Alliance Memory Highlighted Latest SRAM, DRAM, eMMC, and Flash Memory ICs at Electronica 2022
KIRKLAND, Wash. — Nov. 7, 2022 — ALLIANCE Memory announced its technology lineup for electronica 2022, taking place Nov. 15-18 at the Trade Fair Center in Munich, Germany. Exhibiting in Hall C3, Stand 328, the company highlighted its latest SRAM, DRAM, eMMC, and flash memory ICs for the communications, computing, embedded, IoT, industrial, and consumer markets.
“It’s hard to believe it’s been four years since electronica was last held,” said David Bagby, president, and CEO of Alliance Memory. “In that time, we’ve been extremely busy expanding our portfolio of memory solutions, whether it’s bolstering our lineup of DDR3 SDRAMs or adding new products like DDR4 SDRAMs and eMMCs. We can’t wait to meet up with our valued distributors and customers to show them what we’ve been up to and how we continue to be their trusted source for a growing range of must-have memory ICs.”
At electronica 2022, Alliance Memory showcased eMMC solutions that integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single package for solid-state storage in consumer, industrial, and networking applications. The devices simplifyed designs for fast and easy system integration — speeding up product development and time to market — while saving space by eliminating the need for an external controller. The solutions were compliant with the JEDEC eMMC v5.1 industry standard and available with densities of 4GB and 8GB. A 16GB device will be released in December 2022.
Built on a finer process that results in a smaller chip than Alliance Memory’s original 4GB DDR4 SDRAMs, new “A” die versions were on display at electronica 2022 that deliver improved performance — with lower power consumption down to +1.2V (±0.06V), faster clock speeds to 1600MHz, and higher transfer rated to 3200Mbps — at a lower cost. The devices were ideal for the industrial, networking, telecommunications, gaming, and consumer markets, for which Alliance Memory is utilizing a dual-sourcing strategy to ensure supply longevity. In addition, the company is offering a 16GB Micron Technology DDR4 SDRAM for a wide range of applications.
Alliance Memory highlighted 3V and 1.8V multiple input/output serial NOR Flash memory products, which are designed to provide supply continuity to Micron Technology customers utilizing discontinued devices. The NOR Flash products combine fast read performance up to 133MHz with the fast program and erase times. Available in 8-pin SOP wide body (208mils) and 8L WSON (6x5mm) packages with densities of 64Mb and 128Mb, the devices provide reliable, long-term performance with high program/erase cycles and long data retention.
In addition, Alliance Memory highlighted its lineup of DDR3 (1.5V) and DDR3L SDRAMs (1.35V), which includes 512Mb, 1Gb, 2Gb, 4Gb, and 8Gb devices in x8/x16 bus widths, offered in 78-ball and 96-ball FBGA packages across commercial, industrial, and automotive temperature ranges. Offering a double data rate architecture for extremely fast transfer rates of up to 2133Mbps/pin and clock rates of 1066MHz, the devices provide reliable drop-in, pin-for-pin compatible replacements for a number of similar solutions used in conjunction with newer-generation microprocessors for industrial, medical, networking, consumer, telecom, aerospace, and automotive applications.
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本文由深蓝的鱼转载自Alliance News，原文标题为:Alliance Memory to Highlight Latest SRAM, DRAM, eMMC, and Flash Memory ICs at electronica 2022，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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Worldwide Leader in Legacy Memory PRODUCT CATALOG 2024
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Compliant to JEDEC V5.1 Standard DuraFlask BGA E340 EMMC,provides s Stable, Yet Cost Effective High-density Embedded Storage
SMART’s DuraFlash BGAE340 eMMC is an embedded memory solution that combines 2D-MLC NAND Flash Memory, an embedded MMC (MultiMediaCard) controller, and advanced firmware in a small BGA (Ball Grid Array) package.
新产品 发布时间 : 2022-01-29
电子商城
现货市场
服务
可烧录MCU/MPU，EPROM,EEPROM,FLASH,Nand Flash, PLD/CPLD,SD Card,TF Card, CF Card,eMMC Card,eMMC,MoviNand, OneNand等各类型IC,IC封装：DIP/SDIP/SOP/MSOP/QSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN.
最小起订量： 1 提交需求>
拥有IC烧录机20余款，100余台设备，可以烧录各种封装的IC；可烧录MCU、FLASH、EMMC、NAND FLASH、EPROM等各类型芯片，支持WIFI/BT模组PCBA烧录、测试。
最小起订量： 1 提交需求>
授权代理品牌：集成电路
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授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
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授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
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