Coolant Distribution Units - Improve Cooling and Performance of Cloud, Enterprise ＆ 5G Applications
Boyd Corporation has been the leading innovator in Enterprise cooling and engineered material solutions since data centers first started to emerge and evolve. Boyd utilizes these decades of expertise to develop advanced thermal solutions and systems to stay ahead of rapidly rising processing power, thermal density, and heat loads. This includes forward-thinking liquid cooling innovation and system components such as Coolant Distribution Units (CDUs). This article covers CDU technology for improved liquid cooling systems and integrated solutions that help OEMs increase compute density in the same footprint, iterate designs quickly and accelerate speed to market, increase efficiency and reliability, and lower the total cost of data center ownership with a scalable thermal management plan that outpaces processing power and application requirements.
TRENDS IN THERMAL MANAGEMENT FOR ENTERPRISE & 5G
There has been a sharp rise in global digitalization and electronification across all major industries as smart technology innovation, processing ability, and technology reliance are increasing exponentially. Consumers require faster connectivity, more information, and improved functionality across all markets. This is driving the need for larger, more efficient data centers with faster, more powerful chips to support cloud and edge computing as well as increased processing and storage. One of the most significant barriers to technological advancement and improved processing for these data centers is managing the excess heat generated by the increase in data and storage as well as power generation and supply.
New, higher power applications require more efficient cooling for high heat loads in compact volumes; this typically leads engineers to turn to liquid cooling solutions. Design engineers have creatively driven air cooling innovation to impressive performance levels for product design teams reticent about introducing liquid cooling into high-reliability data center systems. However, new requirements are making it increasingly difficult to avoid liquid entirely. Overlapping technology portfolios enable liquid, immersion, two-phase, and air cooling innovation to co-exist, allowing engineers to blend the right solutions for each customized application to extend the performance boundaries of traditional air cooling systems and assure a safe migration to liquid cooling systems when appropriate. Thermal and power density demands of next-generation designs have now reached air cooling limitations, requiring the transition to liquid. The liquid is much more efficient and has the capacity to transfer heat up to 4X higher than the capacity of forced air of the same mass. This enables faster, more cost-efficient, quieter, better-performing applications through efficient, improved heat transfer and higher thermal performance with increased design flexibility and scalability. Increased efficiency and smaller systems also save space, allowing for more racks and servers operating at higher performances.
Data Center Racks
A liquid-cooled system is a hydraulic circuit that typically consists of a cold plate that interfaces with a heat source in a device, hoses, and pumps that circulate fluid through the system, and a heat exchanger that rejects heat into the ambient environment. Liquid-cooled systems are becoming much more common as air cooling is unable to handle new, higher heat loads, and liquid cooling reliability is proven through many hours of in-field installations with leak-free performance. CDUs are the core of liquid systems and are designed to increase overall system efficiency and reduce the total cost of ownership for the data center.
WHAT'S NEXT?
Processing and data storage needs will continue to increase exponentially as organizations and individuals further demand digitalization, greater functionality, increased speed and service, better connectivity, and more electronification globally. To support this global trend, data centers and enterprise applications need to be larger, more efficient and operating 24/7 with improved processing and storage efficiency. This will, in turn, generate greater thermal density and higher heat loads as never seen before in Enterprise Technologies. Data Centers will need to adapt their thermal management strategy quickly to accommodate the fast-changing landscape and increased heat. Liquid Cooling Systems and CDUs will play a big part in these new strategies.
With decades of innovation expertise, experience, and supplier partnerships, coupled with the unique approach of integrating multiple technologies into a streamlined product, Boyd Corporation will continue to stay at the forefront of innovation and improved manufacturing that offers unsurpassed reliability and performance while lowering overall costs to the data center operator. If you are looking to solve current issues or tackle new challenges for the next generation, start by contacting Boyd Corporation to learn more about engineered materials, thermal solutions, customizations, and improved processes for Cloud, Enterprise & 5G Applications.
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可定制均温板VC最薄0.4mm，有效导热系数超5,000 W / m·K（纯铜(401 W/m·K ，石墨烯1,200 W/m·K）。工作温度范围同时满足低于-250℃和高于2000℃的应用，定制最低要求，项目年采购额大于10万人民币，或采购台套数大于2000套。
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可定制商用热管尺寸最高15.88mm，环路热管的热量传递范围为50mm到1000mm以上，同时满足低于-250℃和高于2000℃的应用。定制最低要求，项目年采购额大于10万人民币，或采购台套数大于2000套。
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