Ultra-low profile and Ultra-large current Co-fired power inductor-HTF series with an Ultra-low Loss and Ultra-large Current
Ultra-low profile and Ultra-large current Co-fired power inductor HTF series products adopt innovative copper magnetic Co-fired technology, which can achieve higher characteristics in the same size or achieve equivalent performance in smaller sizes compared to similar products. It has an ultra-low loss, and ultra-large current, and has the ability to be much thinner in the overall dimension design. Its unique copper magnetic co-firing process ensures excellent heat dissipation characteristics and high reliability. Due to the advanced production process, it has the advantages of both molded and assembled power inductors, it can be used to produce small-size but large current inductors and large size meanwhile large current ultra-thin inductors. Regarding the application, it can support single coil DC-DC power supply and coupling inductor for multi-phase power supply applications.
It is especially suitable for some ultra-thin high-power applications, as well as scenarios with high requirements for heat dissipation and reliability. Its unique advantages are incomparable to those of molded inductors and assembled inductors.
Application
●The CPU power supply in high-end PC, Pad, and other applications uses ultra-thin features to improve the equipment cooling system.
●The CPU, GPU, and related circuits in servers, AI servers, and other high-current and ultra-thin applications for the power supply. The ultra-thin high current can deal with the VRM and TLVR power supply scheme, and reduce the board area through back PCB mounting.
Background
Small size, big trust. With the trending of low profile for AI servers, high-end PCs, Pads, mobile phones and other products, as well as the inherent requirements of high power. It has a huge impact on the size and power consumption of internal components. Meanwhile, the DC-DC circuit, as the power supply, subjected to the market request, needs to achieve ultra-low profile while maintaining high power. Which, of course, depending on direct current flow capacity of the power inductor. The ultra-thin ultra-large current copper magnetic Co-fired power inductor came out at the historic moment.
At the same time, accompany with high reliability, high heat dissipation capacity and low loss are also deemed to become the highlights of copper magnetic Co-fired inductor.
Features
●Have incomparable ultra-thin advantages
●Ultra high reliability
●Wide operating temperature range, no long-term high temperature aging problem
● High saturation current characteristic
●Ultra low RDC, lower loss and higher power conversion efficiency
●Wide operating frequency range
●HTF series inductors use Sunlord's unique copper magnetic co-firing technology and have several patents
Table.1
Comparison of Product Advantages
●Comparison of material properties:
Compared with low-temperature solidified alloy powder, sintered alloy powder has:
High permeability（ μi)
High saturation magnetic induction (Bs)
High thermal conductivity
Ultra low core loss
●Temperature rise simulation:
Under the same power consumption, the surface temperature of HTF inductor is 10% lower than that of dry voltage inductor
Fig.1
●Core Loss：
In the same test setup, at 25℃ and 100℃, the Core loss of HTF series products is lower than that of dry pressed products.
Fig.2
●Electrical characteristics and size comparison:
Under the same electrical conditions, the height of HTF series inductors is 50~60% lower than that of assembled inductors, and 30~40% lower than that of traditional dry pressed molded inductors;
Under the same size conditions, the inductance and Q value of HTF series inductors can be 1.5~2.0 times compared than the assembled inductors and traditional molded inductors.
Table.2
●High temperature load test:
After the high temperature load 2400H test, the increase rate of HTF loss fluctuates at 10%, and the increase rate of dry voltage inductance loss is more than 350%;
After the high temperature load 2400H test, the HTF has a good appearance, and the dry pressed inductor has a large area of magnetic particle falling off.
The magnetic powder used for dry pressed inductor contains a lot of organic substances, which will age and become invalid under high temperature. The reliability of product characteristics is low and the strength of the product is insufficient, and the magnet is easy to fall off; HTF series products effectively avoid such problems.
Fig.3
●Ultra low loss:
It can minimize the total loss of terminal products and improve the conversion efficiency
Table.3
●Ultra-low profile features:
The product is ultra-low profile to make it highly compatible with IC;
The overall heat dissipation performance of the terminal product can be improved to a certain extent by improving the heat dissipation duct. Be able to adding heat dissipation plates, and utilizing the high thermal conductivity freely by using the copper magnetic Co-fired inductor.
Fig.4
Applications
●VRM and TLVR power supply of server CPU, GPU, FPGA, etc
●Power supply for ultra-thin Notebook and Pad
Dimensions
Fig.5
Part Number
Table.4
Production
●Sample can be sent at any time
●Mass production import stage
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顺络 - POWER INDUCTOR,共模扼流圈,COMMON MODE CHOKE,射频电感,功率电感,RF 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FSTFM81,A,汽车,AUTOMOTIVE
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超薄型超大电流共烧功率电感HTF系列新品上市
HTF系列超薄大电流共烧功率电感采用创新铜磁共烧技术，实现相同尺寸下更高性能或更小尺寸下等效性能。具有超低损耗、超大型电流，且整体尺寸设计可更薄。其独特的铜磁共烧工艺确保了优异的散热特性和高可靠性。适用于单线圈DCDC电源和耦合电感的多相电源应用，特别适合超薄高功率应用和散热及可靠性要求高的场景。产品具有超薄、超高可靠性、宽工作温度范围、高饱和电流特性、超低RDC、低损耗和高功率转换效率等特点。
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