Waermtimo Provides Professional Thermal Conductivity Solutions to 5G Device Heat Dissipation
4G changes life, and 5G will change society!
In recent years, the fifth-generation mobile communication system 5G has become a hot topic in the communication industry and academia. There are two main driving forces for the development of 5G. On the one hand, the fourth-generation mobile communication system represented by long-term evolution technology 4G has been completely commercialized, and discussions on next-generation technologies have been put on the agenda; on the other hand, the demand for mobile data has explosive growth. Current mobile communication systems are difficult to meet future needs, and the development of a new generation of 5G systems is urgently needed.
Basic Concept:
Like earlier 2G, 3G, and 4G mobile networks, 5G networks are digital cellular networks in which the service area covered by suppliers is divided into many small geographic areas called cellular. Analog signals representing sound and images are digitized in mobile phones, converted by analog-to-digital converters, and transmitted as bit streams. All 5G wireless devices in the cell communicate via radio waves with the local antenna array and low-power automatic transceivers (transmitters and receivers) in the cell. The transceiver assigns channels from a common frequency pool, which can be reused in geographically separated cells. The local antenna is connected to the telephone network and the Internet via a high-bandwidth fiber optic or wireless backhaul connection. As with existing phones, when users cross from cell to cell, their mobile device will automatically "switch" to the antenna in the new cell.
The main advantage of a 5G network is that the data transmission rate is much higher than the previous cellular network, up to 10Gbit / s, faster than the current wired Internet, and 100 times faster than the previous 4G LTE cellular network. Another advantage is lower network latency (faster response time), less than 1 millisecond, and 4G is 30-70 milliseconds. Due to faster data transmission, 5G networks will not only provide services only for mobile phones but will also become general home and office network providers, competing with cable network providers. Previous cellular networks provided low-data-rate Internet access for cell phones, but a cell phone tower could not economically provide enough bandwidth as a general Internet vendor for home computers.
How do 5G devices with high power and high heat consumption dissipate heat?
As 5G is about to "fly into the homes of ordinary people", it is followed by the heat dissipation challenges of various 5G equipment products. How to do a good job of heat dissipation of high power and high heat consumption products in the 5G era has become the trickiest problem that engineers need to face.
Waermtimo provides you with professional thermal conductivity solutions, with independent production plants and a number of production technology patents. According to product needs, we provide targeted thermal conductivity materials to make our products perform better.
Recommended models:
WT5912 series thermal pad
Waermtimo developed TIM's new high-strength thermal pad, which is a thermally conductive sheet with high mechanical strength. The elongation rate is> 300%. It has high toughness. It can effectively absorb shock while conducting heat. It can be reworked many times. Integrates irregular or complex surfaces, has excellent interface filling, and can be used repeatedly. The temperature resistance range is -50 ~ 200 ℃, and the applicable range is very wide. Power equipment, automotive electronics, communication equipment, network terminals, storage equipment, handheld, wearable, and mobile terminal products which between the internal chip and the radiator all can these types of thermal pads to solve the problem of heat conduction and heat dissipation. At the same time, they can also be applied to the shells of some electronic products, which have the functions of heat dissipation, insulation, dust resistance, and waterproofing.
WT5902 series thermal pad
Thermal conductivity: 4W, 5W, 6W, 7W, 8W
WT5902 series thermal pads can solve the problem of product structure design tolerance changes and can be reused. It is a good vertical heat conduction material between a heat source (CPU or electronic chipset) and a heat sink. They have good insulation and mechanical properties, can tightly integrate irregular or complex surfaces, are easy to use, and are easy to remove. They are widely used in power supply equipment, automotive electronics, communication equipment, network terminals, storage equipment, consumer electronics, and other fields.
WT5921 series thermal gel
Waermtimo WT5921 series thermal gel is a silicon-based resin, a thermally conductive filler, and a bonding material configured in a certain proportion, and mud is made by a special process. It is also called thermal mud in the industry. It has excellent high and low-temperature resistance, excellent weather resistance, radiation resistance, and superior dielectric properties.
- |
- +1 赞 0
- 收藏
- 评论 0
本文由玄子转载自Waermtino News,原文标题为:5G is many times faster than 4G!,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关推荐
Thermal Pad WT5912-H20,WT5912-H25 Provides a Heat Dissipation Solution for Wireless Charger
Wireless charging is a device that uses the principle of electromagnetic induction to charge. By placing a coil on each of the transmitting and receiving ends, the transmitting end coil emits an electromagnetic signal to the outside under the action of electric power, and the receiving end coil receives the electromagnetic signal and converts the electromagnetic signal into Current to achieve wireless charging.
应用方案 发布时间 : 2024-01-20
Thermal Pad on LED Lights-Small Size, Great Effect!
LED lights have many advantages such as energy saving, environmental protection, safety, long life, high brightness, easy maintenance, etc., not only general lighting, but also used in various fields such as indication, display, decoration, backlight, etc. It’s called four generations of light sources.
应用方案 发布时间 : 2024-01-18
解密无线路由器导热系统——沃尔提莫可复用导热硅胶片WT5912/902系列,能够紧密整合不规则或复杂表面
路由器IC主要芯片与散热片之间放置导热硅胶片可以避免噪音问题也可增强散热效果。沃尔提莫研发WT5912系列和WT5902系列导热硅胶片,可多次重工,可紧密整合不规则或复杂的表面,具有接口填充及可多次反复使用,同时适用于电源设备、汽车电子,通信设备,网络终端,存储设备,消费电子等领域。
应用方案 发布时间 : 2024-01-15
德聚(CollTech)胶粘剂产品选型指南(英文)
目录- Introduction of CollTech One/Two Part Epoxy Adhesives Acrylate UV Adhesives Underfill Materials/Hot Melt Adhesives/Coating Materials Thermal Conductive Adhesives/Conductive Adhesives/Thermal Greases Thermal Gels/Silicone Potting Materials Silicone Sealants/Polyurethane Sealants Adhesives for Structural Bonding/Instant Adhesives Product Applications
型号- N-SIL 8700,N-PU 5100,EW 6312,N-PU 5103,PW 1164,N-PU 5105,N-PU 5107,PW 1442,PW 2133,PW 1446,PW 1209,N-SIL 8275,PW 1206,PW 1448,N-SIL 8276,N-SIL 8552,EW 6609,EW 6608,N-SIL 8715,EW 6328,EW 6326,PW 1292,CT 7251H,EW 6320,PW 1451,N-SIL 8201,N-SIL 8206,N-SIL 8725,CT 7255B,EW 6658,EW 6657,N-SIL 8608,CT 7261,CT 7260,PW 2990,EW 6650,PW 1023,PW 1304,PW 1422,N-SIL 8210,N-SIL 8332,N-SIL 8215,N-SIL 8336,N-SIL 8337,EW 6615H,N-SIL 8735,N-SIL 8615,EW 6308,CT 7250,N-COAT 9368,CT 7251,CT 7258,N-COAT 9360,CT 7257,PW 1033,PW 1435,PW 1436,CT 7253,N-SIL 8580,CT 7256,CT 7255,N-SIL 8220,N-SIL 8740,HW 9905,N-SIL 8620,AW 2915,PW 1081,AW 2916,EW 6355,PW 1486,EW 6350,PW 2057,PW 1400,PW 1008,N-SIL 8112,N-SIL 8630,N-SIL 8113,AW 2920,N-COAT 9300,PW 1250,HW 9590,EW 6360,PW 2500,PW 2501,CT 5605,CT 5606,PW 1218,CT 5607,N-SIL 8640,EW 6619,CT 5608,EW 6615,EW 6339,SW 7037,CT 7250H,EW 6336,EW 6611,EW 6335,EW 6610,CT 7250L,PW 2550,PW 1465,PW 1066,SW 7022,N-SIL 8135,N-SIL 8533,CT 7258H,EW 6627,EW 6625,EW 6349,AW 2904,AW 2903,EW 6621,EW 6346,EW 6345,PW 1471,AW 2900,AW 2902,PW 1470,EW 6066,N-COAT 9560,AW 2901,PW 1475,EW 6064,EW 6061,EW 6060
鸿富诚(HFC)热界面材料/屏蔽材料/吸波材料选型指南
目录- 公司介绍 Company Profile 热界面材料介绍 Thermal Interface Material Introduction 导热硅胶垫片 Thermal Pad 各向异性导热垫片 Anisotropic Thermal Pad 导热凝胶 Thermal Gel 导电泡棉 FOF Gasket 石墨泡棉 Graphite Foam 半包型导电泡棉 Half-wrapped Gasket SMT导电泡棉 SMT Gasket 全方位导电泡棉 XYZ Conductive Foam 导电PE Conductive PE 导电毛丝 Conductive FOA 导电布胶带 Conductive Fabric Tape 铜/铝箔胶带 Copper/Atuminum Foil Tape 吸波材料 Wave-absorbing Material 导热吸波材料 Thermal Conductive Absorbing Material
型号- H800-LY,HFS-15,HFS-18,H100,HFC-MC,H300,HFC-SMT,H500,H700,H350-SOFT,H100RS,H300-RB,HTG-150DK,HFC-MC系列,HTG-150D,HFC-GB系列,SMFB系列,H200RS,HFC-MFZ系列,HFC-AM,H1200,H250,HFC-GR系列,HTG-1000,HTG-100DK,H1000,HFS-20,H1000-SOFT,H150RS,HFC-A18000,SMFB,H250RS,HTG-600,HTG-500SF,HTG-800,SMFA,HTG-200,HFC-AM系列,HFC-MF,H300MAS,HFC-MT,SMT,H500-RB,HTG-200D,HFC-A系列,HFC-A25000,H150A15,H500-LY,HTG-800D,H100A15,HFS-30,HFC-AM5000,H200,H400,H600,H200-SOFT,H800,H300-SOFT,H100-SOFT,HFC-MF系列,HFC-AM1000,H200MAS,HFC-A5000,SMFA系列,H300-HC,HTG-300SF,HFC-MFZ,H150,HFC-GR,HTDG-250,H150-LY,H700-SOFT,H600-LY,H300-LY,HFC-A,H300-HR,H300-DR,SMT系列,HTG-300,HFC-GB,H200-LD,HTG-500,H150-LD
The Next Generation of Thermal Gap Filler Pad: THERM-A-GAP PAD 80LO, with a Thermal Conductivity of 8.3 W/m-K
By addressing the shortcomings of current gap pads, PAD 80LO represents the next generation of gap pads to address modern electronics design and thermal managements. With a thermal conductivity of 8.3W/m-K, PAD 80LO is designed for high heat-output components.
产品 发布时间 : 2024-10-24
金菱通达(GLPOLY)热对策材料选型指南
目录- Company Profile Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel Thermal Pad Thermal Silicone Pad & Silicone Thermal Fiberglass/Film EMI absorber/Absorption Gel Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound Silicone/Non-Silicone Thermal grease Silicone Thermal Tape Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad
型号- XK-G20E,XK-P20系列,XK-R系列,XK-P PUTTY,XK-PN50,XK-Z系列,XK-P20LD,XK-P80,XK-RE SERIES,XK-RAY310,XK-A100,XK-FN系列,XK-F系列,XK-FN,XK-FN20,XK-J系列,XK-C35D,XK-C35C,XK-PN45,XK-GN SERIES,XK-Z,XK-FST,XK-F35,XK-R30,XK-Z SERIES,XK-F10ST,XK-FN10,XK-P PUTTY SERIES,XK-FN15,XK-FST系列,XK-SF SERIES,XK-P45-PUTTY,XK-GN20,XK-Z15,XK-RE系列,XK-FN50,XK-X SERIES,XK-T SERIES,XK-G40,XK-F20,XK-J20,XK-SF35,XK-XN40,XK-P60,XK-RAY,XK-J25,XK-FST SERIES,XK-C系列,XK-SN SERIES,XK-R20,XK-G系列,XK-PN系列,XK-K系列,XK-TN08,XK-GN15,XK-XN系列,XK-SN系列,XK-FN40,XK-XN50,XK-G30,XK-S15LV,XK-F10,XK-C35,XK-PN60,XK-S30LV,XK-TN,XK-J10,XK-P50,XK-F15,XK-A SERIES,XK-TN12,XK-PS SERIES,XK-R10,XK-J18,XK-X50,XK-SF系列,XK-R15,XK-P30S20,XK-A80,XK-A60,XK-P系列,XK-PLD SERIES,XK-P20 SERIES,XK-PN15,XK-T系列,XK-P50-PUTTY,XK-C20,XK-X系列,XK-G20,XK-S20LV,XK-C25,XK-PLD,XK-SN,XK-SF15,XK-GEL 100,XK-SF18,XK-SN10,XK-P45,XK-PS系列,XK-P80-P,XK-SF,XK-K4,XK-X40,XK-TN SERIES,XK-F20ST,XK-K6,XK-P20S,XK-F SERIES,XK-GN30,XK-J SERIES,XK-S12LV,XK-C15,XK-C16,XK-P PUTTY 系列,XK-K10,XK-P15LD,XK-G15,XK-P50-P,XK-P30,XK-SN20,XK-P SERIES,XK-P80-PUTTY,XK-RE,XK-PN SERIES,XK-C,XK-TN系列,XK-G,XK-F,XK-F60,XK-R SERIES,XK-S25LV,XK-PN30,XK-A,XK-P20S20,XK-R,XK-A系列,XK-T,XK-R10E9,XK-PLD系列,XK-P20,BETA GEL 100,XK-X,XK-P25,XK-K,XK-J,XK-P45-P,XK-RAY SERIES,XK-P,XK-G SERIES,XK-PN,XK-T09,XK-A30,XK-PS,XK-F50,XK-F15ST,XK-C SERIES,XK-PN20,XK-K SERIES,XK-XN,XK-XN10,XK-XN SERIES,XK-RAY 系列,XK-P10LD,XK-FN SERIES,XK-R50,XK-GN系列,XK-T12,XK-GN,XK-ANFC,XK-X10
汉华(Hanhua)导热界面材料选型指南
描述- 深圳市汉华热管理科技有限公司成立于2015年,是与清华大学深圳研究生院材料学院合作成立的一家高科技企业,全面致力于热管理方案、新型导热材料、热扩散材料、导热模组的研发、生产和技术服务。Shenzhen HanHua TM Technology Co., LTD., founded in 2015, is a high-tech enterprise established in cooperation with the School of Materials, Tsinghua Shenzhen Graduate School.
型号- HI,HT90,HL10,HL,HP10,HP,HS,HT,HI系列,KCH30,THSB30,KHGC系列,THSI10,HT80,HI25,THSB25,THSB20,KGF系列,HG70,HI30,KHG80,HL30,KGF100,KGF060,HP30,THSI系列,KHGC50,KGC35,HS10,KGS040A,KCH15,THSB10,HC20,KGT55,KG,HC25,KHGC60,KGS系列,HL20,KGS025A,KGC,HL25,HP20,HP25,HAZ20,KGF,KCH20,KGC系列,KCH25,HAZ10,KGS,HT100,KGT,KGF080,HC10,HAZ,KHG60,HC系列,KGC15,HS30,HG系列,KHG,HAZ30,HS35,HAZ25,KGT35,HB20,HAZ系列,HG40,HB25,KG35,KHGC80,KG15,KGT系列,KGC25,HS20,HS25,HL系列,HP系列,HB10,HT系列,HC30,KGT45,KG25,HI10,HT70,HS50,HB系列,KGS032A,THSI30,KHG系列,HG60,KHGC,HI20,KGS017A,THSB,HS40,HT60,KHG50,KG系列,THSI,KCH,KGT20,HS系列,HB30,THSI25,HB,HC,HG50,THSI20,THSB系列,HG
HFC Company Profile
型号- H150-S,HTG SERIES,H150-S SERIES,H150-LD SERIES,H200-LD SERIES,HFC-A15000,H150-A SERIES,H200-A SERIES,H200-A,H200 S40 SERIES,HFC-A12000,HFC-A18000,HFC-A1000,H150-A,H200 S40,H200-LD,HTG,HFC-A5000,HFC-A25000,H150-LD,HFC-A2000
THERM-A-GAP™ MCS30 Thermally Conductive Gap Filler Pad
型号- 69-11-20687-MCS30X,MCS30,THERM-A-GAP™ MCS30,69-11-20684-MCS30X,69-11-20685-MCS30X,69-11-20698-MCS30X,69-11-20686-MCS30X,69-11-20672-MCS30X,69-11-20991-MCS30X,69-11-20675-MCS30X,69-11-27072-MCS30X,MCS 30,69-11-21259-MCS30X,69-11-27102-MCS30X,69-11-20913-MCS30X
THERM-A-GAP™ PAD 80 8.3 W/m-K Thermally Conductive High Performance Gap Filler Pad
型号- PAD 80,6W-XX-1015-ZZZZZZZ,THERM-A-GAP™ PAD 80
What is Thermal Putty?
Thermal putty, also known as thermal gel, is a highly versatile thermal interface material (TIM) designed to efficiently transfer heat between electronic components and their cooling solutions.
技术探讨 发布时间 : 2024-08-17
电子商城
服务
使用FloTHERM和Smart CFD软件,提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务,热仿真技术团队专业指导。
实验室地址: 深圳 提交需求>
提供稳态、瞬态、热传导、对流散热、热辐射、热接触、和液冷等热仿真分析,通过FloTHERM软件帮助工程师在产品设计初期创建虚拟模型,对多种系统设计方案进行评估,识别潜在散热风险。
实验室地址: 深圳 提交需求>
登录 | 立即注册
提交评论