【产品】有机硅导热灌封胶是电子元器件散热设计的理想材料，具有优异的电气性能和绝缘性能

Ziitek（兆科）导热材料选型指南

公司介绍    TIC系列低熔点导热界面材料    TIF系列热传导间隙填充材料    TIG系列导热膏    TIS系列导热绝缘材料    TIR系列超高导热导电材料    TIA系列导热双面胶    TCP™100系列导热工程塑料    Z-Paster100无硅导热片    TIF™100导热泥/导热粘土    TIE/TIS™导热灌封粘合剂（导热灌封胶）    Kheat™发热材料    导热界面材料应用介绍    模切产品   

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