【产品】单组份无溶剂、粘度低至650cps的电子密封胶8103

时间： 2021-07-30 来源：禧合

技术问答

电子密封胶 8103是禧合应用材料开发的一款单组无溶剂、室温湿气固化硅胶粘接剂。8103具有较强的内聚力及一定的粘接强度，固化后形成永久的隔离层隔开水气及大气中的污染物，非常适用于提高敏感电路及元器件可靠性，延长其使用寿命，以及室温固化工艺下的PET壳料及金属等多种材料的粘接。

产品特点

• 使用方便：单组份无溶剂，无需通风；常温固化无需加热，表干快，表干时间≤10min；

• 粘度低：很低的粘度，达到650cps，良好的缝隙填充性能，涂覆后可自流平；

• 粘接范围广：对多种金属及非金属材料(玻璃、陶瓷)、塑料之间都有良好粘结性；

• 耐候性佳：宽广的适用温度范围，优异的耐老化性和绝缘、抗震防冲击性能；

• 绿色环保：产品符合欧盟RoHS2.0指令、低卤环保要求，中性固化，对绝大多数金属无腐蚀。

产品参数

典型应用

• 刚性/柔性线路板的保护&粘接，缆线终端与连接器间保护

• LCM模组模块的ITO防潮保护

• 晶振，印刷电路板及厚薄混合电路板的三防涂层

• 各类传感器、LED模块组装灌封

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