Silicon Labs and Skyworks reach agreement to sell infrastructure and automotive business
On April 23, Silicon Labs announced that it has reached a final asset purchase agreement with SKYWORKS. Skyworks will acquire Silicon Labs’ infrastructure and automotive business in an all-cash asset (valued at US$2.75 billion) transaction. The products involved in the transaction include SILICON LABS' power/isolation, timing, broadcast products and related assets.
For this matter, Skyworks President and CEO Liam K. Griffin said that this acquisition will broadly expand its capabilities in high-growth end markets such as automotive, communications and industry, creating new and attractive opportunities for Skyworks. Silicon Labs CEO Tyson Tuttle said: “The successful conclusion of this transaction fully proves that the world-class infrastructure and automotive teams have provided industry-leading solutions and strong financial performance over the past 25 years.”
Through this acquisition, Silicon Labs will focus on becoming a leading company in IoT smart and wireless connectivity. Skyworks will accelerate its expansion into the most important growth areas of the industry, including electric and hybrid vehicles, industrial and motor control, power supplies, 5G wireless infrastructure, optical data communications, data centers, automobiles, smart homes and some other applications.
The market leader of Sekorm, Silicon Labs' largest distributor in Great China, said: "We will continue to cooperate with all parties to provide professional services to our customers, ensure a seamless transition between customers and services, and jointly protect the interests of cooperative customers."
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产品型号
|
品类
|
Protocol Stack
|
Frequency Band @ Max TX Power(GHz@dBm)
|
Flash(kB)
|
RAM(kB)
|
GPIO(个数)
|
Operating Temperature(℃)
|
Storage Temperature(℃)
|
Pin Count
|
AVDD Supply Voltage(V)
|
EFR32MG12P433F1024GL125-C
|
Gecko Multi-Protocol Wireless SoC
|
Bluetooth LE Zigbee Thread Proprietary, Wi-SUN
|
2.4GHz @ 19dBm, Sub-GHz @ 20dBm
|
1024kB
|
256kB
|
65
|
-40℃~85℃
|
-50℃~150℃
|
BGA125
|
1.8V~3.8V
|
选型表 - SILICON LABS 立即选型
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产品型号
|
品类
|
Protocol Stack
|
MAX TX Power (dBm)
|
Flash(kB)
|
RAM(kB)
|
GPIO(个数)
|
Secure Vault
|
IADC High-Speed/High-Accuracy
|
Multi Vector Processor
|
Max CPU Speed(MHz)
|
Operating Temperature(℃)
|
Storage Temperature(℃)
|
Pin Count
|
AVDD Supply Voltage(V)
|
EFR32MG24B310F1536IM48-B
|
Wireless SoC
|
Matter,Zigbee,Thread,Bluetooth 5.3
|
10dBm
|
1536kB
|
256kB
|
28
|
High
|
IADC High-Speed/High-Accuracy
|
Multi Vector Processor
|
78.0MHz
|
-40℃~125℃
|
-50℃~150℃
|
QFN48
|
1.71V~3.8V
|
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产品型号
|
品类
|
MCU Core
|
Core Frequency (MHz)
|
Flash
|
RAM
|
Secure Vault
|
Bluetooth
|
Bluetooth 5
|
Bluetooth Mesh
|
Cryptography
|
Output Power Range (dBm)
|
GPIO
|
I²C
|
SPI
|
I²S
|
Receive Sensitivity
|
ADC
|
Comparators
|
Temperature Range (ºC)
|
Package Type
|
Package Size(mm)
|
EFR32BG24B110F1536IM48-B
|
Bluetooth®Wireless SoC
|
ARM Cortex-M33
|
78
|
1536
|
256
|
High
|
5.3
|
Bluetooth 5
|
Bluetooth Mesh
|
AES-128;AES-256;ECC;SHA-1;SHA-2
|
-20 to 10
|
28
|
2
|
3
|
1
|
-97.6DBM(1Mbit/s GFSK)
|
12-bit,SAR,1Msps
|
2
|
-40 to 125
|
QFN48
|
6x6
|
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产品型号
|
品类
|
系列
|
Frequency(MHz)
|
Flash (kB)
|
RAM (kB)
|
Vdd min(V)
|
Vdd max(V)
|
Package Type
|
Package Size (mm)
|
Internal Osc.
|
Dig I/O Pins
|
ADC 1
|
Temp Sensor
|
Timers (16-bit)
|
PCA Channels
|
DAC
|
Comparators
|
UART
|
SPI
|
I2C
|
HS I2C Slave
|
EMIF
|
CAN
|
LIN
|
VREF
|
Debug Interface
|
C8051F392-A-GM
|
8位MCU
|
C8051F39x Small Form Factor
|
50
|
16
|
1
|
1.8
|
3.6
|
QFN20
|
4x4
|
±2
|
17
|
10-bit, 16-ch., 500 ksps
|
Temp Sensor
|
6
|
3
|
10-bit, 2-ch.
|
1
|
1
|
1
|
2
|
0
|
0
|
0
|
0
|
VREF
|
C2
|
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产品型号
|
品类
|
系列
|
Frequency(MHz)
|
Flash (kB)
|
RAM (kB)
|
Vdd min(V)
|
Vdd max(V)
|
Package Type
|
Package Size (mm)
|
Internal Osc.
|
Debug Interface
|
Cryptography
|
Dig I/O Pins
|
ADC 1
|
DAC
|
USB
|
Cap Sense
|
LCD
|
Temp Sensor
|
Timers (16-bit)
|
UART
|
USART
|
SPI
|
I2C
|
I2S
|
EMIF
|
RTC
|
Comparators
|
EFM32GG290F512-BGA112
|
32位MCU
|
EFM32 Giant Gecko
|
48
|
512
|
128
|
1.98
|
3.8
|
BGA112
|
10x10
|
±2%
|
ETM; SW
|
AES-128 AES-256
|
90
|
12-bit, 8-ch., 1 Msps
|
12-bit, 2 ch.
|
-
|
Cap Sense
|
-
|
Temp Sensor
|
4
|
7
|
3
|
3
|
2
|
1
|
0
|
RTC
|
2
|
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