【应用】导热凝胶GEL30结合Smart CFD热仿真助力大功率功放模块散热,世强提供全套热整合设计
当前,在相关应用领域中,功放模块散热设计已越来越受到工程师们的重视。其体积越来越小,功率密度越来越大,在有限的空间里工作势必会导致热量堆积和局部高温,会严重影响相关器件的正常工作和产品的可靠性。那针对大功率功放管,如何选择高效合理的散热方案呢?
针对客户功放模块,功耗830W,机箱体积尺寸为200*200*150mm,环温60℃,温升30℃。散热设计方面,世强先进有热仿真实验室,可根据客户提供的产品3D结构图纸(PCB发热源位置等),使用爱美达Smart CFD热仿真,创建热模拟模型,为功放模块及其他关键器件设计合理的散热方案,将其结点温度达到目标值。同时给出热分析曲线模拟结果、温度曲线图和热传导路径以及相关热界面材料建议等。
从热分析结果来看:功耗830W的功放模块,要达到客户所需要的目标,需要用热管/均温板散热方案,同时结果显示机箱内部相关界面热阻较大,影响热传导,温差明显,均热效果差,需要针对热传导路径进行优化。对于界面间隙填充料,推荐PARKER CHOMERICS 导热凝胶GEL30。
从结构图上看,功放模块产生热量主要通过铜块传递到热管/VC散热器,再与空气进行热交换,已达到均热目的。其中铜块与散热器之间需要热界面材料(TIM)来填充,要求:1、材质柔软且易于压缩,热阻低;2、良好热稳定性,长期可靠性;3、操作便易性,在应用端设计灵活。
Parker Chomerics完全固化的导热凝胶THERM-A-GAP™ GEL30,其导热系数为3.5W/mK,可批量点胶,非常适合于此类应用,性价比超高,并具有良好的热稳定性。有效填充在凸凹不平的界面,降低接触热阻,减少两端温差,热量能有效传导,有利于解决大功率功放模块散热问题。
可点涂各种形状和厚度的胶层,适用于多种自动点胶设备与工艺,对于散热器配套使用也有很好的兼容性,非常适合大批量生产。
对于客户功放模块散热问题,可通过世强的热整合能力:热界面材料+热管/VC散热器整体散热方案,可更有效地解决产品散热的问题,为客户提供经济合理的解决方案。
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JaydenLiu Lv6. 高级专家 2020-11-13学习
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Jerrfy Lv9. 科学家 2020-10-13导热凝胶的选型也是很重要,涉及到温升
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海天一线 Lv4. 资深工程师 2020-10-12学习
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燕子飞 Lv5. 技术专家 2020-10-12学习
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毛绒绒 Lv5. 技术专家 2020-10-12学习
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伟大大 Lv5. 技术专家 2020-10-12学习
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滨海养老会所 Lv7. 资深专家 2020-08-15赞
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terrydl Lv9. 科学家 2020-04-22学习了
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型号- 19-04-12901-XXXX,10-06-A778-XXXX,19-04-M394-XXXX,10-04-4180-XXXX-40,19-04-22951-XXXX**,10-00-0028-XXXXX,10-00-1846-XXXXX,19-09-LH10-1298,10-04-3076-XXXX-40,M83528/007Y005,M83528/007Y004,M83528/007Y003,M83528/007Y002,20-01-5060-1239**,M83528/007Y001,CHO-SEAL V6433,10-05-4542-XXXX,10-00-2029-XXXXX,10-02-1492-XXXXX,19-07-22989-XXXX,20-01-5115-1239**,M83528/007Y007,19-09-28855-XXXX,M83528/007Y006,10-00-0010-XXXXX,19-05-12375-XXXX,19-07-12959-XXXX,19-08-12844-XXXX,19-08-C929-XXXX,10-04-3560-XXXX-40,19-09-E053-XXXX,40-TA-1010-1350,19-04-21194-XXXX,20-02-6565-1212,30-02-2051-XXXXX,19-04-25964-XXXX,19-09-L524-XXXX,19-09-14831-XXXX,19-09-LE24-XXXX,19-06-11223-XXXX,19-09-14645-XXXX,20-01-5055-1239,30-02-2043-XXXXX,19-08-12885-XXXX,40-T0-1020-6307,19-04-16104-XXXX,40-TA-1020-6460,19-04-26610-XXXX,19-04-14349-XXXX,10-01-6515-XXXXX,10-00-3550-XXXXX,10-00-1782-XXXXX,19-06-22037-XXXX,40-TA-1010-1310,19-04-13759-XXXX,19-04-14964-XXXX,19-04-22324-XXXX,10-07-4272-XXXX,19-04-21493-XXXX,10-05-1364-XXXX,19-07-26620-XXXX,10-07-3225-XXXX-40,19-04-28067-XXXX**,30-02-2056-XXXXX,19-04-11875-XXXX,19-04-25051-XXXX,19-04-27546-XXXX**,19-09-11540-XXXX,40-TA-1015-S6305,20-01-5005-1239,19-04-16162-XXXX,19-07-27622-XXXX,19-04-12908-XXXX,19-06-M412-XXXX,19-08-17623-XXXX,19-09-11434-XXXX,40-TA-1015-1298,19-04-24444-XXXX,19-04-22253-XXXX,40-TA-1015-6503,40-TA-1015-6502,CHO-SEAL 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【经验】电子产品外壳自然散热能力的工程估算
在产品研发的事后,通常要对电子元器件是否满足温度规格进行评估。影响电子的元器件温度通常有两个关键因素:电子元器件节点到产品外壳的热阻,外壳到环境的热阻。本文介绍了工程近似估算的方法,实际产品中会有更多的现实因素影响产品的外壳散热能力。推荐世强元件电商平台申请免费热仿真服务,免费使用Smart CFD热仿真软件,为您的产品选择合适的散热方案。
设计经验 发布时间 : 2020-05-12
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