【产品】填充银片的双组分导电环氧涂料CHO-SHIELD® 596,专用于塑料和复合材料EMI屏蔽和电气接地

2019-03-18 Parker Chomerics
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PARKER CHOMERICS推出填充银片的双组分导电环氧涂料CHO-SHIELD® 596,用于给塑料和复合材料基板提供EMI屏蔽和电气接地。这对于耐化学反应的塑料或其他难以粘附的基材来说是一个很好的涂料选择。此外,CHO-SHIELD® 596提供的兼容性导电金属涂层有利于填充银片的EMI屏蔽垫圈与铝制法兰之间的配合。通过在铝基板上形成阻挡层,含银的环氧树脂涂层降低了EMI垫圈/铝制法兰系统的整体电偶腐蚀。当处在极端高低温、高湿度和盐雾腐蚀的环境中时,CHO-SHIELD® 596表现出非凡的环境稳定性、导电稳定性、粘合性和耐磨性。CHO-SHIELD® 596的典型应用包括军用和商业电子设备外壳,火箭燃料筒,便携式电子,雷达系统,航空电子箱,发动机,铝制法兰和结构件等。



CHO-SHIELD® 596的特点和优势:

•双组分

•可预先测量的试剂瓶,可在 一个容器里方便地混合不同组分

 适用期长达8小时

•银片填料

•优异的导电性和EMI屏蔽组分,EMI屏蔽效率大于90 dB

•环氧涂层

•涂层在恶劣的环境中保持电气和机械稳定性

 连续工作温度范围-40 ~150°C (-40~ 302°F)

 良好的耐化学性/防潮性

 耐磨涂层

 符合军用MIL-C-22750规格标准


CHO-SHIELD® 596的订货信息:52-00-0596-000052-01-0596-0000

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
现货商城,价格查询,交期查询,订货,现货采购,在线购买,样品申请渠道:世强硬创平台电子商城www.sekorm.com/supply/
概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
集成电路,电子元件,电子材料,电气自动化,电机,仪器全品类供应:世强硬创平台www.sekorm.com
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测试报告  -  PARKER CHOMERICS  - 4/3/20 PDF 英文 下载

【选型】小剂量气罐装导电涂料PRO-SHIELD®7100/03/08,最适合小批量手工喷涂或原型机测试生产

本文从派克固美丽推荐的多种涂料型号中,筛选出三款能够提供小剂量气罐装的产品,优点是单组分喷灌包装,使用起来方便灵活,最适合小批量手工喷涂,或者是原型机测试生产使用。三款涂料分别为,经济型的镍填充丙烯酸PRO-SHIELD® 7100型;性能与经济效益的折衷方案,镀银铜填充丙烯酸PRO-SHIELD® 7103型;最佳电气性能的银填充丙烯酸PRO-SHIELD® 7108型。

器件选型    发布时间 : 2019-06-07

Parker Chomerics Specialty Materials Product Shelf Life Data

型号- CHO-SHIELD 571,CHO-BOND 580-208,CHO-SHIELD 4994,TECKNIT 0005,TECKNIT 0002,CHO-SHIELD 2056,CHO-SHIELD 596,CHO-BOND 360-20,CHO-BOND 1029,CHO-LUBE 4220,CHO-BOND 2165,CHO-SHIELD 608,CHO-BOND 1077,CHO-BOND 1035,TECKNIT 8116,CHO-BOND 1016,CHO-BOND 1038,CHO-BOND 4669,CHO-BOND 592,CHO-SHIELD 568,CHO-SHIELD 604,CHO-BOND 1030,CHO-BOND 4660,CHO-BOND 1075,CHO-SHIELD 2002,CHO-SHIELD 2003,CHO-SHIELD 2044,CHO-SHIELD 2001,CHO-BOND 1019,CHO-BOND 1121,CHO-SHIELD 2040,CHO-SHIELD 579,CHO-SHIELD 610,CHO-SHIELD 576,CHO-BOND 584-29,CHO-SHIELD 1091,CHO-BOND 1085,CHO-BOND 584-208,CHO-BOND 1086

技术文档  -  PARKER CHOMERICS  - 2021-04 PDF 英文 下载

【经验】Parker Chomerics为航空航天工业应用提供EMI屏蔽和雷击防护方案

当今飞机中的EMI管理和雷击防护为了减轻重量,提高燃油经济性并降低成本,复合材料已经在整个航空工业中取代了金属结构。但是,与过去的传统金属机身相比,这些材料缺乏导电性是一个缺点。传统的金属机身使设计人员可以利用其形成的天然法拉第笼,以保护设备免受干扰。Parker Chomerics产品可应用于航空航天工业中,解决复合材料的EMI屏蔽和雷击防护等问题。

设计经验    发布时间 : 2019-12-28

【经验】高性能低成本的板级EMI屏蔽解决方案——导电涂料和导电粘合剂

电路板上的EMI屏蔽问题,尤其是作为智能电器大脑的半导体芯片元件,对于电磁干扰是十分敏感的,而且不仅是需要屏蔽外来的EMI干扰,还有线路板上各元器件间的互相干扰问题。对于集成电路板上的这种EMI屏蔽需求,半导体技术专家和屏蔽应用专家都十分重视,已经有了多种适用的解决方案,包括金属屏蔽罩、新型EMI屏蔽芯片、PVD沉积金属层、导电涂层和吸波涂层等。本文重点介绍的就是导电涂层方案的原理和应用特点。

设计经验    发布时间 : 2019-07-08

Speeding Development. Reducing Risk. Electromagnetic Interference (EMI) Shielding and Thermal Interface Materials Solutions for Life Science Devices

型号- PREMIER™ A240-FRHF,WIN-SHIELD™ P,SOFT-SHIELD® 4850,CHO-SEAL® 1285,PREMIER™ PEI 140,THERM-A-GAP™ GEL 30,CHOFORM® 5528,CHO-SHIELD® 2040,PREMIER™ A220-HT,THERM-A-GAP™ 974,CHO-SHIELD® 2044,CHO-SEAL® 6370,THERM-A-GAP™ 976,THERM-A-GAP™ 579,WIN-SHIELD™ G,THERM-A-GAP™ GEL 8010,THERM-A-GAP™ HCS10,CHO-SEAL® S6305,DURALAN™ P,CHO-SEAL® 1298,CHO-SEAL® 6502,THERM-A-GAP™ GEL 45,THERM-A-GAP™ G974,THERM-A-FORM™ T646,CHOFORM® 5513,CHO-SHIELD® 2056,THERM-A-FORM™ T647,CHO-SEAL® 6503,PREMIER™ A240-ST,THERM-A-GAP™ TC50,THERM-A-GAP™ 569,PREMIER™ PBT-225,SOFT-SHIELD® 3500,THERM-A-FORM™ 1641,SOFT-SHIELD® 3700

商品及供应商介绍  -  PARKER CHOMERICS  - 10/18 PDF 英文 下载

【产品】兼容CHO-SHIELD 2000EMI涂料的高导电、耐腐蚀的导电密封胶CHO-BOND®2165

Parker Chomerics推出的CHO-BOND®2165是一种稳定的铜填充双组分聚氨酯导电密封胶,专为航空航天和军事应用而设计。 CHO-BOND 2165与CHO-SHIELD 2000系列的EMI涂料配合使用,为铝制和复合材料机身提供导电,耐腐蚀的保护。 CHO-BOND 2165导电胶是EMI屏蔽和电气接地应用的理想选择。 这种浓稠的导电胶可用作飞机的紧固件填充,间隙填充或修补材料。

新产品    发布时间 : 2019-03-28

Engineered Materials Group Capabilities Guide

型号- G-LINK®-200,M-SERIES LVDT,V-LINK®-200,SG-LINK-200,LS-LVDT,TORQUE-LINK-200,S-SERIES LVDT,M-SERIES,G-SERIES,C-SERIES

商品及供应商介绍  -  PARKER CHOMERICS  - 11/20 PDF 英文 下载

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