Leading Electronic Products into a Direction, 0.2mm Ultra-thin High Thermal Conductivity Pad from Waermtimo
At the beginning of 2021, one type of thermal pad with the thickness of only 0.2mm came out amazingly! This type thermal pad is developed and produced by Waermtimo, which has raised the technical level of domestic thermal pad! Waermtimo has its own R&D team, with advanced technology and production capabilities in the development and production of thermal materials. It has launched the WT series of thermal products, which are widely used in automotive electronics, computers, aviation, communications and other fields. It is worth mentioning that the carbon fiber thermal pad launched by Waermtimo received wide attention from the industry once it came out, leading the new direction of the domestic thermal pad.
When selecting thermal pads in some industries, they will consider several important indicators according to their industry’s requirements for thermal pad: thermal conductivity, ease of use, hardness, thickness, etc. Now the market is increasingly calling for ultra-thin and high thermal conductivity pad. Waermtimo's R&D team responded quickly to market needs. After constant trial and error and correction, it finally succeeded in developing ultra-thin and high thermal conductivity pad. The thermal conductivity of 10/(m·K) can be maintained even when the thickness is 0.2mm. Under the premise of ensuring high thermal conductivity, the thickness of this material is greatly reduced, providing electronic equipment manufacturers with suitable thermal materials.
Ultra-thin high thermal conductivity pad is a kind of thermal pad developed using the carbon fiber orientation sheeting technology developed by WT and using a unique sheet-making process. Because of its ultra-thin and advanced technology, this type thermal pad is superior to traditional thermal pad in terms of thermal conductivity and elasticity.
While improving the physical performance of the original product, it also enhances its own thermal conductivity. This technology can be described as one of the difficulties. Waermtimo integrates its own rich experience, draws on the advanced research and development achievements at home and abroad, and improves the thermal conductivity while compressing the space, maintaining a thermal conductivity of 10W/(m·K) at a thickness of 0.2mm.
Compared with the thermal pads currently on the market, its advantages are very dazzling. The thermal conductivity and physical properties of ultra-thin high thermal pad are enough to attract the attention of related electronics industries, such as: aerospace, automotive electronics, microelectronics consumer products and handhelds Electronic devices, base stations, IGBT modules and other industries.
Nowadays, 5G technology is becoming more and more popular, the popularity of smartphones remains high, and the speed of iterative updates is also rapidly increasing. The updated settings of smartphones have also made huge innovations in the internal space. The ultra-thin and high thermal conductivity pad follow the pace of mobile phone updates to reduce the space and increase the thermal efficiency of the mobile phone, which has won the favor of many smart phone manufacturers. I believe that in the near future, ultra-thin high thermal conductivity pads will be used in more electronic devices that are closely related to people's lives.
Ultra-thin and high thermal conductivity pad not only have the performance of common thermal pad, but still play their due role in the original product production chain, and also play a very amazing role in smart products in the new field. On the basis of the original, ultra-thin high thermal conductivity pad has higher thermal conductivity and reduced thickness. From any point of view, it can be said to be even more powerful for electronic smart products. From the perspective of new technology fields, the prospect of ultra-thin high thermal conductivity pad is very broad!
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本文由玄子转载自Waermtimo News,原文标题为:Leading electronic products into a new direction Ultra-thin high thermal conductivity pad,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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Laird(莱尔德)环形磁芯和巴伦磁芯选型指南
目录- Company Introduction Toroid Cores/Balun Cores QUALITY ASSURANCE Toroid Cores/Balun Cores PART IDENTIFICATION Toroid Cores/Balun Cores STANDARD COMPONENTS FERRITE CORE Toroid Cores/Balun Cores MATERIAL COMPARISON CHART Toroid Cores BALUN CORES FERRITE PROPERTY Magnetic Materials TERMINOLOGY
型号- *T0135-10P,T0121-20P,35 __ ______ - __ __ __,T0130-00P,T0231-70P,N0136-10P,T0501-00H,T1417-10H,T0315-00P,T0625-00H,25T0155-10P,*T0325-00P,T0137-00P,*T0120-80P,35T0155-10P,T0153-00P,*N0372-00P,T0866-00H,T0870-00H,*T0155-10P,T0195-20P,*T0119-10P,T0520-20H,T0120-00,*T0375-30H,*T0120-00P,T0135-40P,*T1142-00H,T0122-00P,T0135-60,*T0135-20P,T0231-00P,T0135-60P,N0136-00P,*T0153-40P,T0119-40P,35T0100-00P,T0100-40,T1417-00H,*T0100-20P,T0175-20P,T0500-40H,T0357-10H,T0238-00P,66T0175-20P,*T0155-80P,*T0231-50P,T0394-00H,T0153-70P,T0157-00P,137-0,*T0155-00P,T1000-00H,*T0119-00P,T1220-00H,N0252-000,*T0135-30P,T0135-00,*N0136-30P,T0190-80P,*T0634-00H,T0231-50P,*T0153-30P,T0190-00P,T0155-20P,*T1220-00H,T1142-10H,*T0866-10H,T0135-10,T0220-00P,*T0175-20P,*T0500-40H,T0153-60P,T0632-00H,35N0136-00P,115-1,*T0231-20P,115-0,T0520-00H,T0101-10P,*T0787-10H,153-0,*T0115-00P,T0100-30P,153-4,T0711-00H,*T0100-00P,*N0277-00P,*T0135-40P,T0190-70P,120-8,T0155-10P,*T0984-00H,*T0551-00H,T1142-00H,*T0154-00P,66T0154-70P,T0145-00P,T0119-00,*T0472-00H,*N0138-00P,T0870-10H,*T0231-30P,T0394-20H,*T0301-00P,*T0119-20P,*T0115-10P,*T0137-00P,T0100-40P,T0122-30P,*T0501-10H,66T0190-80P,*T0130-00P,T0325-00P,*T0520-20H,*T0157-00P,*N0136-10P,T0231-30P,*T0121-20P,*T0394-00H,T0120-80P,119- 4,T0119-10P,66T0231-10P,T0155-00P,121-2,*T0122-00P,T0120-00P,T0395-10H,N0138-00P,*T1000-00H,T0115-10P,T0153-40P,*T0145-00P,*T0870-10H,T0120-80,*T0231-00P,*T0625-00H,*T0238-00P,*T1417-10H,*T0501-00H,T0100-10P,*T0154-70P,66T0220-00P,T0135-00P,*T0195-20P,*T0135-60P,*T0190-70P,35 T ______ - __ __ __,T0115-10,*T0157-10P,T0190-10P,*T0153-00P,T0119-00P,T0122-30,T0375-30H,35T0100 - __ __ __,122-3,145-0,*T0315-00P,T0115-00,*T0866-00H,T0153-30P,*T0870-00H,T0500-00H,*T0500-10H,66T0238-00P,T0155-80P,*T0231-10P,T0119-40,*T1417-00H,66T0153-30P,*T0375-00H,*T0119-40P,T0100-20P,66T0157-00P,T0231-00,T0135-10P,T0634-00H,N0136-30P,*T0190-80P,*T0520-00H,*T0394-20H,*T0101-10P,T0231-10P,*T0153-70P,*T0190-00P,T0472-00H,66T0231-70P,T0100-20,100-4,*T0220-00P,66T0155-00P,T0375-00H,T0154-00P,28T0155-10P,T0155-10,T0787-10H,*T0100-30P,100-2,T0301-00P,T0500-10H,*T0500-00H,T0157-10P,N0277-00P,66T0153-40P,T0135-20P,T0153-60,*N0252-000,T0551-00H,66T0190-70P,*T0135-00P,*T0122-30P,T0231-20P,*T0153-60P,*T0190-10P,*N0136-00P,N0372-00P,T0501-10H,T0119-20P,*T0711-00H,T0100-00,*T0395-10H,*T0100-40P,T0154-70P,35T0155-00P,T0866-10H,T0984-00H,T0115-00P,*T0155-20P,*T0231-70P,*T0632-00H,135-4,135-2,135-6,T0100-00P,T0135-30P,*T1142-10H,135-0,135-1
Thermal Putty vs Thermal Pad: Which Is Right for You?
When it comes to managing heat in electronic devices, selecting the right thermal interface material (TIM) is crucial for ensuring optimal performance and longevity. Among the popular TIM options, thermal putty and thermal pads are widely used. This article explores the key differences to help you choose the best solution for your needs.
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