【产品】高导热性能无污染的单组份导热凝胶HTG-500系列,可自动点胶涂覆,具有极佳的操作性
鸿富诚推出的HTG-500系列单组份导热凝胶是一种高适配性的热界面材料,该材料具有比超软导热硅胶垫片更优越的应力应变值,可自动点胶涂覆,是多个芯片共用一个散热器/结构件场合最佳的方案选择。
应用特点:
高导热性能,低热阻
无硅油析出,无污染
极佳的操作性
应用领域推荐:
半导体块和散与底座之间
温度调节器与装配表面
热电冷却装置
高性能中央处理器及显示卡处理器
包装:
根据不同需求,可以按照30cc/55cc/300cc等容量,按灌注包装。
该系列产品环保符合RoHS2.0、卤素、REACH标准。
储存条件:
冷藏或阴暗处储存;
储存温度:≤30℃;
储存湿度:≤70%;
保质期:
在储存条件下:1年
不符合储存条件下:3个月
热器
电源电阻器
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本文由漓雾转载自鸿富诚,原文标题为:HTG-500 常规系列 单组份导热凝胶 规格书,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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目录- General Information Board Mounted Heat Sinks part number Introduction Interface Materials Labor Saving Heat Sink to Board and Semiconductor Mounts Clips Accessories
型号- 6221PBG,530001B02500G,505303B00000G,530402B00100G,566902B00000G,534265,43-77-2G,374824B00032G,513102B02500G,566010B03100G,575803,581002,573100D00000G,PF750G,101900F00000G,581001,374324B00032G,576802V00000G,507302B000 _ _G,7717-18G,373324M00032G,575803B00000G,T405R,5748 02 B 0 37 00 G,533302B02551G,576904,4804SG,6224BG,513101,507002B00000G,513102,7022BG,534002,2342B-TACHG,574004B00000G,576904B00000G,335714B00032G,593002,375024B00035G,115300F00000G,501100B00000G,529901,529902,7721-13NG,574502,580600B00000G,578405B00000G,7023B-MTG,7022B–8223–CL03 G,6238B-MTG,519703B00000G,519903,533802B02554G,TV58G,580100B00000G,7717-178G,591302B02800G,563002D00000G,581201,8923-1G,579704B00000G,581202,6237BG,500403B00000G,7721-3PPSG,PF730G,TV35G,7021B-_G,591202B04000G,T414,T411,T412,2520B-EP04-BGS5G,6399BG,7717-130G,TV4G,MS 51957-30,2522B-EP04-BGS5G,335211B00032G,576802U04000G,500_03B 0 0000G,103G,374024B60023G,4804MG,374324B00035G,501806B00000G,7717-15G,7717-156G,590102B03600G,SW38-2G,100200F00000G,PF752G,TC11,593202,TC10,6232PB-MTG,7717-16G,6400B-P2G,529701,43-77-1G,529702,534002B02554G,577202B04000G,581202B02500G,TC12,164000F00000G,375224B00032G,7721-11NG,575002D00000G,BW50-4G,6396B–_G,335324B00032G,560200B00000G,500403,335814B00000G,8241-CL11G,PF758G,SW38-4G,500103B00000G,56-77-9G,575102B00000G,6400BG,574602B03300G,6201PBG,502006B00000G,6021-_-_G,533102,533101,591202,7106D/TRG,43-03-2,335824B00032G,6046PBG,580300B00000G,102100F00000G,BW50-2G,533522B02552G,10-THMA-01G,325705B00000G,PF732G,TV265G,533101B02551G,SW38-6G,533302,349G,43-77-20G,530162B00162G,125800D00000G,374024B00032G,574004U00000G,533722B02552G,533602B02552G,6232B-MTG,501503,7721-2PPSG,335824B00034G,53-03-2G,593101B 0 0000G,TV1500G,574902,8923-2G,7140DG,335214B00032G,2317B-EP11-BGS1G,592502,501303B000 _ _ 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产品型号
|
品类
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导热系数(W/mK)
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密度(g/cc)
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挤出速率(g/min)
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静态压缩应力@50%(Psi)
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阻燃等级 UL
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使用温度(℃)
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击穿电压(KV/mm)
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体积电阻率(Ω·cm)
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硬度(ShoreOO)
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拉伸强度(Mpa)
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延伸率(%)
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压缩比(%)
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颜色
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HTDG-250
|
剥离单组份导热凝胶
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2.5[±0.2]
|
2.8
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2@0.5Mpa
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<1
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V-0
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-50-150
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≥10
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≥10¹³
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50[±5]
|
≥0.4
|
≥200
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≥20@60psi
|
白色
|
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电子商城
服务
使用FloTHERM和Smart CFD软件,提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务,热仿真技术团队专业指导。
实验室地址: 深圳 提交需求>
提供稳态、瞬态、热传导、对流散热、热辐射、热接触、和液冷等热仿真分析,通过FloTHERM软件帮助工程师在产品设计初期创建虚拟模型,对多种系统设计方案进行评估,识别潜在散热风险。
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