Best Practices in Installation and Testing of Board Level Passive Components for Applications at Frequencies of Ka-Band and Above

时间： 2023-09-20 来源：Smiths Interconnect blogs

代理服务

技术支持

批量订货

As the applications in modern telecommunications shift towards K-band and Ku-band so does the need for RF components and systems at these frequencies.

The telecommunications industry and community have been dealing with the issue of radio spectrum allocation and congestion for many years. Radio spectrum represents a natural resource whose allocation must be carefully managed to achieve its optimal use. Over the last few decades, standard 2.4 GHz band radio spectrums have become more congested and demand for prime positioning in this radio band spectrum is limited.

The most natural way to reduce the problem is by allocating higher frequencies to new applications. This shift of radio wave ecosystems towards higher frequencies brings its own challenges, as RF chip components are getting increasingly smaller and more complex to manufacture.

To properly support introduction of new technologies at high frequencies, all aspects of component design and development must be considered including the choice of high frequency fixture, test board preparation, proper DUT installation and finally, production-level testing. New design techniques must be applied through RF simulation tools, improved controlled manufacturing processes and utilizing more accurate test fixtures and procedures.

Test Board Preparation:
During preparation carefully inspect all the components of the test fixture to be assembled (test boards and DUT chips) for any damage and burrs. Rough edges of the test board may cause fixture assembly issues and therefore should be cleaned up using fine grit sandpaper.
*Important to sand square and evenly and always finish with a very fine grit (600 min.)

Proper Installation (SMT and Wire Bonding):
SMT, Surface Mount Installation:
For proper SMT installation chip terminations need to be properly centered and aligned. Surface mount installation (SMT) usually consists of chip (DUT) tinning, flux application to the test board, chip positioning (placement) and reflow.

Wire Bonding Installation:
Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. For proper wire bonding installation pay close attention to the cleanliness of the parts and equipment, preheat the parts to be bonded (adjust the temperature based on the bond metallization as well as the type and size of wire or ribbon)
*Short ribbon bonds with the width equal to that of 50 ohm transmission line provide the best RF performance.

Mounting:
The final step in the fixture assembly is mounting the connector on the test board. Then, the DUT is to be installed which starts with the careful inspection of all the components of the test fixture to be assembled. Special attention should be given to the test board edges as common PCB manufacturing often leave rough edges that can cause fixture assembly issues. The edges of the test board can usually be cleaned up using fine grit sandpaper. The DUT tends to move during solder reflow. To prevent this, pure indium solder could be used. The indium solder is very soft and the DUT can be pressed into the solder before reflow which allows for fine adjustment of the DUT to the transmission line and insures that the DUT is flush with the test board. When the DUT is reflowed, it remains in place. Finally, the DUT need to be connected to the transmission line. The standard practice is to center the connector pin on the transmission line and ensure that the connector is flush with the edge of the test board to avoid any undesired air gaps. There are primarily two types of connection methods - ribbon and wire bonding. Short ribbon bonds provide the best RF performance, but wire bonding is the most popular.
*Always follow best practices in connector installation that are usually supplied by the connector.

Production-level (high-volume) Testing:
In production-level RF test, DUTs must be verified for RF performance by test methods that use non-solder contact of signal and ground pads. This test method is referred to as ‘push-on’ testing. The development of a push-on test fixture in addition to the design of an RF component is an essential part of each project. This approach results in an establishment of a good correlation between soldered and non-soldered performance of the tested RF component as the PCB is the same structure in both measurements. Having a push-on fixture enables a non-destructive test that is required in many applications. The non-destructive test fixture may be fully developed and tailored to a specific design or a standardized pre-manufactured test fixture used.

For additional support on fxiture preparation and RF test please download our White Paper: Fixture Preparation and RF Test of SMT Board Level components at High Frequencies.

The development of RF components that operate at increasingly higher frequencies requires new simulation techniques and test methodologies that consider the specific behavior of electromagnetic waves at frequencies of Ka-band and above. The test fixture in a sense electrically becomes the part of the DUT that affects its performance. This poses a significant challenge as the electrical performance of an RF device can be guaranteed only in a specific environment. Through collaboration between the RF component development team and the customer, all the necessary information about the application of the to-be-developed RF component is to be used to optimize the RF component for the best possible performance.

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由涂抹转载自Smiths Interconnect blogs，原文标题为:Best Practices in Installation and Testing of Board Level Passive Components for Applications at Frequencies of Ka-Band and Above，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

全部评论（0）

暂无评论

Semiconductor Test Sockets: Key to Shipping Quality ICs

Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and RF products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications and industrial markets. The company has 25 sales, R＆D and manufacturing locations in 12 countries in the Americas, EMEA and Asia-Pacific.

2024-05-06 - 技术探讨

FAQs at Smiths Interconnect: Test Sockets, Capabilities, and Support

At Smiths Interconnect, we receive some of the same questions repeatedly, so we’d like to offer up those answers early on for our existing and potential customers. Here are some of our most frequently asked questions, and if you still have thoughts, questions, or concerns, we’re here to help!

2023-12-15 - 技术探讨

Smiths Interconnect 微波元器件选型指南

描述- Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the Defence and Aerospace, Communications and Industrial markets.

型号- 82 7013TC,32 1209,83 7017TC,33 1052,HPR2F,D3PP20F,CR0402D,33 1050,DS15D10,42WXX.00F,SMT2010TALN,32 1200,82 3003TC,32 1201,81 7042,32P7201F,31 7021,81 3012B,KTVA SERIES,HE298MF,12-0101,12-0102,13-125-T,82 7001TC,81 7021TC,83 7006TC,33 1041,4113P,33 1042,QTVA,8485 SERIES,82 3038TC,32 1212,SMT2010*A,42UW SERIES,32 1213,81 3001B,81 3001A,81 3033TC,42TVA,CR1010D50,5W2,SXUXXXX3F,DS15D20,SMT3737*ALN,CA0505D T,4112P,42KA,P2D50J,DN05W20F,811,812,49XX,83 1001TC,4111P,SD055-055-4-A,82 7025TC,SD055-055-4-B,SD065-035-3-B,5654 XXX,5,TS0710S,82 3039TC,CR1010D50,5TB,81 7031,32 1111,32 1117,81 3011B,81 3011A,5308 XXX,5,81 7028,31 7008,31 7006,5660 XXX,5,32-7172F,823,827,82 7002TC,HPP2F,HN05W03F,HRM,32 1002,32 1123,32 1121,HRT,SD130-105-4-040,83 3005TC,32 1001,32 1122,D3PPXXF,32 1006,32 1007,32 1004,82 7166TC,82 3001TC,32 1005,81 3001TC,CT3725,33 1009,33 1005,33 1006,33 1003,12-250-T,CA0505DXXFT,33 1004,SMT2010*ALN,CT2335TALN,4110J,33 1001,33 1002,SD055-055-3-B,SD065-035-4-A,32P7204F,SD065-035-4-B,83 8999,HRTVA,83 3016TC,TVA SERIES,32 1014,81 3035TC,HR03,32 1138,32 1017,HR05,32 1137,81 3012TC,CT1310D,11-125-T,32 SERIES,D2PL05F,841X SERIES,CT3737,841,842,843,HD064M3F,83-7027-10.00F,846,CT2525,AN7 SERIES,83 7999,ETVA SERIES,12-250-TP,83 3006TC,QFA,32 1026,CT3725_ALNS,CT1206,AN11 SERIES,CT3737TALN,33 1021,TS07,TS06,83 1003TC,TS05,TS04,TS03,CT2335*ALN,5653,42TVA SERIES,32 1035,32 1156,81 3034TC,32 1036,32 1157,32 1034,DN15D10F,32 1039,32 1158,32 1037,TS09,CT0505DT,32 1160,WH0825F,CA0505D,32 1161,32 1041,32 1162,QTVA03N0SMTF,SXXXX-XXX-X-XXX,33 1017,81 7043TC,CR0402D SERIES,QFAXX0XSMTF,81 3008B,TS0620F,31AZ021-050-5F,81 3003TC,CT0505D SERIES,82 7187TC,81-Z008TC-100-5F,SD055-055-4-015,8482 SERIES,32 7037,83 3994TC,875,HRMTVA,D2PLXXF,5657,5659,CR0603D,SD065-035-4-025,CT2010*A,SMT3725,QTVA SERIES,81 7108TC,82 3019TC,5 SERIES,CT3725F,82 7176TC,CT0505DTB,83 3999,32 7163,12-5061,SD045-025-4-A,83 3998,32 7164,SD045-025-4-B,32 7165,SD050-020-3-B,83 3995,CA0505D FT,5307,843X SERIES,CT1206*ALN,AN5 SERIES,81 3006A,82 3008TC,CR0505D,5323,HR0520AW3S,81 3006B,SXU15203F,83 1996TC,81 3002TC,823X SERIES,82 3213TC,SD120-080-5-A,XPDF,31 1099,12-5050,31 1098,12-5051,32 7176,32 7172,8488 SERIES,81 7109TC,CT1005TALN,XFMRF,MTVA0300N05W3S,SXU00203F,SD105-105-4-035,811X SERIES,12-5042,SD045-025-3-B,32 7187,12-5049,81 3123TC,73-0160-100,5310 XXX,5,82 3005TC,12-5032,81 3036,WTVA0300N05SMTF,SMT252503ALN2F,32 7196,42S,81 3032,81 3031,42W,82 7030TC,TS0410S,32 7195,SXU20103TF,83 7011TC,83 7034TC,SMT2525*A,TS0910SMTF,32 7191,81 3039,AN3,AN5,CR040W2 SERIES,AN7,81 3005B,81 3005A,31 7110,83 1006TC,CT0505,12-5021,812X SERIES,31 7109,CR040W2,31 7108,41 SERIES,XPMRF,31 7107,11-250-TP,12-5029,42UW,81 7008TC,12-5028,83 7023TC,SMT2525*ALN,CT1005*A,P4L35G,AN SERIES,8750,82 3006TC,82 3029TC,81 3027TC,81 3002A,HPK2F,82 7163TC,D3MDXXF,D15D20,COAX TVA,81A7042_-100-5F,83 3997TC,12-5014,12-5012,12-5013,CT3725*ALN,81 3003B,81 3003A,81 7107TC,842X SERIES,KTVA,12-5007,42S SERIES,12-5005,CT0402,KTVA0300N052F,8750 SERIES,TVA,HR0320AW3S,81 3028,D2PK02F,81 7001B,D3PV30F,32P7196F,HRM030AN05W3S,AN5-XNXF,SMT1206 *ALN,31 1033,31 1035,31 1034,31A7021-050-5F,P3S35J,P3S35L,8487 SERIES,RPD0212F,TRP 4-12,82 7172TC,SMT3725*ALN,82 3030TC,12 SERIES,41XXPCD,SD105-105-4-A,8XXX,SD105-105-4-B,81 7006TC,81 3006TC,SMT3737*A,WTVA SERIES,KFA,SMT SERIES,KFAXX.00-5SMTF,31 1010,841X,D2PJXXF,TRM4-12_XXX,5,33 7023,CTVA0300N05W3F,5326 XXX,5,83 SERIES,83 7044,WTVA,83 7046,83 7047,SMT3725*A,DN05Z15F,82 7150TC,82 3031TC,HPCA5410.00W3S,SXU10203TF,827X SERIES,31 1021,42 SERIES,842X,CT0402D,SMT3725TALN,42TVA0300N05F,HE128MF,12-3022,42,CR1010D,4112PLC,HLB2F,31 1086,SXU00303F,CT0603D SERIES,33-7XXX-XX.XXF,31 1076,33 7002,843X,33 7001,33 7004,CR0603D SERIES,33 7005,D2PJ30F,12-3007,P4L50G,31 1094,TRM 4-12,5318 XXX,5,82 3051TC,MTVA,31 1089,82A7176TCF,HPX2F,SMT372501AIN2MF,BD064M3F,12-3005,P2S35D,CT0505D,12-3002,SD045-025-4-015,12-3001,SMT3737,81 3008TC,SMT2525,CTVA,846X,D2DL20F,32P7198F,HRTVA SERIES,83 3021TC,D3PVXXF,HPG2F,42KA SERIES,82 3040TC,31 1059,32-1003,31 1054,83 8054,CT1310D SERIES,8487,8485,823X,8488,TRP 6-12,32P7197F,31 1075,12-125-T,31 1074,8482,TRP 6-18,SXU15303F,846X SERIES,81AZ042-100-5F,32 7024,32 7025,CT2525*ALN,32 7027,13-250-T,5653ALN,32 7023,TVA0300N05W3S,5318XXX5,42W SERIES,CT0402D SERIES,82 7017TC,812X,XPRF,5309L,32 1046,32 1047,32 1168,HPD2TF,82 3045TC,HD128M3F,CTVA SERIES,32 1050,AN11,32 1051,SD130-105-3-B,CT2335*A,811X,81-SERIES,4111PCD,82 7005TC,13-125-TP,TS0320W1S,11-250-T,32 1055,CR0505DT2,SMT372503ALN2F,TRM 8-18,81 3075TC,CR0505D SERIES,32 1184,D3FUXXF,CR0505DTB,81 3002BV,HPCA,32 1068,HDC2F,82 3023TC,HE450M2F,CT2525TALN,5307ALN,33 700,32 1070,32 1191,SD130-105-4-B,32 1196,SD130-105-4-A,32 1074,HG064M2F,82 SERIES,CT0603D,RPDXXXXF,CT1005,CT2335,HRMTVA SERIES,827X,RPD0412F,CR0402D W2,82 3209TC,KTVA0300N055SMTF,83 7009TC,82 7192TE,32 1198,32 1199,82 3012TC,81 3074TC,32M7200,12-0001SF,4915,CA0505DXX,32P7197,HRT030AN05W3S,4910,HDS2F,TS0520W1S,83 7014,ETVA0300N05S,82 7015TC,81-7008TC-1005F,RPD0312F,

2020/11/5 - SMITHS INTERCONNECT - 选型指南 - Version 1.0

Smiths Interconnect 线缆组件选型指南

目录- Company and product introduction Cable Semi-Rigid/Conformable/Flexible Cable Semi-Rigid Low Loss Cable MIL-C-17/RG Series Cable LMR Cable Cable Assembly Options Cable Application Notes Cable Engineering Data Introduction

型号- RG405,402TP,RG401,LMR-240,RD316,RG402,405TP,SMS-RG142_-18.0-SMS±2.8PS,LMR-240-LLPL,LMR-400,250TP,LMR-400-LLPL,AL250LLTP,LMR-400-UF,LMR-100A-PVC,SF316,LMR-240-DB,AL141LLSP,BJ085,LMR-400-DB,142D,BJ141,LMR-195,RG316,KMS-AL141LLSP_-12.0-KMS±2.8PS,SF 142,LMR-240-UF,AL141TP,BJ047,SMS-BJ085-18.0-SMR±2.8PS,SMS_100_24.0-SMS_,AL085TP,RG223,316D,RG400,AL085LLSP,RG142

2020 - SMITHS INTERCONNECT,EMC RFLABS - 选型指南 - Version 1.0 代理服务技术支持批量订货

Railway Connectivity Solutions

型号- HYPERMOD SERIES,HDC SERIES,HBB SERIES,C SERIES,BOA SERIES,L SERIES,B SERIES,TRANSFORMER HEAVY POWER SERIES,M12 SERIES,F SERIES,H/N SERIES,LAB-FLEX® SERIES,LHS SERIES,CEA SERIES,LHZ SERIES,REP SERIES

2022/8/17 - SMITHS INTERCONNECT - 商品及供应商介绍 - Version 2.1 查看更多版本

SWaP challenges in the defence industry: How Smiths Interconnect rises to the challenge

The defence industry has exceptionally high connectivity demands, especially when it comes to size, weight and power (SWaP). Smiths Interconnect is an industry-leading provider of cutting-edge connectivity solutions to the defence sector for applications such as guidance systems, data links, manpack radios, radar systems (ground, air and shipboard), antenna systems and drones.

2024-02-28 - 原厂动态代理服务技术支持批量订货

Commercial Aerospace Connectivity Solutions

2024/4/12 - SMITHS INTERCONNECT - 商品及供应商介绍 - Version 3.2 查看更多版本

Fixture Preparation and RF Test of SMT BoardLevel Components at High Frequencies SMT Board Level Components

09.03.2020 - SMITHS INTERCONNECT - 白皮书 - Rev. A 代理服务技术支持批量订货

Space Connectivity Solutions

型号- HC SERIES,K2TVA,AURORA,MWC,KU SERIES,AURORA SERIES,MWC SERIES,QT SERIES

2024/4/12 - SMITHS INTERCONNECT - 商品及供应商介绍 - Version 3.2 代理服务技术支持批量订货查看更多版本

Revolutionizing Space Component Engineering: Smiths Interconnect‘s Space Qualification and Rapid Engineering Laboratory

Smiths Interconnect recently announced its successful bid for approximately £2 million in funding from the UK Space Agency‘s ‘Space Clusters Infrastructure Fund‘ (SCIF). This significant grant, with another £2 million in matched funding by Smiths Interconnect, will help fortify Smiths Interconnect‘s position in the international space sector by enhancing its Space Qualification Laboratory in Dundee, Scotland. The space qualification laboratory plays a pivotal role in simulating the harsh conditions of space, ensuring the quality and durability of space components.

2024-01-24 - 原厂动态代理服务技术支持批量订货

Smiths Interconnect Announced New E-Band WR12 Waveguide Passive Components Handling High Levels of Forward and Reflected RF Power

Smiths Interconnect announced that it is extending its broad range of passive components in E-band with the addition of WR12 couplers, loads, and isolators. The WR12 E-band isolator utilizes a novel design approach selected to be able to handle high levels of forward and reflected RF power.

2023-08-19 - 新产品代理服务技术支持批量订货

Defense Connectivity Solutions

2024/4/9 - SMITHS INTERCONNECT - 商品及供应商介绍 - Version 3.2 查看更多版本

FM 628369 QUALITY MANAGEMENT SYSTEM - EN 9100:2018 bsi Certificate of Registration

2019-01-21 - SMITHS INTERCONNECT - 测试报告代理服务技术支持批量订货

Smiths Interconnect Has Extended Its Broad Range of Coaxial Coupler Components in UHF to Ku-Band

Smiths Interconnect has extended its broad range of coaxial coupler components in UHF to Ku-Band. The comprehensive range of coaxial coupler components is designed for mission-critical applications including GEO/MEO and LEO payloads, launch systems, and deep space mission management.

2022-12-09 - 原厂动态代理服务技术支持批量订货

Keeping the Skies Connected

Following on from a rebranding and strategic re-organisation, Mike Richardson catches up with interconnect specialist, Smiths Interconnect to discover how the company ‘whole’ has become greater than the sum of its parts. The company offers a range of technically differentiated connectivity solutions and prides itself in providing applications through superior connectivity.

2024-04-18 - 原厂动态代理服务技术支持批量订货