Sekorm Became an Authorized Distributor of Rogers
ROGERS is a global leader in engineered materials to power, protect and connect our world. As one of the oldest listed companies in USA, Rogers has a fine tradition of innovation and working with customers to solve problems. From 1832 as a cardboard manufacturer to the present, Rogers has developed into the world's leading supplier of special materials, covering many high-tech equipment and systems. Sekorm is an official authorized distributor of Rogers, acting as a distributor of Rogers' plates.
Rogers is successively launching its products and information on the platform. Users can directly search for product information and enjoy authenticity guarantee and supply guarantee.
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ROGERS层压板/高频板选型表
罗杰斯/ROGERS提供以下技术参数的层压板/高频板选型,超低损耗,低至0.0004(Df) ;超大尺寸:54inchX24inch、52inchX40inch、50.1inchX110inch 等;丰富介电常数:2 -12.85 (Dk);超薄介质,低至1mil
产品型号
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品类
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产品系列
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介电常数(Dk)
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正切角损耗(Df)
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介质厚度(mm)(mil)
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导热系数W/(m·K)
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铜箔类型
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铜箔1厚度
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铜箔2厚度
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尺寸(inch)
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5880LZNS 24X18 H1/H1 R4 0100+-001/DI
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层压板
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RT/duroid® 5880LZ
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2
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0.0027
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0.254mm(10mil)
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0.33
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电解铜
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H1
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H1
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24X18
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选型表 - ROGERS 立即选型
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产品型号
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品类
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产品系列
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介电常数(Dk)
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正切角损耗(Df)
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厚度(mils)(mm)(μm)
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尺寸(inch)
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导热系数W/(m·K)
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3003 BOND PLY 25.5X18 005 R3
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半固化片
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RO3003
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3.00±0.04
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3
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0.005” (0.13mm)
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25.5X18
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0.5
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选型表 - ROGERS 立即选型
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产品型号
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品类
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产品系列
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介电常数(Dk)
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正切角损耗(Df)
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厚度(mm)
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尺寸(mm)
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绝缘强度(V/mil)
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热变化率(ppm/℃)
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导热系数W/(m·K)
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吸湿率
|
2929 BOND PLY 12X18 0015+-10%
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粘结片
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2929
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2.94±0.05
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0.003
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0.0015” (0.038mm) +/- 10%
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12”X18” (305mm X457mm)
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2500
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-6
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0.4
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0.10%
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选型表 - ROGERS 立即选型
ROGERS 粘结膜选型表
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产品型号
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品类
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产品系列
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介电常数(Dk)
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正切角损耗(Df)
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Lengths(ft)
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熔化温度(℃)
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尺寸(inch)
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厚度(mm)
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6700 2.35 24X30LFX0.003
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粘结膜
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CuClad 6700
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2.35
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0.0025
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30ft
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397°F (203°C)
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24X30
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0.0030" (0.08mm)
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选型表 - ROGERS 立即选型
电子商城
品牌:ROGERS
品类:Circuit Materials
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实验室地址: 深圳 提交需求>
可加工PCB层数:1-30层;板材类型:FR4板/铝基板/铜基板/刚扰结合板/FPC板/高精密板/Rogers高频板;成品尺寸:5*5mm~53*84cm;板厚:0.1~5.0mm。
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