【产品】采用32 ×32红外热电堆阵列的MTPA3232501温度传感器模块,可实现非接触式温度测量
KODENSHI(可天士)推出的MTPA3232501是一款温度传感器模块,采用了32 ×32像素的红外热电堆阵列,可以实现非接触式温度测量。它集成了环境温度传感器和用于温度转换的CPU,可输出温度值。
MTPA3232501温度传感器模块特点:
· 接口:I2C输出
· 非接触式温度分布测量
· 内置环境温度传感器和CPU
· 基板尺寸:38×22mm
MTPA3232501温度传感器模块应用:
简易热成像、空调、微波炉、自动门、安全、数字标牌、节能办公
最大额定值(Ta=25℃):
光电特性(Ta=25℃):
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