC606,GBI10M,KBPC1504WP,KBPC608,GBI35M,CS10S,KBPC601,KBPC600,GBI35J,B125C3700-2200,GBI35K,KBPC602,GBI35D,KBPC1016FP,KBPC3514WP,KBP206G,GBI35G,B40C3700-2200,GBI35A,GBI35B,B250C3700-2200,CS20D,KBPC5006FP,B40C7000-4000,MYS40,B500R,KBPC2504FP,B250C2300-1500A,S80,B250C2300-1500B,B500D,DB25-10,DB25-12,KBPC1512WP,DB25-14,DBI20-12B,B80S15A,GBI10J,KBPC3504I,DB25-16,GBI10K,MYS380,MB2S,GBI10G,KBPC2516WP,B250S2A,GBI10A,GBI10B,KBPC3504WP,GBI10D,KBPC1004WP,S380F,KBPC2510I,GBI20M,DB25-01,B80C5000-3300,DB25-02,KBPC1501WP,DB25-04,DB25-06,CS20S,DB25-08,KBPC2504WP,MYS250,KBPC5010FP,B80FS,KBPC1512FP,KBPC2501I,CS30D,KBPC1014WP,S250F,B40FD,B80R,B80S,KBPC3516FP,GBI20J,GBI20K,KBPC3502I,GBI20D,B80D,KBPC1002FP,MB4S,GBI20G,B80C7000-4000,S250K,GBI20A,GBI20B,MYS125,KBP310G,KBPC1501FP,GBU4A,KBPC2514FP,KBPC802,KBPC3504FP,GBU4G,KBPC804,B40C5000-3300,GBU4D,KBPC806,KBPC1502WP,B380FD,GBU4B,KBPC808,CS30S,GBU4M,B250S15A,GBU4K,KBPC801,KBPC1014FP,GBU4J,KBPC800,B500S,KBPC3516WP,KBP202G,B380FS,KBPC1510WP,DB35-12,KBPC5008FP,DB35-10,KBPC2502FP,B80C3700-2200,B500S2A,CS40D,MB6S,GBV15B,KBPC1001FP,GBV15D,KBPC2514WP,KBP308G,KBPC1506FP,GBV15G,GBV15J,KBPC3506WP,KBPC3508I,GBV15K,DB35-16,S380,GBV15M,DB35-14,KBPC2502I,DB35-02,GBI40W,GBU6B,DB35-01,GBU6A,B80S2A,KBPC1002WP,KBPC5012FP,S125,GBU6K,B380C3700-2200,GBU6J,GBI40J,GBU6G,GBI40K,GBI40M,GBU6D,B380S,KBPC1510FP,CS40S,B380R,KBPC2502WP,DBI25-12A,B500S15A,GBU6M,MYS80,DB35-08,S250,DB35-06,S80F,DB35-04,KBPC1012WP,KBPC2501FP,KBPC3510FP,KBPC5001FP,B80FD,B500C7000-4000,DBI25-16A,PB1010,CS50D,B250S,GBI40G,B125C2300-1500B,MB8S,B125C2300-1500A,GBI40D,KBPC1008FP,B250R,KBPC3506I,B250D,GBS4B,B250C7000-4000,GBU8D,GBS4A,KBPC2504I,KBPC1001WP,GBU8B,KBPC2512FP,GBU8A,PB1008,KBPC1508FP,B125C7000-4000,GBS4K,KBPC1508WP,GBU8M,GBS4J,PB1004,GBU8K,GBU8J,PB1006,GBS4G,KBPC3506FP,PB1000,GBU8G,PB1001,GBS4D,GBU100G,PB1002,GBUK8G,KBPC1012FP,KBPC3510WP,GBS4M,B40S2A,KBPC2501WP,KBP210G,CS50S,KBPC2508FP,KBPC5002FP,B500C3700-2200,KBPC1516WP,GBUK8D,DBI25-18A,ABS15Y,KBPC610,B250C5000-3300,B380S15A,B125FS,B125FD,KBP304G,KBPC1504FP,KBPC2512WP,DBI20-08B,KBPC3508WP,B125S15A,B40C2300-1500,B380C5000-3300,B250FS,ABS15G,ABS15M,ABS15K,ABS15J,KBPC1008WP,KBPC2506I,ABS15S,B80C2300-1500A,B80C2300-1500B,B250FD,KBPC2508WP,KBP208G,KBPC1516FP,ABS15D,B40C2300-1500B,KBPC1010WP,B380D,GBU12K,S125K,GBU12M,KBPC3512FP,B40R,B40S,S125F,DBI25-08A,KBP306G,KBPC3501WP,GBU12B,B380S2A,GBU12A,B40D,GBU12D,KBPC1006FP,GBU12G,GBU12J,GBI15A,S500,KBPC1506WP,KBPC2510FP,KBPC3508FP,KBPC2508I,B125C5000-3300,KBPC1010FP,GBI15J,GBI15K,GBI15M,KBPC3512WP,GBI15G,GBI15B,GBI15D

选型指南  -  DIOTEC  - Version 26  - 2021 PDF 英文 下载

Diotec Rectifier Bridge GBI25J-LV Offers 10% Lower Forward Voltage Drop to Energy Saving Power Supply of Data Servers

The input bridge GBI25J-LV by Diotec is built with rectifier chips offering a 10% lower forward voltage drop than the standard version GBI25J. Since always two diodes are conducting per main cycle, the power savings are even 20%. This is a lot for a power supply running 24/7.

应用方案    发布时间 : 2024-04-04

Smart Garage Door Opener Drive Supplied by Energy Saving Bridge GBI25J-LXN

For GBI25J-LXN, the typical forward voltage drop of the four rectifier diodes is 0.90 V, saving energy during standby operation. Repetitive peak forward current can reach up to 60 A, powerful enough at any time when the motor starts to pull the door.

应用方案    发布时间 : 2024-03-31

PANJIT‘s New Ultra-Low VF Bridge Rectifier Series: Optimizing Power Efficiency and Reliability Across Various Applications

PANJIT proudly introduces its latest Ultra-Low VF Bridge Rectifier Series. Engineered with oxide planar chip junction technology and featuring PI protection layers, this series is poised to redefine the standards of power efficiency and reliability across various applications.

产品    发布时间 : 2023-10-28

Diotec Products for Power LED Lamps – Halogen and CFL Retrofits Application Note

型号- GU5.3,TGL200F10,CS20S,SGL1-40,S500,SK34SMA,GU10,S250,SK14,MR16

应用笔记或设计指南  -  DIOTEC  - 2011-02-02 PDF 英文 下载

数据手册  -  DIOTEC  - Version 2022-08-15  - 2024/2/22 PDF 英文 下载

Forward surge current limit of GBU4 to GBU8 adjusted to industry standard Product Change Notification

型号- GBU4A,GBU6B,GBU8D,GBU6A,GBU8B,GBU8A,GBU6K,GBU8M,GBU6J,GBU4G,GBU8K,GBU8J,GBU6G,GBU4D,GBU8G,GBU4B,GBU6D,GBU4M,GBU4K,GBU6M,GBU4J,GBU4,GBU6,GBU8

产品变更通知及停产信息  -  DIOTEC  - 31.01.2013 PDF 英文 下载

Powerful AC to DC Rectification on Printed Circuit Boards

The GBU10A, GBU10B, GBU10D, GBU10G, GBU10J, GBU10K, GBU10M series of single phase bridge rectifiers from Diotec are offered in the GBU package with 5.08mm pitch. The devices can be operated free-standing for up to 7.0A of output current as well as clipped onto a heatsink for up to 10A. They are ideally suited for printed circuit board assemblies. With a case length of 21.5mm and a thickness of 3.4mm it can be used even in tight assemblies where space is restricted.

新产品    发布时间 : 2020-06-03

数据手册  -  DIOTEC  - Version 2022-08-15  - 2024/2/22 PDF 英文 下载

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ATA半导体热电空调定制

可定制ATA TE Cooler的冷却功率范围:35~800W;控温精度:≦±0.1℃;尺寸:冷面:20*20到500*300;热面:60*60到540*400 (长*宽;单位mm)。

最小起订量: 1 提交需求>

ATP半导体冷板制冷器定制

可定制ATP TE Cooler的冷却功率:40~200W;运行电压:12/24/48V(DC);控温精度:≤±0.1℃; 尺寸:冷面:20*20~500*300;热面:60*60~540*400 (长*宽;单位mm)。

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