Application Note Understanding Thermal Specifications of Bridge Rectifiers
Mastering thermal management of power applications is one of the highly underestimated challenges electronic designers must overcome. This application note explains the mechanisms of heat transfer in semiconductor components along with DIOTEC's datasheet parameters of 1ph and 3ph Bridge Rectifier. It further describes a way to determine whether a bridge is suitable for a given output current and ambient respectively case temperature.The conduction of electric current at a voltage generates heat in a semiconductor material thus increasing the temperature of the pn-junction. A higher temperature is directly tied to an increased probability of failures and a reduced component lifetime. In order to assure safe operation, designers must take measures to reduce the junction temperature during operation.
Mechanisms of heat transfer in semiconductor components (free standing)
Figure 1 Heat Transfer Path when Free Standing
In semiconductor components, heat transfers from the hot areas to the cooler ones by different paths. Fig. 1 shows the thermal resistive path of heat transfer from the hot pn-junction to the ambient via the component case.
Tj= P * R(th j-a)+Ta (1)
R(th j-a)= R(th j-c)+R(th c-a)
Tj: Temperature of pn-junction
Ta: Temperature of ambient
P: Power Dissipation
R(th j-a): Thermal Resistance junction-to-ambient
R(th j-c): Thermal Resistance junction-to-case
R(th c-a): Thermal Resistance case-to-ambient
2. Mechanisms of heat transfer in semiconductor components (on heatsink)
Figure 2 Heat Transfer Path with Cooling fin
A heatsink improves the heat transfer by introducing an additional path with a low thermal resistance.
Tj= P * R(th j-a)+Ta (2)
R(th j-a)= R(th j-c)+R(th c-cf)+R(th cf-a)
R(th c-cf): Thermal Resistance case-to-cooling fin
R(th cf-a): Thermal Resistance cooling fin-to-ambient
A thermal paste applied between the thermal pad of the component case and the cooling fin improves the heat transfer at the contact area. Recommendations of the thermal paste manufacturer must be respected and the thermal resistance of the paste must be taken into account.
3.1 Free standing
3. Datasheet Specifications of Bridge Rectifiers
For free standing bridge rectifiers, Diotec specifies a maximum average rectified current at a certain ambient temperature. This is sampled close to the component case (as specified in the datasheet footnotes). If the application requires a maximum ambient temperature higher than the datasheet specification, the max. current must be derated. For a reliable design, operation at maximum values is to be avoided with appropriate safety margins in place.
3.2 Cooling fin
When mounted on a heatsink (e.g. a cooling fin), the total thermal resistance between pn-junction and ambient is reduced. The larger the cooling fin area, the lower the thermal resistance and the better the thermal transfer. Diotec specifies a maximum average rectified current for a specific case temperature and area of the cooling fin.Due to the improved thermal resistance, the maximum value for the current is higher than for applications where the bridge rectifier is free standing.
3.3 Forced cooling
For applications without a heatsink, an active cooling (e.g. cooling fan) can be used to improve heat transfer.
4. Estimation of junction temperature at given output current
Formulas (1) and (2) allow to determine the junction temperature at given ambient respectively case temperature, when power losses P are known. No matter if single or three phase bridge, always only two diodes are conducting at the same time.
Depending on how Rth is defined, this has to be considered accordingly. The duty
cycle per diode is 1/2 for the single phase bridge and 1/3 for the three phase one.
Power dissipation P becomes then as follows:
P = VF * IFAV * n * m
VF: Forward voltage drop of the single diode at IFAV and Tj
IFAV: Average current at the output of the bridge
n= 1/2 (for 1ph bridges) or n= 1/3 (for 3ph bridges)
m= 2 (if Rth is „per device“) or m= 1 (if Rth is „per diode“)
Since VF is difficult to be measured in the real application, one can use the maximum value at 25°C as specified in the data sheet. Since real diodes will get hot during operation and VF thus will get down (due to its negative temperature coefficient), this procedure leads automatically to a certain safety margin. As such it covers unforeseeable, short overloads which might occur in the application.
It is a good practice to use the bridge at junction temperatures of not much higher than 100°C, even if maximum rating is at 150°C. According to Arrhenius‘ law, every 10K of reduced Tj improves the lifetime by a factor of 2. So in order to achieve a long lifetime and high reliability, it is worth to spend some effort in improved cooling or to choose a higher rated device.
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With Diotec‘s DBI25-18A, industrial robots can be reliably supplied with energy. It allows for up to 25A output current at 115℃ case temperature, can be soldered to the PCB and screwed to a heatsink, and supports by its admissible reverse voltage of 1800V to fulfil the requirements of IEC 6100-4-5.
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PANJIT proudly introduces its latest Ultra-Low VF Bridge Rectifier Series. Engineered with oxide planar chip junction technology and featuring PI protection layers, this series is poised to redefine the standards of power efficiency and reliability across various applications.
Adjusting parameters of “round bridges” to industry standard Product Change Notification
型号- B091A,B091B,B500R,B091C,B80R,BXXX,B40R,B068B,B066A,B066B,B066C,B066D,B066,B380R,B159B,B159A,B091,B125R,B250R
DI6206xx 系列电动汽车充电解决方案
型号- DBI25-08...18A,UGB8JT,BYG23T,DI78L,DI78M,LDI1117 SERIES,DI012N60D1,DIJ020N60,P6SMB400 ... 550CA,GBI 40 K...W,ESD9BL0522P,AM2000,TGL200CF08,DBI20-08...16B,ESD5Z3V3 ... 12,GBI 25 K...W,GBI 35 K...W,SMS560-3G,BYG10K ... M,P2500T ... Y,DI6206 SERIES,FR2YSMA,DI79L SERIES,DI6206,ESD9BL24P,DI79L,LDI1117,SK34SMA-3G,UFT800J,GBU 10 K...M,1.5SMC400 ... 550CA,MUR860,MURF2060CT,DI6206XX,DI6206XX 系列,DI78L SERIES,DI78M SERIES,GBU 12 K...M
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可定制ATP TE Cooler的冷却功率：40~200W；运行电压：12/24/48V(DC)；控温精度：≤±0.1℃； 尺寸：冷面：20*20~500*300；热面：60*60~540*400 （长*宽；单位mm）。
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可定制ATL TE Cooler制冷量范围：50~1000W;工作电压：12/24VDC;控温精度≤±0.1℃;控温精度：≤±0.1℃；尺寸：冷面：20*20~500*300mm，热面：60*60~540*400mm。
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