Ingchips ING918xx Series BLE SoC for Feiyu Vimble 3 Stabilizer with 1.25Mbps GATT Data Rate Provides High Stability and Performance

时间： 2023-08-15 来源：INGCHIPS News

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Feiyu Vimble 3 officially launched at 10:00 a.m. on March 23, 2022. And Ingchips BLE SoC was applied in this product.

Feiyu is a product company, top3 in the mobile phone stabilizer industry. At that time, Feiyu began to focus on the foreign market, especially the high-end market.

The goal of the mobile phone stabilizer is to shoot mobile phone blockbusters at any moment, such as walking, running, outdoor with extremely low temperature, etc. The three-axis stability enhancement technology with the extension bar can easily capture the images of different angles of view, and AI tracking module mounted on top of the phone holder without supporting by App.

The BLE SoC installed in the stabilizer needs to maintain the wireless connection with the mobile phone in real time. No matter how novel the playing method, how complex the environment, and what type of mobile phone, the key is to maintain the stability of the mobile phone shooting.

Because of the product requirements of the mobile phone stabilizer, BLE SoC, as one of the many components, plays a key role of this product. Ingchips high-performance BLE SoC ING918xx attracted Feiyu's attention because of its high stability, high compatibility, and adaptability to sensitive and complex environments.

ING918xx chip is different from the low-cost strategy chips from other domestic vendors. It adopts a product design idea similar to Nordic, with high performance and stability as the focus. The advanced 40nm process, full BLE5.1 feature protocol stack, - 40 ℃~125 ℃ temperature range, extreme low power cost, friendly development environment are the key features that attracted Feiyu, which is very conducive to the quick mass production of Feiyu products.

ING918xx series BLE SoC, with its leading chip design technology, provide high stability, high compatibility and development convenience to the customers.

TSMC40nm uLP eFlash process；
RTC sleep with 1μA power consumption，30μA power consumption with 500ms connection interval；
Ambient temperature -40℃~125℃；
High compatibility and Stability: full 5.1 features with LINK-PHY 180 ICS test cases
High throughput: 1.25Mbps GATT data rate，uplink 100+KB data rate with Android phone，and 40KB with IOS；
Multiple Connection: support 24 connections；
Long Range：370m adv with Coded S8 mode；
Hybrid mode：multiple central and multiple peripheral connection configuration；
Easy development：Graphical project Wizard, ADV editor, dozens examples, etc.

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本文由玄子转载自INGCHIPS News，原文标题为:INGCHIPS inside-Feiyu Vimble 3 on market，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

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