【应用】超柔导热垫片THERM-A-GAP™MCS30解决服务器大面积散热问题
服务器(SERVER)是网络中的重要设备,要接受少至几十人、多至成千上万人的访问,因此对服务器具有大数据量的快速吞吐、超强的稳定性、长时间运行等严格要求。CPU是计算机的“大脑”,是衡量服务器性能的首要指标。依可靠统计,温度每升高10度,计算机的可靠性能就下降25%,使用寿命将减少50%,因而热管理在服务器中的应用至关重要。
散热设计当中常用的方法有:使用主动散热和被动散热(散热器,冷却风扇),TIM截面材料,高导PCB等,导热材料实际应用中要针对客户实际需求,给出最佳最合理的方案,将以上几种方式应用到实处中。
下面介绍一下导热垫片在Server中的一种应用方式:
在服务器中,需要散热芯片很多,一般将导热垫片安装放置在需要散热的芯片对应的PCB板底部和外壳之间(如图一),但其pcb背端,温度也是很高,同时需要解决散热,这时,可使用大面积软性导热垫片(如图二),可以充分利用其良好的填充效果,压缩性能,以及良好的截面浸润性能带来导热效能,同时材料本身有优越的电气绝缘效果以及减震效果,区别于其他的导热介面材料。同时柔性导热硅胶片的使用便利,不易损耗,可重复使用,便于安装,为客户设计验证批产节省人力物力。
图一(PCB背端散热模型)
图二(PCB背端使用整张超软垫片)
大面积Pcb板散热对导热垫片的要求是:
1、 硬度小,回弹性好;
2、 压变应力小,力学强度高,耐磨损;
3、 绝缘强度在8KVac/mm以上;
4、 导热系数为3.0W/mK左右。
派克固美丽THERM-A-GAP™MCS30系列导热垫片,导热系数为3.0W/mK。其特点是超柔特性,标准硬度shore 00为25,可大张使用,紧密贴合在pcb背端表面与散热机壳之间的界面,对板端压变应力小,截面接触好,从而达到高导热效率。其柔顺性使其压缩率可达到50%及以上,而且绝缘强度达到11KVac/mm以上,同时MCS30有带玻纤、绝缘膜等版本,力学强度高,且具有一定的耐摩擦性,可以使用不同行业应用。
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6371,19-04-22371-XXXX**,CHO-SEAL 6370,10-00-0044-XXXXX,19-05-21166-XXXX,19-07-21339-XXXX,10-05-10648-XXXX,10-00-2231-XXXXX,19-26-5575-0240,10-00-2536-XXXXX,10-04-5514-XXXX,20-01-5225-1239**,19-04-11228-XXXX,19-09-W321-XXXX,10-01-1375-XXXXX,19-05-Z586-XXXX-40,10-05-3369-XXXX,10-06-8560-XXXX,19-06-Z731-XXXX,10-04-2862-XXXX,30-03-2071-XXXXX,40-TA-1015-1273,10-00-2070-XXXXX,10-00-2040-XXXXX,19-04-26424-XXXX,19-04-23836-XXXX,19-04-16390-XXXX,19-05-15343-XXXX,19-04-23158-XXXX,10-06-2750-XXXX-40,19-07-12951-XXXX,19-09-L453-XXXX,10-07-B447-XXXX,10-00-2227-XXXXX,40-TA-1015-1285,10-00-2777-XXXXX,40-TA-1015-1287,19-04-F371-XXXX-40,19-26-1800-0345,10-00-2228-XXXXX,19-04-22049-XXXX,20-02-6515-1212,30-02-2048-XXXXX,19-04-12910-XXXX,19-09-19925-XXXX,10-01-1240-XXXXX,19-07-W391-XXXX,10-00-0052-XXXXX,19-07-21881-XXXX,19-09-C032-XXXX,10-05-1363-XXXX-40,19-07-15804-XXXX,10-00-2320-XXXXX,CHO-SEAL 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【经验】导热垫片老化变硬问题怎么解决?
导热垫片使用广泛,是最常用的导热界面材料,但导热垫片也存在一些问题,其中老化变硬问题比较突出,本文讲解了老化变硬问题产生的原因,危害及解决方法,给使用和开发导热垫片提供思路,并推荐固美丽的导热垫片,如MCS30、TPS55、TPS60。
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