Smiths Interconnect Expands into Burn-In Test Market with Acquisition of Plastronics

时间： 2023-01-10 来源：Smiths Interconnect News

代理服务

技术支持

采购服务

Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment, as well as custom connectors for industrial applications.

Plastronics’ technology, products, and capabilities complement and strengthen Smiths Interconnect’s existing portfolio of products and support the company’s ambition to be the partner of choice for semiconductor test customers around the world.

The acquisition brings growth opportunities for both semiconductor tests and connectors. It also provides cross-selling opportunities in both Asia and the US by leveraging the combined sales and manufacturing footprint of the companies.

Smiths Interconnect President Julian Fagge said: "I am delighted to welcome Plastronics to the Smiths Interconnect family of technology brands. We are proud of our heritage of supplying technically differentiated components critical to our customers’ products and operations. Plastronics fits very well with our long-term strategy, adding new technology, products, and capabilities to the business and strengthening our position across our customer base”.

Plastronics is headquartered in Irving, Texas.

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由星晴123转载自Smiths Interconnect News，原文标题为:Smiths Interconnect expands into burn-in test market with acquisition of Plastronics，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

全部评论（0）

暂无评论

Smiths Interconnect Socket Improving Time-and Cost-efficiency In Reliability Burn-in Testing

When companies develop new devices, they must ensure there are no failures in the field. This means that thorough reliability burn-in testing must take place from the start to avoid malfunctions down the road.

2023-09-17 - 原厂动态代理服务技术支持采购服务

Boosting the Bottom Line. Choosing Smiths Interconnect Contact Technology for Your Connectivity

Smiths Interconnect engineering team used spring probe contacts and RF engineering, developing a grid array-based solution, replacing the existing expensive coaxial contacts with specially arranged non-magnetic Hyperspring® contacts.

2023-08-04 - 原厂动态代理服务技术支持采购服务

Smiths Interconnect Has a Very Large Portfolio of Existing Coaxial Isolators and Circulators for Space or Defence Applications

As it is impractical to solder the piece parts externally and pass the assembly into the cavity, Smiths Interconnect uses a contactless induction soldering and inspect the resultant solder joints using a Smiths Interconnect in-house 3D x-ray machine, whose 160keV beam makes short work of up to 5mm of steel.

2023-04-27 - 原厂动态代理服务技术支持采购服务

Smiths Interconnect announced New Custom Grid Array technology for medical applications with RF performance from DC to 300MHz

Smiths Interconnect announced the introduction of a new contact technology for the medical market segment, the Custom Grid Array. The new technology offers a contact layout using spring probe and target contacts to deliver the same RF performance as cabled coaxial solutions, with improved signal integrity.

2022-10-08 - 新技术代理服务技术支持采购服务

工业连接解决方案

描述- Smiths Interconnect是一家领先的工业连接解决方案提供商，专注于为国防与航天、通信和工业市场提供技术先进的电子组件、子系统、微波、光学和射频产品。其产品包括高集成度组装到微型连接器，并提供电缆组装、原型制作、仪表外壳、电气建模和测试等多种增值服务。公司采用创新的超薄球面接触技术和多种连接技术，满足各种应用需求，并在全球范围内提供服务和支持。

型号- MR,HCS,HC

2023/3/3 - SMITHS INTERCONNECT - 商品及供应商介绍 - Version 1 代理服务技术支持采购服务

High-Power Burn-In Testing in 2023: How to Overcome the Extreme

Semiconductor devices are running at such heat, it can be difficult to establish that balance of temperature with the right components within the application. Which internal pieces will be able to ensure high functionality and longevity through the heat? As an industry, we look to next-generation electronics to fill that gap with reliable high-power burn-in sockets that can withstand these unprecedented temperatures and conditions.

2023-08-07 - 设计经验代理服务技术支持采购服务

Smiths Interconnect announced the launch of its Volta 200 Series Probe Head to Enhance Wafer Test Production Efficiency

A departure from cantilever and more traditional vertical probe technologies, the Volta Series enables quicker test set-up time and online cleaning ＆ maintenance while assuring impeccable site to site planarity. These benefits are a result of using spring probe contacts and a proprietary engineered housing material.

2023-11-01 - 产品代理服务技术支持采购服务

电池触点和燕尾形连接器高度可配置的弹簧探头连接器

型号- C□2.5□□□□□,C SERIES,DC□2.5□□□□□

2024/1/30 - SMITHS INTERCONNECT - 商品及供应商介绍 - Version 1.1 代理服务技术支持采购服务查看更多版本

QN系列加速寿命测试解决方案

描述- 该资料介绍了Smiths Interconnect公司生产的QN系列烧录插座，用于下一代IC封装的高可靠性测试。这些插座具有模块化设计，适用于多种QFN封装，并提供广泛的尺寸和配置选项。

型号- QN-SERIES,QN SERIES

2023/8/2 - SMITHS INTERCONNECT - 数据手册 - Version 1.0 代理服务技术支持采购服务

K系列H-Pin插座加速寿命测试解决方案

描述- 该资料介绍了Smiths Interconnect公司生产的K-Series H-Pin Socket加速寿命测试解决方案。它采用H-Pin技术，适用于下一代集成电路包的高可靠性测试。产品具有行业验证的设计、内部工具、模具和加工，以及自动化组装。特性包括零标记盖子操作以提高产量，垂直压力平台，热沉功能，集成温度控制等。

型号- K-SERIES

2023/7/29 - SMITHS INTERCONNECT - 数据手册 - Version 1.0 代理服务技术支持采购服务

8 Advantages to Know About Spring Probe Contact Technology in the Space Industry

In summary, spring probe contact technology can provide significant benefits in space and satellite applications over traditional pin and socket connector systems. It is critical to fully understand the application requirements to best balance the design trade-offs to make the best implementation of spring probe contacts and connectors to meet the reliability and efficient design needs of today’s satellite and space craft challenges.

2023-09-19 - 设计经验代理服务技术支持采购服务

QH系列H-PIN插座加速寿命测试解决方案

描述- 本资料介绍了Smiths Interconnect公司生产的QH系列高可靠性测试插座。该系列产品采用H-Pin技术，适用于下一代集成电路包的高可靠性测试，具有小型化设计、广泛的可配置选项和高频、高电流、高温等特性。

型号- QH-SERIES,QH SERIES

2023/7/29 - SMITHS INTERCONNECT - 数据手册 - Version 1.0 代理服务技术支持采购服务

What is Thermal Simulation and Why is it Important to Reliability Burn-in Testing?

Not every semiconductor manufacturer utilizes thermal simulation in their reliability testing setup. Lower power burn-in allows for an acceptable temperature rise within the package/die in a traditional burn-in chamber running at 125℃. As packages in burn-in are moving to higher power output, socket, and burn-in systems may need to have enhanced features to manage the desired target die temps.

2023-11-22 - 技术探讨代理服务技术支持采购服务

弹簧探针松动探针和连接器解决方案

描述- Smiths Interconnect作为弹簧接触探头设计的领导者，提供了一系列低轮廓、高兼容性的弹簧探头解决方案。这些探头具有高频率、低稳定电阻、高电流承载能力和长插入寿命等特点，适用于各种连接器应用，包括盲接、高频率信号传输、恶劣环境下的密封连接等。资料中详细介绍了不同型号的探头规格、尺寸和材料，以及如何订购。

型号- 101111,305330-000,101190,101549,101506,101628,101402-000,100410,100410-005,PI-5327,100891-002,100671,101628-000,101247-001,101582-000,100671-000,100606-000,101050-003,PI-5329,101712-000,PI-5328,101119-001,101549-000,101506-000,101190-002,101438-000,101111-008,101679,101712,101438,101119,101050,101294,100804-002,305327-000,305328-000,101050-005,101294-000,PI-5330,305329-000,101247,101402,101582,100891,100803-011,101679-000,101530-000,100803,100606,100804,101530

2020/11/01 - SMITHS INTERCONNECT - 商品及供应商介绍 - Version 1.0 代理服务技术支持采购服务