LEMON Photonics VCSEL Spot Laser Module Solution with Outstanding Performance

2023-06-07 LEMON Photonics

As laser devices are more and more widely used in robot products, from commercial sweepers, AGVs, food delivery machines, etc., to civilian sweepers, power tools and other terminal applications have appeared point/line laser modules.


As a domestic Vcsel chip design and production enterprise, LEMON Photonics can not only provide industry-specific point/line laser modules but also provide personalized customized product solutions according to the application scenarios of end customers.


Product solutions at a glance

In order to solve the problems related to different solutions, LEMON Photonics proposed a variety of solutions respectively. They are:

▶ VCSEL point laser module scheme for triangulation measurement stereo vision

▶ Multi-junction VCSEL Spot Laser Module scheme for dToF


1. VCSEL point laser module scheme for triangulation measurement of stereo vision

In relatively widely used stereo vision and ToF schemes, traditional lidar light sources generally use edge-emitting lasers (EELs). In view of this, LEMON Photonics provides a laser light source scheme with better performance for the mainstream LDS SLAM system based on its self-developed high-performance vertical cavity surface emitting laser chip (VCSEL) and horizontal cavity surface emitting laser chip (HCSEL).


Compared with the traditional EEL collimation module, LEMON Photonics' VCSEL series spot laser module (Figure 1) adopts a customized VCSEL single-point chip, which has the advantages of small temperature drift coefficient, high spot roundness, and uniformity, strong antistatic ability, high reliability, easy packaging, and high-cost performance compared with traditional EEL collimation module. The product has passed the performance and reliability verification of a number of lidar solution providers and intelligent robot end customers and has entered mass production.

Figure 1: VCSEL point light source module for lemon photon triangulation lidar measurement


2. Multi-junction VCSEL point laser module scheme for dToF


LEMON Photonics also introduced the industry-leading multi-junction VCSEL chip family with peak electro-optical conversion


The efficiency can reach 56% (Figure 2).


Figure 2: Measured LI and PCE data of LEMON photonics multi-junction VCSEL chip (test conditions: 200ms pulse width, 1% duty cycle)


It can be seen that this series of products have the characteristics of high power density, high reliability, and excellent high-temperature performance, and is widely used in short pulse (ns class) and high peak power applications. Multi-junction technology represents the next leap forward in the VCSEL industry, bringing many advantages to machine vision applications. High power density can reduce package size and optimize system architecture, while high electro-optical conversion efficiency can reduce the thermal load of the whole machine, and high slope efficiency can reduce pulse current, thereby improving the switching speed of the driver chip.


In summary, VCSEL technology has many advantages over EEL, and the point laser collimation module based on multi-junction VCSEL is expected to replace the traditional EEL module so that the dToF lidar scheme can be more widely used in the field of robot vision.LEMON photonics VCSEL spot laser module solution with outstanding performance.

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本文由吃葡萄不吐葡萄皮儿转载自LEMON Photonics,原文标题为:LEMON photonics VCSEL spot laser module solution with outstanding performance,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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海量正品紧缺物料,超低价格,限量库存搜索料号

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SMT贴片加工

可贴PCB板厚范围:0.6~2.0mm,也支持生产软硬接合板,拼板长宽:50*50mm~550*500mm,PCBA快速贴片支持01005CHIP元件。

最小起订量: 1片 提交需求>

SMT贴片加工/DIP插件加工

可贴片PCB尺寸50*50mm-580*610mm;PCB厚度0.3-8mm;贴装精度CHIP元件+0.03,BGA Pitch 大于0.25mm;元件尺寸0201-74*74BGA;元件高度:30mm。

最小起订量: 1 提交需求>

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授权代理品牌:接插件及结构件

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授权代理品牌:加工与定制

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