【选型】微型散热器T-WING用于快充接头散热设计，满足产品防火要求，厚度仅为0.178mm

时间： 2022-11-17 来源：世强

技术问答

快充接头已经在手机和平板电脑等产品中得到广泛应用，由于其体积小，工作电流大，热量堆积产生的高温会影响芯片的可靠性，因此散热问题是产品设计的难点。

常规的散热方案是利用导热硅脂填充热源芯片到外壳之间的缝隙，但这会导致快充接头外壳温度很高，推荐PARKER CHOMERICS的微型散热器 T-WING，整体厚度13mil（0.33mm），由电绝缘薄膜、PSA、铜箔组成，至少降低芯片温度10℃以上，以下是T-WING典型性能参数：

1、快充接头的核心器件是AC-DC控制芯片，在工作过程中发热量较大，采用传统的导热硅脂填充的方案会导致外壳温度很高，推荐采用Parker Chomerics的微型散热器T-WING，热导体是超薄的铜箔，厚度仅为0.178mm，通过PSA直接粘合到热源芯片表面，可以与不平整表面接近100%粘结，迅速将热量传递到空气中，降低AC-DC控制芯片的结温。

2、快充接头内部有多种不同高度的器件，需要灵活的散热方案，T-WING微型散热器提供0.5*2mm、0.5*3mm、0.75*3mm、1*3mm、1*4mm和1.5*4mm六种标准尺寸，还可以根据客户需求定制，满足不同的散热需求，其操作过程中便于剥离和粘贴到各种表面，施加的应力小，降低损坏器件的风险。

3、快充接头是涉及到人身安全的消费品，对器件阻燃等级有较高的要求，T-WING满足UL94 V0标准，满足产品防火的要求，以下是T-WING的典型应用。

图1 T-WING微型散热器典型应用

综上所述，Parker Chomerics的微型散热器T-WING具有体积小、重量轻、降低热源芯片工作温度的特性，是快充接头等小尺寸消费品散热方案的优秀选择。

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