【产品】罗杰斯提供COOLSPAN导热导电胶膜，易于加工成形，加压固化期间流动性低

Rogers（罗杰斯）高频层压板材料和粘结材料选型指南（中文）

公司及产品简介    层压板材料    粘结材料    金属箔    厚度、公差和板材尺寸    订购信息    电气表征能力    主要市场   

ROGERS  -  3D可打印介质材料,层压板材料,玻纤布半固化片,粘结材料,半固化片,粘结片,陶瓷半固化片,陶瓷热固性半固化片,电解铜箔,热固性微波材料,热固性粘结片,粘结膜,埋阻铜箔,热固性导热导电胶,金属箔,模压成型介质材料,铜箔,热塑性粘结膜,低轮廓反转处理电解铜箔,层压板,压延铜箔,碳氢化合物半固化片,导热导电胶,陶瓷PTFE粘结片,高频层压板,RO4534,RO3203,RO4533,TC 系列,KAPPA® 438,RO4003C,RO4533™,5880LZ,ISOCLAD933,CLTE-MW,ISOCLAD 933,RT/DUROID 6002,CUCLAD 217,RO3035™,COOLSPAN® TECA,RO4725JXR™,CUCLAD,6010.2LM,CLTE™,TMM®,CLTE-AT™,RT/DUROID 6006,RO4730G3 LOPRO®,RO4003C LOPRO®,RO4534™,XTREMESPEED™R01200M,RO4835T™,6002,RO3210,AD1000™,R03003™,10I,AD350A™,AD255C™-IM,RO3006™,RO4730G3™,RO3010™,TC600™,RO3206,AD 系列™,RO4535,RT/DUROID 6202PR,RO4535™,RT/DUROID5870,RO4835 LOPRO®,RO4534 LOPRO®,RO4533 LOPRO®,ISOCLAD917,6250,RO4730G3 ED,AD250C™,RO3003G2™,RO4360G2,ISOCLAD® 917,CUCLAD 233,RT/DUROID® 5880LZ,6006,TC600,RO4835™,RO4535 LOPRO,AD300D™-IM™,RO3035,RO4835IND™ LOPRO,TMM 13I,R03206,MAGTREX® 555,CLTE-XT™,RO3210™,AD255™,AD300™,RO3206™,TMM® 3,RO4350B LOPRO®,XTREMESPEED™ RO1200™,TMM 10,RT/DUROID® 5870,TC350,RO4360G2™,RO3003,CLTE-MW™,RO3000,CLTE,DICLAD® 880,RO3003G2,13I,RO4350B,CUCLAD 250,RT/DUROID 5870,DICLAD 527,DICLAD527,AD255C™,RO3003™,6700,DICLAD 880,CLTA™,DICLAD® 527,RT/DUROID 5880LZ,RT/DUROID 6202,RO3000® 系列,RO4000® 系列,TC350 PLUS,6202,RO3010,RO4350B™,RT/DUROID 6035HTC,DICLAD® 系列,RO4450F™,ISOCLAD® 系列,AD300D™,CUCLAD® 系列,RT/DUROID 5880,AD350™,AD350,R04450T™,DICLAD 870,6202PR,SPEEDWAVE® 300P,ANTEO™,CLTE-XT,RO3006,RO4830™,AD1000,TMM 10I,5880,AD300,TMM 6,TMM 4,RT/DUROID 6010.2LM,CU4000 LOPRO,RO3203™,RO4003C™,AD250™,2929,TC350™,DICLAD® 870,R04460G2™,588018X12H1/H1R30200+-001DL,R03203™,CU4000,CLTE-AT,DICLAD® 880-IM,AD250,CLTE 系列™,6035HTC,AD255,RO4835,RO3003M™,CUCLAD® 217,功率放大器,汽车,热管理,计算设备,测试测量,天线系统,小基站,航空系统,微波回传,物联网,射频印制电路,雷达系统,分布式天线系统,IP基础设施,信息娱乐,移动互联网设备,数据中心,有线基础设施,通信系统,卫星电视,移动互联设备,汽车雷达传感器,天线,连接设备,无线基础设施

Rogers（罗杰斯）高频层压板材料和粘结材料选型指南（英文）

Rogers Corporation is the world’s leading manufacturer of high performance dielectrics, laminates and prepregs used in microwave and RF printed circuit and related applications in Aerospace & Defense, Wireless & Wireline (digital) Infrastructure, Automotive Radar Sensor, Satellite TV, Mobile Internet Device and High End Chip Scale Packaging.

ROGERS  -  THERMOSET GLASS REINFORCED PREPREG,PTFE随机玻璃纤维,编织玻璃94 V-0层压板,HYDROCARBON CERAMIC,热固性导热导电胶膜,半固化片,HIGH PERFORMANCE DIELECTRICS,PREPREGS,PTFE CERAMIC,THERMOSET MICROWAVE MATERIALS,BONDING MATERIALS,HYDROCARBON UL 94 V-0 LAMINATES,热固性微波材料,粘结片层,陶瓷UL 94 V-0层压板,PTFE RANDOM GLASS FIBER,层合板,磁介质层压板,TECA FILM,玻璃纤维增强聚四氟乙烯,高性能电介质,热塑性粘合膜,THERMOSET THERMALLY & ELECTRICALLY CONDUCTIVE ADHESIVE FILM,交叉编织玻璃纤维增强聚四氟乙烯,3D可打印介电材料,MAGNETO-DIELECTRIC LAMINATES,玻璃纤维增强聚四氟乙烯天线级层压板,专利陶瓷、热固性聚合物复合材料,NON-WOVEN GLASS REINFORCED PTFE,粘接材料,导热导电胶电影,烃类陶瓷,WOVEN GLASS REINFORCED PTFE,CROSS-PLIED WOVEN GLASS REINFORCED PTFE,BONDPLYS,PROPRIETARY CERAMIC, THERMOSET POLYMER COMPOSITES,WOVEN GLASS REINFORCED PTFE ANTENNA GRADE LAMINATES,无纺玻璃纤维增强聚四氟乙烯,聚四氟乙烯陶瓷,3D-PRINTABLE DIELECTRIC MATERIALS,CERAMIC UL 94 V-0 LAMINATES,碳氢化合物UL 94 V-0层压板,热固性玻璃纤维增强半固化片,LAMINATES,WOVEN GLASSUL 94 V-0 LAMINATES,THERMOPLASTIC BONDING FILM,RO4534,RO3203,RO4533,KAPPA® 438,RO4003C,RO4533™,AD300D-IM,CLTE-MW,COOLSPAN,ISOCLAD 933,RT/DUROID 6002,CUCLAD 217,AD255C,RO3035™,AD300D,COOLSPAN® TECA,RO4725JXR™,AD250TM,CUCLAD,CLTE™,6010.2LM,CLTE-AT™,RT/DUROID 6006,RO4003C LOPRO®,RO4730G3 LOPRO®,RO4534™,XTREMESPEED RO1200,CLTE SERIES,CUCLAD® 6250,RO4835T™,6002,RO3210,RO4350B LOPRO,AD350A™,AD255C™-IM,RO3006™,RO4730G3™,RO3010™,TC600™,RO3206,RO4535,RT/DUROID 6202PR,RO4535™,RO4835 LOPRO®,RO4534 LOPRO®,RO4533 LOPRO®,6250,RO4730G3 ED,TC600TM,AD255TM,RT/DUROID 6202PR 0.005",AD250C™,RO3003G2™,RO4360G2,ISOCLAD® 917,CUCLAD 233,RADIX,RT/DUROID® 5880LZ,AD350A,6006,TC600,RO4835™,RO4535 LOPRO,TMM®10,AD300D™-IM™,DICLAD,RO3035,RO4835IND™ LOPRO,KAPPA,RO4000,TMM 13I,AD SERIES,RO4730G3,CLTE SERIES™,MAGTREX® 555,TMM®13I,ISOCLAD,CLTE-XT™,RO3210™,CUCLAD 6700,TMM® 3,RO3206™,RO4350B LOPRO®,ANTEO,RT/DUROID 6202PR 0.020",XTREMESPEED™ RO1200™,TMM 10,RT/DUROID® 5870,TC350™ PLUS,TC350,RO4360G2™,RO3003,RT/DUROID 6010.2 LM,CLTE-MW™,RO3000,CLTE,DICLAD® 880,RO3003G2,588018X12H1/H1R30200+-001DI,RO4350B,AD300TM,CUCLAD 250,RT/DUROID 5870,DICLAD 527,RO4835T,AD255C™,RO3003™,6700,RO4460G2™,DICLAD 880,DICLAD® 527,RT/DUROID 5880LZ,RT/DUROID 6202,RO4835IND,TC350 PLUS,AD350TM,RO4350B™,6202,RO3010,RT/DUROID 6035HTC,RO4450F™,RO4835 LOPRO,AD300D™,RT/DUROID 5880,RT/DUROID 6202PR 0.010",DICLAD 880-IM,AD350,KAPPA 438,DICLAD 870,6202PR,SPEEDWAVE® 300P,ANTEO™,CLTE-XT,RO3006,RO4830™,RO4830,TMM 10I,5880,AD300,AD255-IM,RT/DUROID,TMM 6,TMM 4,TMM®10I,DICLADR 880-IM,RT/DUROID 6010.2LM,TC350 TM,CU4000 LOPRO,RO3203™,ISOCLAD 917,RO4003C™,2929,TC350™,RO4460G2,DICLAD® 870,RO4450F,TMM,CLTE-AT,RO4450T™,TMM®4,AD250,AD250C,TC SERIES,TMM®3,6035HTC,AD255,RO4835,CUCLAD® 217,TMM®6,RO4450T,SATELLITE TV,DIGITAL INFRASTRUCTURE,航空航天,DLP,DIGITAL LIGHT PROCESSING,RF PRINTED CIRCUIT,SLA 3D PRINTING PROCESSES,AUTOMOTIVE RADAR SENSOR,AEROSPACE,立体光刻3D打印工艺,WIRELESS INFRASTRUCTURE,STEROLITHOGRAPHY 3D PRINTING PROCESSES,国防,WIRELINE INFRASTRUCTURE,数字基础设施,射频印刷电路,数字投影系统,HIGH END CHIP SCALE PACKAGING,SLA 3D打印工艺,微波电路,DEFENSE,有线基础设施,MOBILE INTERNET DEVICE,高端芯片级封装,DLP公司,卫星电视,移动互联设备,MICROWAVE CIRCUIT,汽车雷达传感器,无线基础建设

射频解决方案-REACH SVHC Letter 7.2

ROGERS  -  粘结片材料,FILM,BONDPLY,薄膜,铜箔板,COPPER FOIL,HIGH FREQUENCY LAMINATE,高频层压板,BONDPLY MATERIALS,粘结片,XTREMESPEED TM RO1200TM,CLTE,RO4000® SERIES,DICLAD®,RO2800® SERIES,MAGTREX® SERIES,ISOCLAD®,RO4000®,AD SERIES®,LOPRO®,MAGTREX®,COOLSPAN® TECA,TC SERIES®,2929,ISOCLAD® SERIES,AD,RO2800®,KAPPA®,XTREMESPEED TM RO1200TM SERIES,RO3000®,3232,DICLAD® SERIES,RO3000® SERIES,RT/DUROID® SERIES,CUCLAD® SERIES,RT/DUROID®,CLTE SERIES®,CUCLAD®,IM SERIESTM,KAPPA® SERIES

Rogers（罗杰斯）COOLSPAN® TECA导热导电粘合薄膜数据手册

COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) film is a thermosetting, epoxy based, silver filled adhesive film.

ROGERS  -  TECA,导热导电粘合薄膜,COOLSPAN TECA,COOLSPAN® TECA,COOLSPAN导热导电胶,COOLSPAN®导热导电胶,导热导电胶,THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE,热导电胶粘剂,COOLSPAN®,COOLSPAN TECA 10X12 0020+-0005,COOLSPAN TECA 10X12 0040+-0005,COOLSPAN® TECA,COOLSPAN,POWER AMPLIFI ER HEAT SINK COIN ATTACHMENT,FUSION BONDING,MECHANICAL,ALTERNATIVE TO HEAVY CLAD LAMINATES,重覆层压板的替代品,POST FABRICATION METAL BACKPLANE ATTACHMENT,压装金属附件,SWEAT SOLDERING,功率放大器散热器硬币附件,射频电路板模块组件,RF CIRCUIT BOARD MODULE ASSEMBLY,后加工金属底板附件,POWER AMPLIFI ER HEAT SINK COIN ATTACHMENT,融熔接合,汗焊,机械的,PRESS FIT METAL ATTACHMENT

高级连接解决方案TSCA PBT信函

ROGERS  -  粘结片材料,FILM,BONDPLY,薄膜,铜箔板,COPPER FOIL,HIGH FREQUENCY LAMINATE,高频层压板,马格特雷克斯,MAGTREX,BONDPLY MATERIALS,粘结片,XTREMESPEED TM RO1200TM,RO4000® SERIES,RO2800® SERIES,COOLSPAN,TMM® SERIES,RO4000®,KAPPA SERIES,LOPRO®,TC SERIES®,2929,ISOCLAD® SERIES,TMM®,CLTE SERIES,ML SERIES TM,RO2800®,XTREMESPEED TM RO1200TM SERIES,RO3000®,TECA,AD SERIES,TC,DICLAD® SERIES,RO3000® SERIES,RT/DUROID® SERIES,CUCLAD® SERIES,RT/DUROID®,MAGTREXTM 555,IM SERIESTM

康涅狄格州罗杰斯工厂生产运营的最新情况

Rogers, Connecticut的Rogers工厂近期发生小型设备火灾，影响Coolspan® TECA薄膜和3232粘合薄膜材料的生产。火灾已得到控制，预计2月底前恢复生产，3月初开始发货。目前正使用现有库存履行订单，可能建议替代尺寸以减少延误。

ROGERS  -  COOLSPAN® TECA FILM,3232粘合膜材料,3232 BONDING FILM MATERIALS,COOLSPAN®TECA膜,COOLSPAN® TECA,3232

射频解决方案-REACH SVHC信函

欧洲化学品管理局（ECHA）发布了高度关注物质（SVHC）候选清单，并呼吁企业检查其潜在义务。罗杰斯公司对其射频解决方案产品进行了评估，确认这些产品不含高于0.1%的SVHC物质。受此声明覆盖的产品包括多种高频层压材料和粘合材料。罗杰斯公司基于供应商提供的安全数据表（SDS）和有限的产品测试提供此信息，并声明不对信息的准确性负责。

ROGERS  -  粘结片材料,FILM,BONDPLY,薄膜,铜箔板,COPPER FOIL,HIGH FREQUENCY LAMINATE,高频层压板,BONDPLY MATERIALS,粘结片,RO4000® SERIES,CLTE SERIES®,RO2800® SERIES,IM SERIES™,3232 BONDPLY,DICLAD® SERIES,MAGTREX® SERIES,RO3000® SERIES,2929 BONDPLY,RT/DUROID® SERIES,XTREMESPEED™ RO1200™ SERIES,CUCLAD® SERIES,LOPRO®,AD SERIES®,COOLSPAN® TECA,ISOCLAD® SERIES,TC SERIES®,KAPPA® SERIES

RFS产品组合摘要

该资料概述了RFS公司的产品组合，包括多种PTFE和陶瓷填充PTFE层压材料，如RT/duroid、DiClad、TC350等系列，以及高热导率陶瓷填充PTFE层压材料和高Dk PTFE层压材料。此外，还包括天线级PTFE和热固性层压材料，如TMM®系列和特殊树脂。资料还提到了热塑性及热固性粘合材料，如CuClad®、SpeedWave®等。

ROGERS  -  陶瓷填充聚四氟乙烯层压板,HIGH THERMAL CONDUCTIVITY CERAMIC FILLED PTFE LAMINATES,高DK聚四氟乙烯层压板,HIGH DK PTFE LAMINATES,高导热陶瓷填充聚四氟乙烯层压板,CERAMIC FILLED PTFE LAMINATES,天线级聚四氟乙烯和热固性层压板,LAMINATES,传统聚四氟乙烯/玻璃层压板,TRADITIONAL PTFE/GLASS LAMINATES,SPECIALTY RESINS,陶瓷填充碳氢化合物层压板,ANTENNA GRADE PTFE AND THERMOSET LAMINATES,陶瓷填充热固性层压板,CERAMIC FILLED THERMOSET LAMINATES,专业树脂,CERAMIC FILLED HYDROCARBON LAMINATES,层合板,AD SERIES™,RO4360G2™,CLTE-MW™,RO3000,CLTE,RO4533™,DICLAD®,92ML™,TC350+™,MAGTREX™ 555,ISOCLAD®,AD300D-IM™,RO1200™,RT/DUROID 6000,RO4000®,CUCLAD® 6700,AD255C™,RO3003™,COOLSPAN® TECA,RO4725JXR™,CLTE™,COOLSPAN®TECA,CLTE-AT™,RO4534™,CLTE SERIES,CUCLAD® 6250,TC SERIES™,RO4350B™,AD1000™,AD350A™,DICLAD® SERIES,RO3006™,92ML™ SERIES,RT/DUROID 5000,RO4730G3™,RO3010™,CUCLAD®,TC600™,SPEEDWAVE® 300P,RO4830™,RO4535™,TMM 10I,RT/DUROID® 6010.2LM,TMM 6,RO4450™,TMM 4,RADIX™,AD250C™,RO4003C™,2929,RT/DUROID® 5000,RO4835™,TC350™,RO4460G2,ISOCLAD® SERIES,92ML SERIES,92ML,RO4000,RO3000®,RO4500™,AD SERIES,RT/DUROID® 6035HTC,RT/DUROID® 6006,CLTE-XT™,RO3210™,TMM® 3,RO3206™,TMM,CUCLAD® SERIES,RO4450T™,TC SERIES,RT/DUROID® 6000,KAPPA™ 438,TMM 10,RT/DUROID® 6002,RT/DUROID® 6202

CoolSpan®TECA薄膜导热胶和导电胶数据表

COOLSPAN® TECA是一种热电导粘合剂薄膜，用于将电路板与重覆层金属背板、散热片硬币和射频模块外壳连接。该产品提供热和电导接口，适用于替代熔融焊接、汗焊、机械或压接金属附件。

ROGERS  -  导热导电胶电影,THERMALLY & ELECTRICALLY CONDUCTIVE ADHESIVE FILM,导热导电胶膜,TECA FILM,热固性，环氧树脂基，银填充胶膜,THERMOSETTING, EPOXY BASED, SILVER FILLED ADHESIVE FILM,RF MODULE HOUSINGS,BOND CIRCUIT BOARDS,焊接电路板,HEAT SINK COINS,POST FABRICATION METAL BACKPLANE ATTACHMENT,热沉硬币,POWER AMPLIFIER HEAT SINK COIN ATTACHMENT,射频模块外壳,射频电路板模块组件,功率放大器散热器硬币附件,HEAVY CLAD METAL BACKPLANES,RF CIRCUIT BOARD MODULE ASSEMBLY,厚包层金属背板,后加工金属底板附件

COOLSPAN® TECA 导热导电粘合薄膜数据资料表

ROGERS  -  导热导电粘合薄膜,COOLSPAN® TECA,COOLSPAN TECA

Rogers（罗杰斯） COOLSPAN 导电导热胶(TECA)的产品数据安全说明书(MSDS)（中文）

本资料为COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA)的产品安全信息表，详细介绍了该产品的物质/配制和公司/企业识别信息、危害辨别、原料成分/信息、急救措施、防火措施、意外泄露措施、处理和储存、暴露控制/个人防护、物理和化学性质、稳定性和反应性、毒物学信息、生态学信息、处置信息、运输信息、管理信息以及其他相关信息。

ROGERS  -  THERMALLY & ELECTRICALLY CONDUCTIVE ADHESIVE (TECA),导热导电胶（TECA）,微波电路板材,COOLSPAN TECA 10X12 0020+-0005/DI,COOLSPAN TECA 10X12 0040+-0005/DI,COOLSPAN,室内照明,机车,工业设备控制,车载娱乐,车载,电力,车身和底盘,照明,车联网,手机相关,电动汽车动力系统,通信设备,车载通讯,装备及逆变电源,可再生能源,工业自动化,工业伺服,智能家居,轨道交通,国防工业设备,热交换,物联网,仓储,安全系统