Apacer‘s New 112-layer BiCS5 3D TLC Industrial Cards Now Available Optimized for Smart IoT and AI Facial Recognition
According to research from Mordor Intelligence, the facial recognition market was valued at USD 3.72 billion in 2020, and is projected to be valued at USD 11.62 billion by 2026, registering a CAGR of approximately 21.71% over the forecast period. Facial recognition technology is finally coming into its own. It has gone beyond police officers looking for a suspect on a surveillance camera. Now, smart AI-driven facial recognition technology is common in smart retail, finance, transportation and even healthcare applications. But as adoption spreads, facial recognition devices are being required to operate in ever-more-challenging locations and environments. Keeping all these developments in mind, Apacer developed and has now released the CH120 series of industrial cards powered by the latest 112-layer BiCS5 3D TLC NAND technology, optimized for both AI facial recognition and smart IoT applications.
BiCS5 promises concrete, measurable advantages for SSDs, as it greatly improves capacity while keeping transmission latency ultra-low. In fact, Apacer's A2-grade CH120 series offers 4,000/2,000 IOPS for 4K image read/write performance. And compromised environments won’t slow these cards down either – their wide temperature range means they operate smoothly in temperatures as low as -40 and as high as 85 degrees Celsius. The CH120 series of industrial cards are also equipped with value-adding over-provisioning and SLC-liteX technology. The former drastically reduces write amplification, extending an SSD's operational lifespan, while the latter allows an SSD to increase its endurance to up to 30,000 P/E cycles. That's 10 times higher than standard 3D TLC SSDs.
The CH120 series of industrial cards are just the latest examples of how Apacer is living up to its brand spirit of “Adding Value, Enhancing Collaboration.” They stand in a diverse BiCS5 3D TLC product lineup that includes the ST250 2.5-inch drives and the M.2 2280 industrial SSDs. Even greater upgrades in terms of capacity, latency and reliability are set to come as Apacer looks towards 2022 – offering appealing advantages for 5G, smart IoT, edge computing, secure surveillance, smart healthcare, and deep learning applications.
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本文由江枫转载自Apacer，原文标题为:Apacer’s 112-layer BiCS5 3D TLC Industrial Cards Now Available Optimized for Smart IoT and AI Facial Recognition，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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适用于医疗保健应用的工业级SSD和DRAM解决方案
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型号- CH120-MSD,SH250-M242,VLP ECC SODIMM,CV120-MSD,UV110-UFD1,PV220-M280,SV250-25,VLP ECC UDIMM,CH710-CF,PV910-M280,RDIMM,ECC UDIMM,UV110-UFD5,SV250-M280,UH110-UFD1,SODIMM,ECC SODIMM,PV210-M280,SV250-M242
Apacer Collaborates with Onyx to Demonstrate Healthcare-Optimized Solutions at HIMSS
Apacer’s brand-new combination of CoreSnapshot and CoreRescue Auto Self Recovery (ASR) and Self Recovery through USB Drive (USR) was part of a collaboration with the well-known healthcare equipment provider Onyx.
2022年第1季度工业级固态硬盘产品路线图卡，USB，PATA外形规格
描述- 本资料详细介绍了Apacer工业级固态存储产品的路线图，包括CF卡、SD/microSD卡、USB模块、USB驱动器和PATA 2.5英寸驱动器等。资料中涵盖了不同型号的产品规格、性能参数、存储容量、接口类型、耐用性、工作温度范围以及应用领域等信息。此外，还提供了不同型号产品的比较表格，以便用户选择合适的产品。
型号- UV110-UFM3,UV110-UFM2,UDM2 PLUS,MICROSD R1,UV110-UFM1,CH210 MICROSD,US120-UFD5,MICROSD H1-M,US120-M242,UV110-UFD5,AH322,MICROSD H2-SL,EH353-M,EH163-M,AH321,UDM2A,UDM2A-M,IND. SD H1-M,UH110-UFD4,CH120 MICROSD,ADC4,UM120-UFD5,UV210-UFD3,IND. MICROSD,IND. SD,IND.MICROSD H2-M,CF6,CM710-CF,CV110-MSD,MICROSD H1-SL,R1-M,STD 90D,UH110-UFD1,CH110-MSD,TYPE D LP,MICROSD R1-M,IND. SD R1,CV120-MSD,CH110-SD,TYPE B,MICROSD,TYPE C,TYPE D,TYPE E,USZ20-UFD5,CV110-SD,IND. SD5.0,CH710-CF,TYPE A,UH110-UFM3,AFD257,M.2,CH210-MSD,UH110-UFM2,UH110-UFM1,CF6A-SL,MICROSD H2-M,LP 90D,ADM5S-M,CS710-CF,CH120-MSD,IND. MICROSD R1,CF6-M,UMF2,EH353,CF6A-M,UV110-UFD1,UDM 1U,TYPE D-LP,180D,UDM 1U-M,CF6A,UFM1,UT110-UFD2,ADM5S,SD H1-SL,USM120-UFD5
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