【应用】新型Volta半导体探头测试解决方案，用于测试从蓝牙和电源管理等集成芯片封装

时间： 2022-03-02 来源：Smiths Interconnect

技术问答

随着计算机、手机和智能设备变得越来越先进，支持它们的集成芯片也必须跟上这种变化。Smiths Interconnect的新型Volta 半导体探头测试解决方案处于领先地位，这些解决方案用于测试从蓝牙和电源管理到数字显示器的所有背后的集成芯片封装。Volta在耐用性和性能方面明显优于其他竞争对手。

Volta系列探头

Smiths Interconnect与客户就Volta的设计进行了密切合作。它使用创新的世界级电接触技术和专有工程材料来提高性能和生产效率，以及更长的生命周期。它还支持快速安装和维修，进一步降低持有成本。通过为Volta开发新的电接触技术并集成制造和装配流程，我们开辟了一个有吸引力的新市场领域，并展示了我们致力于不断创新来满足客户不断变化的需求的承诺。

图1 Volta系列探头

Smiths Interconnect的客户优势

技术挑战和飞涨的制造成本正在推动半导体测试机会的增长。Volta通过专为满足客户需求而设计的高性价比的高性能选项来应对这些趋势。Smiths Interconnect的新Volta半导体测试解决方案正在支持客户突破技术界限。

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