Dual-channel H-bridge Motor Driver Chip Offers Three Packages with RDS(ON) of Only 800mΩ

2021-07-10 Zhongke Microelectronics
Dual-channel H-bridge Motor Driver Chip,AT8833,中科微 Dual-channel H-bridge Motor Driver Chip,AT8833,中科微 Dual-channel H-bridge Motor Driver Chip,AT8833,中科微 Dual-channel H-bridge Motor Driver Chip,AT8833,中科微

Zhongke Microelectronics's Dual-channel H-bridge Motor Driver Chip AT8833 provides an integrated dual-channel motor drive solution for toys, printers, and other motor integration applications. AT8833 has two H-bridge drivers, which can drive two DC brushed motors, a bipolar stepper motor, solenoids, and other inductive loads.


The power output stage of each H-bridge is composed of N-type power MOSFET, called the H-bridge driver. Each bridge contains a rectifier circuit and a current-limiting circuit.


Internal shutdown function includes overcurrent protection, short circuit protection, under-voltage lockout protection, and overtemperature protection, and provides a fault detection output pin.


AT8833 offers three packages, one is ETSSOP16 package with exposed pad, and the other two are QFN16 package with exposed pad. The sizes are 4*4 and 3*3, which can effectively improve the heat dissipation performance. All are lead-free Products that comply with environmental protection standards.


Features

●Dual-Channel H-bridge Motor Driver

●Drive Two DC Brushed Motors or One Stepper Motor

●Low RDS(ON) resistance, 800mΩ(HS+LS)

●1.2A Drive Output

●Wide Voltage Supply,2.7V-15V

●PWM control interface

●Over-temperature Shutdown Circuit

●Short Circuit Protection

●Undervoltage Lockout Protection


Application

● Battery-Powered Toys

● POS Printers

● Video Security Cameras

● Office Automation Machines

● Gaming Machines

● Robotics


Package


Typical Application Diagram


Selection Guide


授权代理商:世强先进(深圳)科技股份有限公司
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本文由星晴123转载自Zhongke Microelectronics,原文标题为:Dual-channel H-bridge Motor Driver Chip AT8833,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

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可贴片PCB尺寸50*50mm-580*610mm;PCB厚度0.3-8mm;贴装精度CHIP元件+0.03,BGA Pitch 大于0.25mm;元件尺寸0201-74*74BGA;元件高度:30mm。

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