The Analysis of Market Trend & Pricing of SMART Modular

2022-01-20 SMART
Modular,SMART Modular,SMART Modular,SMART Modular,SMART

From there we'd like to move forward and provide you with a variety of contents about SMART Modular. Each monthly or quarterly issue will deliver updates from different topics as below: 

  • Market trend & pricing

  • Product introduction

  • Event notice 

  • News release 

  • Downloads (product brochures & briefs, white papers, others)


Market Trend & Pricing

  • Mobile Market: 

    • Shipment has grown in Q3, 21'based on QoQ but YoY is approximately down 6% due to material gap

    • 1-digit down of YoY in Q4 can be foreseen as a result from the gap

    • Decreasing shipment may cause oversupply of NAND since mobile takes a major consumption of NAND flash

  • Server Market: 

    • Demand remains strong but cannot be fulfilled due to material gap 

    • Market pricing of server DRAM will start to get soft due to above factor 

  • PC/NB Market : 

    • The season of Chromebook has passed and office-type NB seems to be saturated as well while parts shortage is mitigated. 

    • PC DRAM pricing is expected to be declined significantly from weak demand

  • Conclusion : 

    • The component gap makes system buyer prudent in Q4

    • Inventory level is expected to stack up among most of mid-downstream memory traders

  • Q4 Price Projection :

    • DRAM IC expects to drop in 1-digit range 4-6% 

    • PC DRAM module expects to drop significantly up to 1-digit range 3-5% 

    • Server DRAM module expects to keep stable or slightly drop in 1-digit range 1-3%

    • NAND Flash IC expects to drop within 1-digit range 5%

    • Client TLC SSD expect to be stable or drop slightly 2-3%  



Featured  Solution

When it comes to industrial applications, access to systems that operate in harsh environments is sometimes difficult, so it‘s important to design a durable system that can withstand a variety of environmental conditions. 

  • When you have following requirements for industrial application, here are our picks:

Withstand a variety of environmental conditions

  • Data security during transmission

  • Storage with a small footprint in space-constrained locations


授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
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