【产品】符合最高空间标准的超高密度互连NXS系列，专为10Gbps高速空间应用设计和测试

时间： 2021-12-09 来源：Smiths Interconnect

技术问答

Smiths Interconnect今天宣布发布其新的 NXS 系列，这是专为关键太空飞行应用而设计和测试的超高密度互连。

今天，空间卫星正在从提供低速电信信号的基于射频模拟的有效载荷，转向用于高吞吐量卫星的新数字透明处理器架构。这种架构增加了对坚固和更高速连接的需求。 NXS 形成互连背板，专为高达10Gbps 的高速空间应用而设计和测试，可根据需要使用尽可能多或尽可能少的“模块化数字处理器”来实现可扩展的卫星设计，同时确保信号完整性和高抗冲击性。

“卫星制造商通常使用具有非常高价值组件的大型单一印刷电路板。 NXS 系列为他们提供了无焊 PCB 安装连接器，可以以非常低的风险放置和更换电路板，” Smiths Interconnect 连接器业务部副总裁兼总经理 Mark Kelleher说，“新的 NXS 系列旨在提供一种先进的、高密度的互连，比目前市场上可用的互连更紧凑，按需提供下一代数据”，他补充道。

全新 NXS 系列符合最高空间标准，符合严格的测试和性能标准：ESCC 3401、ESCC 3402、ECSS-Q-ST-70C、ECSS-Q-ST-70-02、ECSS-Q-ST- 70-08C、ECSS-Q-ST-70-38C 和 ECSS-Q-70-71。NXS 系列配备micro Hypertac® 双曲面接触技术，可承受每通道高达 10Gbps 的数据速率应用要求，包括超过 2100G 的极端振动、冲击和气候测试。

NXS 系列采用坚固的设计/构造，带有 4 或 12个高速四同轴（双双轴）模块。每个超高密度四同轴模块包含2个双轴，每对100Ω。它可盲插、可热插拔、具有超低插拔力和低释气材料。此外，无焊 PCB 安装设计降低了客户的风险和拥有成本。连接器在回流后安装，对附近的元件没有影响。每个产品都使用 3D 电磁模拟 (EM) 软件进行设计，以在整个薄膜工艺中提供卓越的性能。

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