【应用】THERM-A-GAP™ MCS30超柔垫片应用于智能音箱主控芯片散热,导热系数3W/m·K
如下是G公司旗下的一款智能音箱产品,其作为家庭消费者用于语音上网的一个工具,包含了上网购物、点播歌曲、天气预报等服务;同时,它还可以对智能家居设备进行控制,比如提前让热水器升温、打开窗帘、设置冰箱温度等。这些功能的实现、离不开主控芯片强大算力的支持;然而,长时间的连续运行会加剧芯片部位的功率损耗,并转化为热量、进而引起温度上升。温度过高,对于芯片、智能音箱及使用者而言,都是极其不利的;如何有效的降低温升,则是每一位热设计工作者需要思考的问题。
芯片位于中框主板表面,上方添加一个屏蔽罩,用以降低周围的电磁干扰,除此之外,屏蔽罩还可用于芯片部位的散热。芯片与散热器之间的高度0.85mm左右,考虑实际装配时15%的压缩余量、并保证良好接触,选用一款1mm厚度的导热垫片作为芯片与屏蔽罩间的导热填充介质;芯片比较脆弱,所选用的导热垫需要具备低硬度、易压缩且低应力等特性。上述采用15%压缩量设计,也正是基于低应力方面的考量;另外,通过热设计初期的仿真模拟,所需导热垫的导热系数满足3W/m·K即可达到使用要求。
THERM-A-GAP™ MCS30 是PARKER CHOMERICS旗下的一款超柔导热垫片,导热系数典型值为3W/m·K@20Psi,其在硬度、压缩性、应力应变等方面,均符合上述智能音箱主控芯片部位使用要求。
1、其具有良好的热传导特性,1mm厚度对应的热阻为0.4℃.in2/W@20Psi;双面自带弱粘性,可方便与芯片表面的预固定。界面润湿性好,可排除芯片与屏蔽罩间90%以上的空气,可大大降低接触热阻,有利于芯片热量的快速转移。
2、其硬度低至25 Shore OO,选用1mm厚度、在15%应变情况下,应力低至0.05Mpa左右,可有效降低装配过程中对芯片部位的损伤。
3、其击穿强度高达11KVac@1mm,电气绝缘特性十分突出,对芯片部位可起到电气保护作用,并大大降低长期使用过程中发生短路的可能性。
4、其具有极低的小分子挥发率,质量损失TML只有0.06%;已达到NASA航天级材料选用标准,长期使用的性能一致性及稳定性有保障,且对周围器件无腐蚀、无污染。
5、其适用于-50℃~200℃温度范围,可耐受高温、低温老化的影响,长期使用可靠性高。
6、其符合RoHS欧盟环保认证要求,阻燃防火等级可达到UL94 V-0;属于环境友好型材料,使用安全性好。
综上,Parker Chomerics旗下的THERM-A-GAP™ MCS30 超柔导热垫片,其在热性能、机械性能、电性能等方面均具有不俗的表现,非常适合应用于智能音箱产品主控芯片部位的导热散热,而不会对芯片造成明显的应力损伤。如需了解这款导热垫更多的技术信息,欢迎查阅THERM-A-GAP™ MCS30 Thermally Conductive Gap Filler (sekorm.com)
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82-12916,21-13910,82-12911,21-13911,21-13912,60-02010,21-13913,60-02011,21-13914,60-02012,21-13915,60-02013,21-13916,60-02014,21-13917,60-02015,21-13918,60-02005,88-12342,60-02006,60-02007,60-02008,60-02009,48-00476,43-46210,88-12347,21-13900,82-12921,21-13901,XX-X1500,21-13902,60-02002,60-02003,60-02004,21-13907,XX-X1506,21-13908,XX-X1505,21-13909,XX-X1508,XX-X1507,XX-X1502,XX-X1501,XX-X1504,XX-X1503,48-00481,88-12337,73-00081,XX-X1509,60-02030,21-13933,60-02031,21-13934,60-02032,21-13935,60-02033,43-13794,60-02027,60-71043,60-02028,60-71044,60-02029,88-12362,60-71042,60-71047,60-71048,60-71045,60-71046,86-10094,89-50010,43-43162,86-10093,89-50012,86-10090,89-50014,86-10092,89-50016,86-10091,86-10076,84-70079,86-10075,89-7XXXX,21-13920,86-10077,84-70076,84-70075,60-02020,84-70078,60-02021,84-70077,60-02022,84-70072,60-02023,84-70071,60-02024,84-70074,60-02025,84-70073,60-02026,88-12352,60-02016,43-46208,60-02017,60-02018,43-46206,60-02019,88-12357,89-50020,89-50021,86-10082,89-50022,43-00003,89-50023,43-43175,89-50024,43-43178,72-08116,89-50025,43-00000,89-50026,89-50027,86-10080,73-00025,60-02052,60-02053,43-13335,60-02054,43-13334,60-02055,88-12392,60-02056,60-02057,60-02058,60-02059,84-70070,89-50070,89-50072,89-50074,CS 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【选型】Parker Chomerics(派克固美丽)热管理材料选型指南
目录- 产品简介 热传递基础 填缝材料 THERM-A-GAP™569,570,579,580,热垫片 THERM-A-GAP™974,G974,976,高性能热垫片 THERM-A-GAP™T63X系列,可涂布填缝材料 THERM-A-GAP™TP575NS,无硅热垫片 THERM-A-GAP™174,274,574,热垫片 THERMFLOW®相变垫片 HERMATTACH®热粘合带 THERM-A-FORM™可现场固化的灌注和底部填充材料 导热脂和导热胶 绝缘垫片 CHO-THERM®商用热绝缘垫片 CHO-THERM®高能热绝缘垫片 T-WING®和C-WING™薄型散热器 热管理词汇表 安全指南
型号- 65-00-T6XX-0030,WW-XX-5442-ZZZZ,WW-XX-D426-ZZZZ,T500,69-XX-20684-ZZZZ,WW-XX-D387-ZZZZ,69-12-XXXXX-A274,WW-XX-D390-ZZZZ,WW-XX-4659-ZZZZ,61 - 07 - 0909 - G570,69-XX-20698-ZZZZ,6WWXXYYYYZZZZ,T630,WW-XX-D409-ZZZZ,WW-XX-YYYY-ZZZZ,WW-XX-D6875-ZZZZ,WW-XX-D375-ZZZZ,WW-XX-D410-ZZZZ,69-XX-20686-ZZZZ,WW-XX-D424-ZZZZ,THERM-A-FORM™ T64X,69-11-25177-T630,65-00-T6XX - 0030,65-00-T670-3790,WW-XX-D399-ZZZZ,T63X,T404,T647,60-12-20264-TW10,69-11-24419-T630,T405,T646,T766,T644,T642,WW-XX-D385-ZZZZ,62-20-23116-T274,69-11-27155-575NS,69-12-22745-CW10,69 - 12 - XXXXX - A569,WW-XX-D414-ZZZZ,65-00-YYYY-ZZZZ,T650,T636,T635,WW-XX-D389-ZZZZ,65-00-T6XX - 0010,575-NS,WW-XX-D407-ZZZZ,62-16-23115-A274,WW-XX-8531-ZZZZ,WW-XX-D392-ZZZZ,WW-XX-D373-ZZZZ,69-11-27156-575NS,65-00-1642-0000,60-12-20267-TW10,T64X,69-11-27157-575NS,WW-XX-D379-ZZZZ,62-13-23114-T274,WW-XX-D396-ZZZZ,WW-XX-D382-ZZZZ,WW-XX-D418-ZZZZ,WW-XX-D403-ZZZZ,60-XX-YYYY-ZZZZ,274,WW-XX-4306-ZZZZ,62-04-23111-A274,65-00-1641-0000,65-00-T644-0045,WW-XX-402-ZZZZ,62-16-23115-T274,69-XX-20675-ZZZZ,WW-XX-4353-ZZZZ,WW-XX-D397-ZZZZ,T670,WW-XX-D417-ZZZZ,WW-XX-D378-ZZZZ,T405-R,T418,WW-XX-D419-ZZZZ,T777,T413,T414,WW-XX-D380-ZZZZ,T411,T412,69-12-22849-CW10,60-12-20269-TW10,65-00-T6XX-0180,WW-XX-D421-ZZZZ,WW-XX-4997-ZZZZ,WW-XX-D377-ZZZZ,T660,WW-XX-4305-ZZZZ,69-XX-27083-ZZZZ,69-12-23802-CW10,67-XX-YYYY-ZZZZ,69-11-27159-575NS,T444,65-01-1641-0000,WW-XX-4511-ZZZZ,174,TP575NS,65-00-T646-0200,WW-XX-D428-ZZZZ,WW-XX-5791-ZZZZ,WW-XX-8302-ZZZZ,WW-XX-D371-ZZZZ,WW-XX-D422-ZZZZ,974,976,65-00-T647-0200,WW-XX-6956-ZZZZ,T558,T557,WW-XX-4996-ZZZZ,61-07-0909-G174,62 - 20 - 0909 - A579,69-XX-20685-ZZZZ,60-12-20268-TW10,T441,62 - 20 - 0909 - A574,WW-XX-D381-ZZZZ,WW-XX-D412-ZZZZ,G974,65-00-T6XX - 0300,WW-XX-D411-ZZZZ,WW-XX-D374-ZZZZ,61 - 07 - 0909 - G174,WW-XX-4661-ZZZZ,WW-XX-D391-ZZZZ,PC07DS-7,WW-XX-D425-ZZZZ,WW-XX-D386-ZZZZ,6W-XX-YYYY-ZZZZ,WW-XX-D372-ZZZZ,WW-XX-D430-ZZZZ,65-00-T6XX-0300,WW-XX-D427-ZZZZ,WW-XX-D408-ZZZZ,WW-XX-D413-ZZZZ,69-11-27158-575NS,THERM-A-FORM™ 164X,WW-XX-D388-ZZZZ,69-XX-27072-ZZZZ,WW-XX-D423-ZZZZ,WW-XX-D376-ZZZZ,WW-XX-5792-ZZZZ,69-XX-20687-ZZZZ,WW-XX-D429-ZZZZ,WW-XX-D398-ZZZZ,T630G,6-6W-XX-YYYY-ZZZZ,69-XX-27070-ZZZZ,62-07-23112-A274,WW-XX-5527-ZZZZ,69-XX-27082-ZZZZ,62-10-23113-A274,WW-XX-D395-ZZZZ,1642,1641,WW-XX-4969-ZZZZ,65-00-T650-0003,WW-XX-4374-ZZZZ,WW-XX-D370-ZZZZ,WW-XX-D401-ZZZZ,62-20-23116-A274,WW-XX-D404-ZZZZ,WW-XX-D420-ZZZZ,C-WING,62-13-23114-A274,62-04-23111-T274,69-11-27154-575NS,65-00-T6XX - 0180,62-10-23113-T274,65-00-T644-0200,65-00-T642-0035,WW-XX-D383-ZZZZ,WW-XX-D405-ZZZZ,1671,60-12-20266-TW10,69 - 12 - XXXXX - A274,WW-XX-D416-ZZZZ,62-07-23112-T274,569,WW-XX-D065-ZZZZ,164X,T725,69-XX-YYYY-ZZZZ,65-00-T6XX-0010,65-00-T642-0250,65-00-T646-0045,WW-XX-D393-ZZZZ,THERM-A-GAP™ T63X,T609,570,WW-XX-D400-ZZZZ,69-XX-21259-ZZZZ,1678,574,1674,579,WW-XX-D406-ZZZZ,69-XX-20672-ZZZZ,65-00-T647-0045,WW-XX-D394-ZZZZ,69-XX-20991-ZZZZ,T710,580,WW-XX-D384-ZZZZ,WW-XX-D415-ZZZZ,60-12-20265-TW10,T-WING
Advanced Battery Energy Storage Systems (BESS) Solutions: Parker Chomerics 6.0W/m-K THERM-A-FORM CIP 60
Parker Chomerics introduced THERM-A-FORM CIP 60, a two-component (2k) dispensable thermal gap filler and cure-in-place material with 6.0 W/m-K thermal conductivity. With a Shore 00 hardness of 50 at full cure, it is designed to be an alternative to hard-curing dispensable materials. Lower hardness means that CIP 60 can serve as a vibration dampening agent and also simplify the reworking process.
应用方案 发布时间 : 2024-10-10
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