【产品】高导电性的填充银粉单组分导电硅胶PRO-SHIELD®7008,具有卓越的EMI屏蔽性能
PARKER CHOMERICS 推出一款具有高度导电性的填充银粉的单组分导电硅胶PRO-SHIELD 7008。它可用作密封剂或间隙填料以及专门用于需要高电磁干扰(EMI)屏蔽的应用。
PRO-SHIELD 7008导电密封胶的实物图
PRO-SHIELD 7008的纯银填料为电子组件和天线的电气接地提供了良好的导电性。通过包装在30 CC的注射器里面,PRO-SHIELD 7008几乎没有浪费地为那些需要分配小粒径颗粒的应用提供了一个优质的导电密封解决方案。
PRO-SHIELD 7008导电密封胶的特点:
•使用方便
•单一组分- 无需混合或沉重
•湿固化硅胶 - 4小时无粘性,3天后完全固化
•体积电阻率小于0.030 ohm-cm
•屏蔽效能:70-110 dB
•搭接剪切强度:125 PSI
PRO-SHIELD 7008导电密封胶的典型应用:
•组件或硬件接地
•电子组件
•医疗设备
•工业机柜
•接入面板
•发动机控制模块(ECM)
•电信基础设施
•便携式电子产品
PRO-SHIELD 7008导电密封胶的订货信息:
底漆不包括在内。 为获得最佳粘合效果,Chomerics建议在使用PRO-SHIELD 7008之前先将PRO-SHIELD 7201底漆涂在清洁和脱脂的基材上。
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本文由Adward翻译自Parker Chomerics,版权归世强硬创平台所有,非经授权,任何媒体、网站或个人不得转载,授权转载时须注明“来源:世强硬创平台”。
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