【产品】单一成分快速固化导电硅胶密封剂TECKNIT 0002，可用于电磁屏蔽垫片修复，粘接和连接

时间： 2019-03-23 来源：Parker Chomerics

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PARKER CHOMERICS旗下推出的TECKNIT 0002是一种单一成分快速固化导电硅胶密封剂，它可以被当做嵌条，填缝剂和裂缝密封剂来使用，以满足电气外壳的电磁屏蔽及接地需求。

TECKNIT 0002的最小推荐厚度为0.005英寸（0.13毫米）。此外，TECKNIT 0002可用于需要中等拉力强度（150 psi）的应用中的电磁屏蔽垫片修复，粘接和连接。TECKNIT 0002的湿固硅聚合物系统使其能够在2小时内固化，形成一个有弹性的导电和环境密封环境，并可以在各种温度下提供灵活应用。

当TECKNIT 0002被用于敏感基材上时要必须小心，因为在固化过程中会释放出微量的乙酸，这可能会损坏电路。此外，在使用TECKNIT 0002时需要注意通风，因为在固化过程中会释放散发出强烈的气味的乙酸。

图1 TECKNIT 0002产品外观图

TECKNIT 0002导电硅胶密封剂产品特性及优势：

• 单一成分。

• 银填充。

• 湿固化硅胶。

• 乙酸固化机制。

• 中等粘贴度。

• 易于使用，无需称重或混合。

• 优优的导电率0.010 ohm-cm。

• 5分钟工作时间，快速成膜，在固化过程中不需要压力，广泛的应用温度。

• 快速固化，2小时处理时间，72小时完全固化性能，无需底漆。

• 操作方便，易于使用和涂抹，可以用于天花板或垂直表面。

TECKNIT 0002产品典型应用：

• 便携式电子设备

• 雷达和通信系统

• EMI通风口

• 军用地面车辆和避难所

TECKNIT 0002产品订购信息：

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本文由方人也翻译自Parker Chomerics，版权归世强硬创平台所有，非经授权，任何媒体、网站或个人不得转载，授权转载时须注明“来源：世强硬创平台”。

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