【选型】适用于硅橡胶粘合应用的导电硅酮粘合剂选型推荐
美国PARKER CHOMERICS(派克固美丽)公司是一家世界知名的屏蔽材料生产厂家,该公司提供的产品几乎覆盖了所有的相关应用领域。导电粘合剂是一种常用的辅助屏蔽材料,通常用在各种外壳、基板、垫圈之间,起到结构粘合的作用,同时保证整体的屏蔽效果和导电性能。不同材质间适用的粘合剂类型有所不同,对于导电硅橡胶制成的屏蔽垫圈来说,还是相似材质的导电硅酮化合物更适合用作粘合剂,能够非常有效且稳定的将EMI硅橡胶垫圈粘合在各种金属基板上。派克固美丽在官网上推荐的导电粘合剂型号中,仅有两款镀银铜颗粒填充导电硅酮化合物的产品,本文对这两款产品做一下性能和应用优势方面的简单介绍,帮助读者了解一下这两款产品。
图1 CHO-BOND® 1029型导电粘合剂
如上图所示,第一款介绍的是CHO-BOND® 1029型,主要配方为镀银铜填充硅酮化合物,外观呈棕红色。镀银铜颗粒是除了纯银以外导电性能最好的金属填料,因此这款粘合剂的导电性能相当不错,体积电阻率小于0.06Ω·cm。而对于粘合剂来讲,非常重要的粘合强度表现为剪切强度大于450PSI,虽然比不上其他粘合剂动辄上千的剪切强度,但是对于硅酮粘合剂来讲,这个强度已经算是相当不错了。另外,在应用上,这款粘合剂的工艺灵活性优势非常明显,其固化方式可以选择热固化(121℃,30分钟)和室温固化(24小时固化至可接触状态,完全固化需要一周)两种方案。这个特点给生产现场的工艺设计带来了巨大的灵活性,既可以选择短节拍周期的热固化工艺,以提高批量生产效率;也可以选择降低工艺设备投资的室温固化方案。更特别的是,这款粘合剂在室温下有120分钟的活性周期,这比大部分粘合剂都要高很多,工艺适应性更强。
图2 CHO-BOND® 1030型导电粘合剂
CHO-BOND® 1030型导电粘合剂的主配方与1029型相同,外观呈浅灰色。从性能上看,1030型的导电性能略好一点点,体积电阻率小于0.05Ω·cm;但是固化后的剪切强度只有200PSI,粘合强度方面就远不如1029型了。1030型这一款粘合剂的相对优点在于,使用工艺特别简单,单组分产品,不需要调配混合;室温湿固化型产品,也不需要额外的热炉设备。不过,没有热固化方案可供选择,而且室温活性周期也只有30分钟,工艺灵活性和适应性不如1029型。还有一个优点,就是这款粘合剂配方中完全不含挥发性有机化合物(VOC),更加安全环保,虽然1029型的VOC含量也很低,仅有14g/L。
最后,把CHO-BOND® 1029和1030型,这两款导电硅酮粘合剂的主要特性做一下对比:
• 两款配方都采用较经济的镀银铜填料,是经济型的高性能解决方案
• 1029型可以高温快速固化,也可以选择室温固化
1030型为室温湿固化型
• 1029型室温下有120分钟的活性周期,工艺适应性更强
1030型的室温活性周期为30分钟,比较普通
• 1029型的体积电阻率小于0.06Ω·cm,剪切强度大于450PSI
1030型的体积电阻率小于0.05Ω·cm,剪切强度大于200PSI
• 1029型为双组分,使用前需要混合调配
1030型为单组分,不需调配,简单方便
• 1029型的挥发性有机化合物(VOC)含量很低,仅有14g/L,比较环保
1030型完全不含挥发性有机化合物(VOC),非常安全环保
• 推荐1029型与CHO-SHIELD 1085型底漆配合使用
1030型与CHO-SHIELD 1086型底漆配合使用
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Parker Chomerics Specialty Materials Product Shelf Life Data
型号- CHO-SHIELD 571,CHO-BOND 580-208,CHO-SHIELD 4994,TECKNIT 0005,TECKNIT 0002,CHO-SHIELD 2056,CHO-SHIELD 596,CHO-BOND 360-20,CHO-BOND 1029,CHO-LUBE 4220,CHO-BOND 2165,CHO-SHIELD 608,CHO-BOND 1077,CHO-BOND 1035,TECKNIT 8116,CHO-BOND 1016,CHO-BOND 1038,CHO-BOND 4669,CHO-BOND 592,CHO-SHIELD 568,CHO-SHIELD 604,CHO-BOND 1030,CHO-BOND 4660,CHO-BOND 1075,CHO-SHIELD 2002,CHO-SHIELD 2003,CHO-SHIELD 2044,CHO-SHIELD 2001,CHO-BOND 1019,CHO-BOND 1121,CHO-SHIELD 2040,CHO-SHIELD 579,CHO-SHIELD 610,CHO-SHIELD 576,CHO-BOND 584-29,CHO-SHIELD 1091,CHO-BOND 1085,CHO-BOND 584-208,CHO-BOND 1086
Parker Chomerics(派克固美丽)导电特种材料选型指南
描述- Parker is the global leader in motion and control technologies, providing precision-engineered solutions for a wide variety of mobile, industrial and aerospace markets. Parker can be found on and around everything that moves.
型号- CHO-SHIELD 571,52-01-2001-0000,50-30-0584-0029,CHO-LUBE 4220,52-01-0571-0000,50-10-1086-0000,52-03-2056-0000,CHO-BOND 2165,CHO-SHIELD 608,CHO-BOND 1077,596,52-00-2002-0000,52-00-2003-0000,51-02-4669-0000,50-33-1038-0000,50-01-0584-0208,50-00-1091-0000,CHO-SHIELD 604,72-00002,72-00005,CHO-BOND 1075,52-03-2044-0000,50-05-0580-0208,50-02-1030-1000,4220,50-01-1030-0000,2044,2040,52-01-2002-0000,50-00-0584-0208,52-00-2001-0000,54-01-4220-0000,CHO-SHIELD 4994,CHO-SHIELD 2056,CHO-SHIELD 596,50-01-2165-0000,2056,52-01-0579-0000,50-01-1085-0000,52-01-0604-0000,50-04-2165-0000,52-01-0596-0000,52-04-4994-1000,52-03-0610-0000,CHO-SHIELD 2044,50-01-1075-0000,50-10-0584-0029,52-00-2002-1000,50-02-1038-0000,CHO-SHIELD 4900,50-02-1075-1000,50-00-1029-0000,50-01-1091-0000,CHO-SHIELD 2040,CHO-SHIELD 579,4994,50-00-0584-0029,CHO-SHIELD 610,CHO-SHIELD 576,72-08116,CHO-BOND 584-208,52-04-2002-0000,CHO-BOND 580-208,CHO-BOND 360-20,CHO-BOND 1029,52-01-0576-0000,CHO-LUBE E117,50-02-1038-1000,50-01-0580-0208,CHO-BOND 1035,52-04-0608-0000,51-05-4669-0000,TECKNIT 8116,50-03-0584-0029,50-02-1077-0000,CHO-BOND 4669,CHO-BOND 1038,52-04-2001-0000,50-02-1016-0000,CHO-BOND 1030,52-00-2001-1000,CHO-BOND 4660,51-00-1035-0000,2001,CHO-BOND 1019,50-00-0360-0020,50-02-0584-0029,52-03-4994-1000,50-01-1121-0000,52-00-2003-1000,604,CHO-SHIELD 1091,608,50-02-1075-0000,50-31-1038-0000,TECKNIT 0005,51-01-1035-000,TECKNIT 0002,50-04-1086-0000,50-01-1077-0000,50-01-1029-0000,51-02-4660-0000,50-02-1030-0000,571,51-05-4660-0000,576,610,CHO-BOND 1016,2003,50-01-1038-0000,54-01-E117-0200,2002,51-00-1035-1000,50-01-0584-0029,50-02-2165-0000,CHO-SHIELD 2002,52-00-0596-0000,CHO-SHIELD 2003,54-02-4220-0000,CHO-SHIELD 2001,50-01-1019-0000,52-01-2003-0000,50-01-1016-0000,CHO-BOND 1121,50-01-0360-0020,52-03-2040-0000,52-04-2003-0000,50-01-1086-0000,52-02-4900-0000,CHO-BOND 584-29,CHO-BOND 1085,CHO-BOND 1086
Parker Chomerics 产品概述
型号- CHO-TOUCH™,CHO-STRAP®,CHO-SEAL®,STREAMSHIELD OMNI-CELL® SHIELD-CELL,T-WING®,CHO-MUTE®,CHO-MASK®,SPRING-LINE®,DURALAN™,CHO-BOND®,CHO-FAB®,THERM-A-GAP™,WIN-SHIELD®,CHO-SORB®,THERM-A-FORM™,CHO-THERM®,THERMFLOW®,CHO-SHRINK®,THERMATTACH®,METALASTIC®,PREMIER™,CHO-FOIL®,CHO-LUBE,SOFT-SHIELD®,CHO-FORM®,POLA®,TECKFILM™,CHO-SHIELD®
Engineered Materials Group Capabilities Guide
型号- G-LINK®-200,M-SERIES LVDT,V-LINK®-200,SG-LINK-200,LS-LVDT,TORQUE-LINK-200,S-SERIES LVDT,M-SERIES,G-SERIES,C-SERIES
【产品】可屏蔽EMI、剥离膜易去除的金属箔胶带CHO-MASK®II系列,可提供导电和耐腐蚀的表面处理
Parker Chomerics推出CHO-MASK®II系列的抗EMI金属箔胶带,包括Standard Tack(ST)和High Tack(HT)两,可为喷漆后的金属电子器材提供导电、耐腐蚀的表面。 CHO-MASK II胶带由1盎司 (28.4克)或2盎司(56.7克)的镀锡铜箔上覆盖一层凹进的聚酯漆掩膜构成。 金属箔的反面具有可导电的压力敏感粘合剂(PSA)。
【产品】双组分银填充导电环氧粘合剂系统PRO-SHIELD 7058,用于高强度高导电性的电气连接
Parker Chomerics PRO-SHIELD 7058是一种双组分银填充导电环氧粘合剂系统,专为需要实现高强度高导电性的电气连接的应用而设计。其采用带有静态混合器的50cc双注射器,可最大限度地减少材料废料和混合问题。 它的固化可在短短15分钟内通过加热实现,从而最大限度地减少设备停机时间并提高生产能力。
Electrically Conductive Silicone Adhesive and Sealant Application Procedure
型号- CHO-BOND 1121,CHO-BOND 1035,TECKNIT 0002,CHO-BOND® 1030,CHO-BOND 1016,CHO-BOND 1038,CHO-BOND 1029,CHO-BOND 1030,CHO-BOND 1085,CHO-BOND 1075,CHO-BOND® 1029,CHO-BOND 1086
电子商城
品牌:ROGERS
品类:Thermally and Electrically Conductive Adhesive
价格:¥3,366.3686
现货: 0
品牌:ROGERS
品类:Thermally and Electrically Conductive Adhesive
价格:¥5,175.6199
现货: 0
品牌:ROGERS
品类:Thermally and Electrically Conductive Adhesive
价格:
现货: 0
品牌:ROGERS
品类:Thermally and Electrically Conductive Adhesive
价格:
现货: 0
服务
使用FloTHERM和Smart CFD软件,提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务,热仿真技术团队专业指导。
实验室地址: 深圳 提交需求>
提供多种可压缩材料如导热硅胶、散热垫片、各种相变材料以及其他粘合剂和固体试样的材料导热系数测试,给出测试结果及数据解析报告;测试范围:最大加热电流5A;热阻范围:0.01K/W-5K/W。
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