Ventec Launches New Highest Thermal Conductive Metal Base Laminate VT-4BC for IGBT ＆ Power Markets with a Thermal Conductivity of 10W/mK
Ventec is pleased to announce the launch of its latest high thermal conductive metal base laminate VT-4BC designed for use in applications requiring excellent performance in thermal management including super bright lighting, power modules, controllers, motor drives, and rectifiers.
With high electrical breakdown strength, VT-4BC is designed to provide unparalleled reliability and improved performance over competing materials. It exhibits a thermal conductivity of 10 W/mK, offering superior heat dissipation even under the most demanding conditions.
In addition to its exceptional thermal performance, VT-4BC also boasts excellent mechanical properties, dimensional stability, and superior dielectric properties. It is also resistant to impact, moisture, and chemicals, making it a reliable choice for the most demanding applications, particularly for IGBT and power markets.
The material will make its US debut at IPC APEX Expo 2023 from 24-26 January in San Diego, where visitors to booth 419 can discover the superior performance of VT-4BC alongside the full range of PCB base materials.
Ventec’s Global Head of IMS Technology, Chris Hanson commented on the release of VT-4BC: “We are proud to introduce a product that provides unparalleled thermal performance and the highest electrical breakdown strength. VT-4BC is designed for customers who value reliability and require improved performance over traditional materials. We look forward to showcasing it at IPC APEX Expo in January, where attendees can discover its superior capabilities firsthand.”
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本文由玄子转载自Ventec News，原文标题为:New: Highest Thermal Conductive Metal Base Laminate for IGBT & Power Markets，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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