Rogers Corporation’s Power Electronics Solutions Group to Showcase curamik® Ceramic Substrates ＆ ROLINX® Eco Busbars at the PCIM 2023

Eschenbach, Germany, April 24, 2023——ROGERS Corporation’s ("Rogers") Power Electronics Solutions (PES) group will be exhibiting at PCIM Europe and showcasing the whole curamik® ceramic substrate portfolio and ROLINX® Eco — a new generation aluminum busbar with unique features.

The PCIM Europe (Power Conversion and Intelligent Motion) event is the world's leading exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management. It is the leading international platform showcasing current products, topics, and trends in power electronics and applications, taking place at the Nuremberg Messe (exhibition hall) in Nuremberg, Germany from May 09 –11, 2023. Rogers will be exhibiting in Hall 9 at Booth 351.

Rogers will also be active on the E-Mobility Forum schedule. Manfred Goetz, Rogers Senior Manager of Product Management for curamik, will present on the topic, “Comparison of Ceramic Substrate Materials for Different Packaging Technologies for Power Electronics.” This presentation will show that with the growth of HEV/EV and increasing requirements for packaging materials, designers struggle to find new ways to ensure the reliability and high efficiency of electronic systems, which are necessary to power these new, challenging technologies. Additionally, Goetz will explain why finding and selecting the proper substrate materials for these challenges is the key to success in power electronics.

E-Mobility Forum, Hall 6, Booth 6-220
Tuesday, May 09, 2023, 3:10 pm
Thursday, May 11, 2023, 1:25 pm

Rogers will also be active on the PCIM Europe technical conference schedule and present a paper titled “Development of Method for Thermal Diffusivity Measurement of Thin and High Conductive Ceramics” by Martina Schmirler, Stefan Britting, and Karsten Schmidt in cooperation with the Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany. This paper will show that reliable operation of power modules under all conditions that may occur during their lifetime must be achieved by design and that thermal simulation is an important tool to optimize the thermal design with respect to chip temperature. This paper will elaborate that it has identified a reliable method for determining thermal diffusivity by comparing different coating methods for sample preparation and investigating the influence of the measurement device on the results.

Stage: Mailand
Thursday, May 11, 2023, 2:00 pm

Visitors to the Rogers booth can learn more about curamik Ceramic Substrates designed for high-demand applications. The basis of the substrate is a ceramic insulator to which pure copper is applied. The result is ceramic substrates with high thermal conductivity, high heat capacity, and heat spreading provided by the thick copper layer. These high-performance substrates are well-suited for power electronics applications.

Visitors will also have the chance to discover the wide range of ROLINX customized busbar solutions and assemblies renowned for their reliability, safety, and durability in the most demanding applications, including mass transit and electric propulsion, industrial drives, renewable energy, and automotive systems. ROLINX busbar solutions offer low inductance, compact and highly customizable designs, and, in combination with capacitors, extremely low inductance, and high-power density capabilities.